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61. 发明授权

US06853941B2 Open-loop for waveform acquisition 有权
标题翻译：用于波形采集的开环
公开(公告)号：US06853941B2
公开(公告)日：2005-02-08
申请号：US10136710
申请日：2002-04-30
申请人： Hui Wang , Kenichi Kanai , Hiroyasu Koike
发明人： Hui Wang , Kenichi Kanai , Hiroyasu Koike
IPC分类号： G01R31/305 , G01R31/00
CPC分类号： G01R31/305
摘要： Methods and apparatus, including computer program products, implementing and using techniques for open-loop waveform acquisition. In general, in one aspect, the invention provides a method for open-loop waveform acquisition. The method includes acquiring an S-curve of an acquisition loop of an electron-beam probe system. The S-curve represents a response of the acquisition loop to changes of potential differences between the acquisition loop and a device under test. The method includes calibrating the acquisition loop to obtain a linear region in the acquired S-curve and using the linear portion of the acquired S-curve to calculate voltage at a probe point of the device under test.
摘要翻译：方法和设备，包括计算机程序产品，实现和使用开环波形采集技术。通常，一方面，本发明提供了一种开环波形采集方法。该方法包括获取电子束探针系统的采集环路的S曲线。 S曲线表示采集环路对采集环路和被测器件之间的电位差的变化的响应。该方法包括校准采集环路以获得所获得的S曲线中的线性区域，并且使用获取的S曲线的线性部分来计算被测器件的探针点处的电压。

62. 发明授权

US06495007B2 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplaces 失效
标题翻译：用于在工作场所的电抛光和/或电镀期间保持和定位半导体工件的方法和装置
公开(公告)号：US06495007B2
公开(公告)日：2002-12-17
申请号：US09800990
申请日：2001-03-07
申请人： Hui Wang
发明人： Hui Wang
IPC分类号： B23H304
CPC分类号： C25D17/001 , C25D7/123 , C25D17/06 , C25F7/00
摘要： A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured to receive the wafer for processing. The spring member is disposed on the bottom section and configured to apply an electric charge to the wafer. In accordance with another aspect of the present invention, the spring member contacts a portion of the outer perimeter of the wafer. In one alternative configuration of the present invention, the wafer chuck further includes a seal member to seal the spring member from the electrolyte solution used in the electropolishing and/or electroplating process.
摘要翻译：用于在晶片的电抛光和/或电镀期间保持晶片的晶片卡盘包括顶部部分，底部部分和弹簧部件。根据本发明的一个方面，顶部部分和底部部分构造成接收用于处理的晶片。弹簧构件设置在底部上并构造成向晶片施加电荷。根据本发明的另一方面，弹簧构件接触晶片外周的一部分。在本发明的另一种配置中，晶片卡盘还包括密封件，用于将弹簧件与用于电抛光和/或电镀工艺中的电解液密封。

63. 发明授权

US06440295B1 Method for electropolishing metal on semiconductor devices 失效
标题翻译：在半导体器件上电镀金属的方法
公开(公告)号：US06440295B1
公开(公告)日：2002-08-27
申请号：US09497894
申请日：2000-02-04
申请人： Hui Wang
发明人： Hui Wang
IPC分类号： C25F316
CPC分类号： H01L21/32115 , C25F3/22 , C25F7/00 , H01L21/32134 , H01L21/7684
摘要： An electropolishing apparatus for polishing a metal layer formed on a wafer (31) includes an electrolyte (34), a polishing receptacle (100), a wafer chuck (29), a fluid inlet (5, 7, 9), and at least one cathode (1, 2, 3). The wafer chuck (29) holds and positions the wafer (31) within the polishing receptacle (100). The electrolyte (34) is delivered through the fluid inlet (5, 7, 9) into the polishing receptacle (100). The cathode (1, 2, 3) then applies an electropolishing current to the electrolyte to electropolish the wafer (31). In accordance with one aspect of the present invention, discrete portions of the wafer (31) can be electropolished to enhance the uniformity of the electropolished wafer.
摘要翻译：用于抛光形成在晶片（31）上的金属层的电抛光设备包括电解质（34），抛光容器（100），晶片卡盘（29），流体入口（5,7,9）一个阴极（1,2,3）。晶片卡盘（29）将晶片（31）保持并定位在抛光容器（100）内。电解质（34）通过流体入口（5,7,9）输送到抛光容器（100）中。然后，阴极（1,2,3）将电解抛光电流施加到电解质上以对晶片（31）进行电解抛光。根据本发明的一个方面，晶片（31）的离散部分可以被电抛光以增强电抛光晶片的均匀性。

64. 发明授权

US06395152B1 Methods and apparatus for electropolishing metal interconnections on semiconductor devices 失效
标题翻译：用于电解抛光半导体器件上的金属互连的方法和装置
公开(公告)号：US06395152B1
公开(公告)日：2002-05-28
申请号：US09346699
申请日：1999-07-02
申请人： Hui Wang
发明人： Hui Wang
IPC分类号： C25D1700
CPC分类号： H01L21/32115 , C25F3/22 , C25F7/00 , H01L21/32134 , H01L21/7684
摘要： An electropolishing apparatus for polishing a metal layer formed on a wafer (31) includes an electrolyte (34), a polishing receptacle (100), a wafer chuck (29), a fluid inlet (5, 7, 9), and at least one cathode (1, 2, 3). The wafer chuck (29) holds and positions the wafer (31) within the polishing receptacle (100). The electrolyte (34) is delivered through the fluid inlet (5, 7, 9) into the polishing receptacle (100). The cathode (1, 2, 3) then applies an electropolishing current to the electrolyte to electropolish the wafer (31). In accordance with one aspect of the present invention, discrete portions of the wafer (31) can be electropolished to enhance the uniformity of the electropolished wafer.
摘要翻译：用于抛光形成在晶片（31）上的金属层的电抛光设备包括电解质（34），抛光容器（100），晶片卡盘（29），流体入口（5,7,9）一个阴极（1,2,3）。晶片卡盘（29）将晶片（31）保持并定位在抛光容器（100）内。电解质（34）通过流体入口（5,7,9）输送到抛光容器（100）中。然后，阴极（1,2,3）将电解抛光电流施加到电解质以对晶片（31）进行电解抛光。根据本发明的一个方面，晶片（31）的离散部分可以被电抛光以增强电抛光晶片的均匀性。

65. 发明授权

US06363659B1 Storm resistant window bracket 失效
标题翻译：防风窗支架
公开(公告)号：US06363659B1
公开(公告)日：2002-04-02
申请号：US09448331
申请日：1999-11-23
申请人： Hui Wang
发明人： Hui Wang
IPC分类号： E05D1522
CPC分类号： E05D15/22 , E05Y2900/148 , E06B3/44 , E06B3/4407 , E06B3/5063
摘要： A storm resistant device for a window that has a window frame enclosing at least one sash slidingly and pivotally mounted therein. The sash has side rails and the frame has vertical jambs that engage the side rails of the sash to raise and lower and pivot the sash. The storm resistant device comprises a first elongated bracket having a substantially Z-shaped cross section with two end segments and a middle segment connecting the two end segments. The middle segment is connectable to the side rails of the sashes with one of the end segments extending outward from the sash toward an adjacent jamb. There is a second elongated bracket having a substantially L-shaped cross section with two legs, one leg of the bracket adapted to be mounted to the jamb with a second leg of the L extending toward an adjacent side rail of the sash. The first and second brackets are mounted to the frame and sash, respectively, so that when the sash is closed, the one end segment of the first bracket interlocks with the second leg of the second bracket and prevents the sash from pivoting when pressure is applied to the sash.
摘要翻译：一种用于窗户的防风雨装置，其具有围绕至少一个窗框的窗框，其滑动地并枢转地安装在其中。窗框具有侧轨，框架具有垂直的边框，其接合窗框的侧轨以升高和降低并枢转窗扇。防暴装置包括具有大致Z形截面的第一细长支架，其具有两个端部段和连接两个端部段的中间段。中间部分可连接到窗扇的侧轨，其中一个端部段从窗扇向外延伸到相邻的边框。存在具有两个腿的基本上L形横截面的第二细长支架，支架的一个支腿适于安装到侧柱，其中L的第二支腿朝向窗扇的相邻侧轨延伸。第一和第二支架分别安装到框架和窗框上，使得当窗框关闭时，第一支架的一端部与第二支架的第二支腿互锁，并且防止当施加压力时窗框摆动到窗扇

66. 发明授权

US06258407B1 Precursors for making low dielectric constant materials with improved thermal stability 失效
标题翻译：制备具有改善的热稳定性的低介电常数材料的前体
公开(公告)号：US06258407B1
公开(公告)日：2001-07-10
申请号：US09440297
申请日：1999-11-15
申请人： Chung J. Lee , Hui Wang , Giovanni Antonio Foggiato
发明人： Chung J. Lee , Hui Wang , Giovanni Antonio Foggiato
IPC分类号： C23C1600
CPC分类号： B05D1/62 , C08J5/18 , C09D4/00 , C23C16/30 , C23C16/401 , H01L21/02131 , H01L21/02211 , H01L21/02216 , H01L21/02271 , H01L21/02274 , H01L21/02277 , H01L21/3122 , H01L21/3127 , H01L21/31629 , Y10T428/26 , C08G77/24
摘要： Fluorinated chemical precursors, methods of manufacture, polymer thin filmswith low dielectric constants, and integrated circuits comprising primarily of sp2C—F and some hyperconjugated sp3C—F bonds are disclosed in this invention. Precursors are disclosed for creating fluorinated silanes and siloxanes, and fluorinated hydrocarbon polymers. Thermal transport polymerization (TP), chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), high density PECVD (HDPCVD), photon assisted CVD (PACVD), and plasma-photon assisted (PPE) CVD and PPETP of these chemicals provides thin films with low dielectric constants and high thermal stabilities for use in the manufacture of integrated circuits.
摘要翻译：氟化化学前体，制造方法，具有低介电常数的聚合物薄膜以及主要包含sp2C-F和一些超共轭sp3C-F键的集成电路在本发明中公开。公开了用于制备氟化硅烷和硅氧烷的前体和氟化烃聚合物。这些化学品的热转移聚合（TP），化学气相沉积（CVD），等离子体增强CVD（PECVD），高密度PECVD（HDPCVD），光子辅助CVD（PACVD）和等离子体光子辅助（PPE）CVD和PPETP提供具有低介电常数和高热稳定性的薄膜用于集成电路的制造。

67. 发明授权

US06248222B1 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces 失效
标题翻译：用于在工件的电抛光和/或电镀期间保持和定位半导体工件的方法和装置
公开(公告)号：US06248222B1
公开(公告)日：2001-06-19
申请号：US09390458
申请日：1999-09-07
申请人： Hui Wang
发明人： Hui Wang
IPC分类号： C25B1100
CPC分类号： C25D17/001 , C25D7/123 , C25D17/06 , C25F7/00
摘要： A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured to receive the wafer for processing. The spring member is disposed on the bottom section and configured to apply an electric charge to the wafer. In accordance with another aspect of the present invention, the spring member contacts a portion of the outer perimeter of the wafer. In one alternative configuration of the present invention, the wafer chuck further includes a seal member to seal the spring member from the electrolyte solution used in the electropolishing and/or electroplating process.
摘要翻译：用于在晶片的电抛光和/或电镀期间保持晶片的晶片卡盘包括顶部部分，底部部分和弹簧部件。根据本发明的一个方面，顶部部分和底部部分构造成接收用于处理的晶片。弹簧构件设置在底部上并构造成向晶片施加电荷。根据本发明的另一方面，弹簧构件接触晶片外周的一部分。在本发明的另一种配置中，晶片卡盘还包括密封件，用于将弹簧件与用于电抛光和/或电镀工艺中的电解液密封。

68. 发明授权

US6086679A Deposition systems and processes for transport polymerization and chemical vapor deposition 失效
标题翻译：用于运输聚合和化学气相沉积的沉积系统和方法
公开(公告)号：US6086679A
公开(公告)日：2000-07-11
申请号：US958352
申请日：1997-10-24
申请人： Chung J. Lee , Hui Wang , Giovanni Antonio Foggiato
发明人： Chung J. Lee , Hui Wang , Giovanni Antonio Foggiato
IPC分类号： C23C16/448 , B05D3/06 , B05D7/24 , C23C16/26 , C23C16/40 , C23C16/44 , C23C16/507 , H01L21/31 , H01L21/312 , C23C16/00
CPC分类号： B05D1/60 , C23C16/26 , C23C16/401 , C23C16/4412 , C23C16/507 , H01L21/312 , B05D3/061
摘要： The described deposition systems are designed to accommodate new precursors and chemical processes used for transport polymerization and chemical vapor deposition. The systems consist primarily of a reactor, a liquid injector or gas mass flow controller, a cracker and a deposition chamber under sub-atmospheres pressure. The cracker utilizes one or more types of energy, including heat, photons, and plasmas. This invention is especially useful for preparing F-PPX (fluorinated poly(para-xylylenes) and other fluorinated polymer thin films for intermetal dielectric (IMD) and interlevel dielectric (ILD) applications in the manufacture of integrated circuits with features
摘要翻译：所描述的沉积系统被设计成适应用于运输聚合和化学气相沉积的新的前体和化学方法。该系统主要由反应器，液体喷射器或气体质量流量控制器，裂化器和在亚压力下的沉积室组成。裂解器利用一种或多种类型的能量，包括热，光子和等离子体。本发明特别可用于制备具有<0.25μm特征的集成电路的制备中的金属间电介质（IMD）和层间电介质（ILD）应用的F-PPX（氟化聚（对 - 二甲苯））和其它氟化聚合物薄膜尺寸。

69. 发明授权

US5317574A Method and apparatus for generating x-ray and/or extreme ultraviolet laser 失效
标题翻译：用于产生x射线和/或极紫外激光的方法和装置
公开(公告)号：US5317574A
公开(公告)日：1994-05-31
申请号：US999127
申请日：1992-12-31
申请人： Hui Wang
发明人： Hui Wang
IPC分类号： H01S4/00 , H05G2/00 , H01S3/097 , H01S3/30
CPC分类号： H05G2/003 , H01S4/00
摘要： A method and apparatus for producing x-ray and/or extreme ultraviolet (EUV) is described. A liquid edge 2 is electrically connected to a cathode 8 via a high voltage pulse power supply 10. Liquid edge 2 is set to be parallel to cathode 8. When high voltage pulse power supply 10 is turned on, a vacuum discharge will occur in a space between liquid edge 2 and cathode 8. The plasma will be confined into a high density and high temperature thin plasma column 4 in a space near liquid edge 2 by strong magnetic field induced by the huge discharge current. A population inversion in the confined plasma column will lead to a amplified simultaneous emission of x-ray and/or EUV 6 along the axis of plasma column 4. Moreover, a large power x-ray and/or EUV laser can be built by using multi-liquid edge-shape anodes placed in a straight line and operated in a traveling-wave mode.
摘要翻译：描述了用于产生x射线和/或极紫外（EUV）的方法和装置。液体边缘2通过高压脉冲电源10与阴极8电连接。液体边缘2被设定为与阴极8平行。当高电压脉冲电源10接通时，真空放电将发生在液体边缘2和阴极8之间的空间。等离子体将通过由巨大放电电流引起的强磁场在液体边缘2附近的空间中被限制在高密度和高温薄的等离子体柱4中。限制等离子体柱中的群体反转将导致沿着等离子体柱4的轴同时发射x射线和/或EUV 6。此外，可以通过使用大功率x射线和/或EUV激光器来构建大功率x射线和/或EUV激光器放置在直线上并以行波模式操作的多液边缘形阳极。

70. 发明授权

US5243638A Apparatus and method for generating a plasma x-ray source 失效
标题翻译：用于产生等离子体x射线源的装置和方法
公开(公告)号：US5243638A
公开(公告)日：1993-09-07
申请号：US848205
申请日：1992-03-10
申请人： Hui Wang , Weimin Shi
发明人： Hui Wang , Weimin Shi
IPC分类号： H05G2/00
CPC分类号： H05G2/003 , H05G2/005 , H05G2/008
摘要： A method and apparatus are provided for generating x-ray photon radiation. A liquid cone anode and an extraction electrode spaced therefrom are disposed in a vacuum chamber. The liquid cone anode comprises a liquid material, a reservoir for holding the liquid material having an opening for passage of the liquid material, and a liquid material feeding and cone forming mechanism operatively associated with the reservoir for feeding liquid material through the opening in the reservoir and for forming a liquid cone from the liquid material A power supply is connected to the liquid cone anode and the extraction electrode for creating an electric field therebetween of sufficient strength to cause particles to be extracted from the liquid cone anode to form a plasma ball in the space between the liquid cone anode and the extraction electrode which emits x-ray photon radiation.
摘要翻译：提供了一种用于产生x射线光子辐射的方法和装置。液体锥形阳极和与其分开的提取电极设置在真空室中。液体锥体阳极包括液体材料，用于保持具有用于液体材料通过的开口的液体材料的储存器，以及与储存器可操作地相关联的液体材料供给和锥形成机构，用于通过储存器中的开口供给液体材料并且用于从液体材料形成液体锥体电源连接到液体锥形阳极和引出电极，用于在其间产生足够强度的电场，以使得从液体锥形阳极中提取颗粒以形成等离子体球液体锥形阳极和引出电极之间的空间，其发射x射线光子辐射。

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