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61. 发明授权

US10159832B2 Electrode with increased stability and method of manufacturing the same 有权
公开(公告)号：US10159832B2
公开(公告)日：2018-12-25
申请号：US11924763
申请日：2007-10-26
申请人： Dao Min Zhou , Jerry Ok , Neil Hamilton Talbot , Brian V. Mech , James Singleton Little , Robert J. Greenberg
发明人： Dao Min Zhou , Jerry Ok , Neil Hamilton Talbot , Brian V. Mech , James Singleton Little , Robert J. Greenberg
IPC分类号： C25D5/02 , A61N1/05 , A61N1/36
摘要： The present invention provides an implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material. The present invention further provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer.

62. 发明授权

US08644937B2 Electronics package suitable for implantation 有权
标题翻译：电子封装适合植入
公开(公告)号：US08644937B2
公开(公告)日：2014-02-04
申请号：US13610653
申请日：2012-09-11
申请人： Robert J. Greenberg , Jerry Ok
发明人： Robert J. Greenberg , Jerry Ok
IPC分类号： A61N1/00
CPC分类号： A61N1/0543 , A61N1/36046 , A61N1/3752 , H01L23/057 , H01L23/10 , H01L23/4985 , H01L2224/05573 , H01L2224/16225 , H01L2224/73204 , H01L2224/92125 , H01L2924/01079 , H01L2924/1461 , H05K1/0306 , H05K3/321 , H05K3/328 , H05K3/361 , H05K3/4015 , H05K3/423 , H05K3/4652 , H05K3/4691 , H05K2201/09127 , H05K2201/10287 , H05K2201/10295 , H05K2201/10977 , H05K2203/0733 , H05K2203/1446 , H01L2924/00
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
摘要翻译：本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得的电子封装，其适于植入生物组织，例如用于视网膜或皮层电极阵列，以使视力恢复到某些非目标人士。电气密封的电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。所得到的电子装置是生物相容的并且适合长期植入生物体组织。

63. 发明授权

US08551271B2 Method for providing hermetic electrical feedthrough 有权
标题翻译：提供气密电馈通的方法
公开(公告)号：US08551271B2
公开(公告)日：2013-10-08
申请号：US11924408
申请日：2007-10-25
申请人： Jerry Ok , Robert J. Greenberg
发明人： Jerry Ok , Robert J. Greenberg
IPC分类号： C03B29/00 , B29C65/00 , H01B13/00
CPC分类号： H05K3/4061 , B32B37/14 , C04B35/10 , C04B37/00 , C04B2237/064 , H05K1/0306 , H05K3/0044 , H05K3/0047 , H05K3/005 , H05K3/12 , H05K3/1225 , H05K3/1233 , H05K3/4614 , H05K3/4623 , H05K3/4629 , H05K2201/0376 , H05K2201/096 , H05K2201/09609 , H05K2203/1147 , H05K2203/308 , Y10T156/10
摘要： A method for fabricating a hermetically sealed electrical feedthrough. The method provides a ceramic sheet and forming at least one via hole in the ceramic sheet, inserting a conductive thickfilm paste into the via hole, laminating the ceramic sheet that has a paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form an integral ceramic substrate, firing the laminated ceramic substrate to sinter the ceramic substrate and cause the paste filled via hole to form a metalized via while the laminated ceramic substrate form a hermetic seal around the metalized via. The upper ceramic sheet and the lower ceramic sheet are removed from the fired ceramic substrate to expose the upper and lower surface of the metalized via.
摘要翻译：一种用于制造密封电馈电的方法。该方法提供陶瓷片并在陶瓷片中形成至少一个通孔，将导电厚膜糊剂插入通孔中，将在上陶瓷片和下陶瓷片之间填充有通孔的陶瓷片层压到形成整体的陶瓷基板，烧结层叠陶瓷基板以烧结陶瓷基板，并使填充通孔的浆料形成金属化通孔，同时层压陶瓷基板在金属化通孔周围形成气密封。将上陶瓷片和下陶瓷片从烧制的陶瓷基片上除去，露出金属化通孔的上表面和下表面。

64. 发明授权

US08406887B2 Package for an implantable neural stimulation device 有权
公开(公告)号：US08406887B2
公开(公告)日：2013-03-26
申请号：US13224104
申请日：2011-09-01
申请人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号： A61N1/375
CPC分类号： A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device includes an electrically non-conductive substrate with electrically conductive vias. A flip-chip circuit is attached to the substrate using conductive bumps and electrically connected to a first subset of the vias. The flip-chip circuit can contain one or more stacks or a folded stack. A wire-bonded circuit is also attached to the substrate and electrically connected to a second subset of the vias. A cover is bonded to the substrate. The cover, substrate, and vias form an improved hermetic package for implantation.

65. 发明授权

US08285380B2 Electronics package suitable for implantation 有权
标题翻译：电子封装适合植入
公开(公告)号：US08285380B2
公开(公告)日：2012-10-09
申请号：US13429215
申请日：2012-03-23
申请人： Robert J. Greenberg , Jerry Ok
发明人： Robert J. Greenberg , Jerry Ok
IPC分类号： A61N1/00
CPC分类号： A61N1/0543 , A61N1/36046 , A61N1/3752 , H01L23/057 , H01L23/10 , H01L23/4985 , H01L2224/05573 , H01L2224/16225 , H01L2224/73204 , H01L2224/92125 , H01L2924/01079 , H01L2924/1461 , H05K1/0306 , H05K3/321 , H05K3/328 , H05K3/361 , H05K3/4015 , H05K3/423 , H05K3/4652 , H05K3/4691 , H05K2201/09127 , H05K2201/10287 , H05K2201/10295 , H05K2201/10977 , H05K2203/0733 , H05K2203/1446 , H01L2924/00
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
摘要翻译：本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得的电子封装，其适于植入生物组织，例如用于视网膜或皮层电极阵列，以使视力恢复到某些非目标人士。密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。所得到的电子装置是生物相容的并且适合长期植入生物体组织。

66. 发明申请

US20110319963A1 Package for an Implantable Neural Stimulation Device 有权
标题翻译：可植入神经刺激装置的包装
公开(公告)号：US20110319963A1
公开(公告)日：2011-12-29
申请号：US13224104
申请日：2011-09-01
申请人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号： A61F9/08
CPC分类号： A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.
摘要翻译：本发明是用于植入人体的改进的密封包装。可植入装置包括非导电基底; 通过所述非导电衬底的多个导电通孔; 使用导电凸块连接到所述非导电衬底并电连接到所述多个导电通孔的第一子集的倒装芯片电路，其中所述倒装芯片电路包含一个或多个堆叠或折叠堆叠; 连接到所述非导电衬底并电连接到所述导电通孔的第二子集的引线键合电路; 以及盖，其结合到所述非导电衬底，所述盖，所述非导电衬底和所述导电通孔形成气密封装。

67. 发明申请

US20110270067A1 Biocompatible Bonding Method 审中-公开
标题翻译：生物相容性粘合法
公开(公告)号：US20110270067A1
公开(公告)日：2011-11-03
申请号：US13097399
申请日：2011-04-29
申请人： Boozarjomehr Faraji , Robert J. Greenberg , James S. Little , Jerry Ok , Neil Hamilton Talbot , David Daomin Zhou
发明人： Boozarjomehr Faraji , Robert J. Greenberg , James S. Little , Jerry Ok , Neil Hamilton Talbot , David Daomin Zhou
IPC分类号： A61B5/04 , H05K13/04 , B32B38/00 , B32B37/12 , B32B37/16 , A61N1/36 , B32B37/02
CPC分类号： H01L21/563 , A61B5/04001 , A61B2562/125 , A61N1/0543 , A61N1/36046 , A61N1/3752 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/45169 , H01L2224/48091 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81193 , H01L2224/81801 , H01L2224/838 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01041 , H01L2924/01045 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/19107 , H01L2924/3011 , Y10T156/10 , H01L2924/00014 , H01L2924/00 , H01L2924/3512
摘要： The invention is a device and method for connecting a hermetic package to a flexible circuit such as for an electrode array in an implantable device. Attaching metal pads on a flexible circuit to metal pads on a hermetic device by conductive adhesive is known. A smooth metal, such as platinum, does not bond well to conductive epoxy. The invention provides a roughened surface, such as etching or applying high surface area platinum gray, to improve adhesion to platinum or other metal pads.
摘要翻译：本发明是一种用于将密封包装连接到诸如用于可植入装置中的电极阵列的柔性电路的装置和方法。通过导电粘合剂将柔性电路上的金属焊盘连接到密封设备上的金属焊盘是已知的。光滑的金属，如铂，不能很好地粘结到导电环氧树脂上。本发明提供了粗糙化的表面，例如蚀刻或施加高表面积的白金灰，以改善与铂或其它金属垫的粘合性。

68. 发明授权

US07914842B1 Method of manufacturing a flexible circuit electrode array 有权
标题翻译：柔性电路电极阵列的制造方法
公开(公告)号：US07914842B1
公开(公告)日：2011-03-29
申请号：US11702735
申请日：2007-02-06
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Brian V. Mech
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Brian V. Mech
IPC分类号： A61N1/04
CPC分类号： H05K3/0011 , A61N1/0543 , H05K3/0035 , H05K3/064 , H05K2203/0736 , H05K2203/095
摘要： Polymer materials form electrode array bodies for neural stimulation, especially for retinal stimulation to create vision. The method lays down a polymer layer. Apply a metal layer to the polymer and pattern to create electrodes and leads. Apply a second polymer layer over the metal layer and pattern to leave openings for electrodes. The array and its supply cable are a single body. A method for manufacturing a flexible circuit electrode array, is: deposit a metal trace layer on an insulator polymer base layer; apply a layer of photoresist on the metal trace layer and pattern the metal trace layer and form metal traces on the insulator polymer base layer; activate the insulator polymer base layer and deposit a top insulator polymer layer and form a single insulating polymer layer with the base insulator polymer layer; wherein the insulator polymer layers are heated at 80-150° C. and then at 230-350° C.
摘要翻译：聚合物材料形成用于神经刺激的电极阵列体，特别是用于视网膜刺激以产生视觉。该方法沉积聚合物层。将金属层施加到聚合物和图案以产生电极和引线。在金属层和图案上施加第二聚合物层以留下用于电极的开口。阵列及其供电电缆是单体。柔性电路电极阵列的制造方法是：在绝缘体聚合物基层上沉积金属迹线层; 在金属迹线层上施加一层光致抗蚀剂，并对金属迹线层进行图案化并在绝缘体聚合物基层上形成金属迹线; 激活绝缘体聚合物基层并沉积顶绝缘体聚合物层并与基底绝缘体聚合物层形成单个绝缘聚合物层; 其中将绝缘体聚合物层在80-150℃，然后在230-350℃下加热

69. 发明授权

US07877866B1 Flexible circuit electrode array and method of manufacturing the same 有权
标题翻译：柔性电路电极阵列及其制造方法
公开(公告)号：US07877866B1
公开(公告)日：2011-02-01
申请号：US11545354
申请日：2006-10-10
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok
IPC分类号： H05K3/00 , H05K3/10 , H01R9/00
CPC分类号： H05K3/06 , A61N1/0543 , H05K1/118 , H05K3/0041 , H05K3/28 , H05K3/381 , H05K3/388 , H05K2201/0154 , H05K2201/0317 , H05K2203/0554 , H05K2203/0789 , H05K2203/0793 , H05K2203/095 , H05K2203/1163 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155
摘要： A method of manufacturing a flexible circuit electrode array that provides excellent adhesion between the polymer base layer and the polymer top layer and insulation of the trace metals and electrodes. A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned to create electrodes and leads for those electrodes. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body. Alternatively, multiple alternating layers of metal and polymer may be applied to obtain more metal traces within a given width.
摘要翻译：一种制造柔性电路电极阵列的方法，其提供聚合物基层和聚合物顶层之间的优异粘附性以及痕量金属和电极的绝缘。放置一层聚合物。将一层金属施加到聚合物上并图案化以产生用于那些电极的电极和引线。将第二层聚合物施加在金属层上并图案化以留下电极的开口，或稍后通过诸如激光烧蚀的手段产生开口。因此阵列及其供电电缆由单体形成。或者，可以施加金属和聚合物的多个交替层以在给定宽度内获得更多的金属迹线。

70. 发明授权

US07709961B2 Implantable microelectronic device and method of manufacture 有权
标题翻译：植入式微电子器件及其制造方法
公开(公告)号：US07709961B2
公开(公告)日：2010-05-04
申请号：US11924486
申请日：2007-10-25
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
IPC分类号： H01L29/40
CPC分类号： A61N1/375 , A61N1/3754 , H01L23/291 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/85 , H01L2224/0345 , H01L2224/0347 , H01L2224/0401 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05187 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/13164 , H01L2224/13169 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H01L2924/04953 , H01L2924/00 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.
摘要翻译：公开了可植入气密微电子器件及其制造方法。本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔层。在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触，装置。优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

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