会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 61. 发明专利
    • ETCHING METHOD AND DEVICE
    • JPH06342769A
    • 1994-12-13
    • JP22241592
    • 1992-08-21
    • NISSIN ELECTRIC CO LTD
    • MITSUTA YOSHIEMURAKAMI HIROSHIHAYASHI TSUKASAKUWABARA SO
    • C23F4/00H01L21/302H01L21/3065
    • PURPOSE:To enable to a work to be protected against side etching and enhanced in etching shape controllability, etching rate, and plane uniformity by a method wherein etching gas is turned into plasma by applying a pulse-modulated high-frequency voltage. CONSTITUTION:A tray 9 fitted with a substrate 8 on which an etched thin film is formed is mount on an electrode 4, and etching gas is introduced into a chamber 1 from a gas source 5 as the chamber 1 is exhausted to a prescribed pressure. A pulse-modulated high-frequency voltage is applied to etching gas by a power supply 7 to turn it into plasma, and the etched thin film on the substrate 8 is expose to plasma. As a pulse-modulated high-frequency voltage is applied to etching gas to make it high in ionization rate, the vacuum chamber 1 can be reduced to a lower pressure than a conventional one, and consequently ions are enhanced in mean free path due to a reduction in gas pressure, and etching high in anisotropy can be carried out. As etching gas has a high ionization rate, an etching operation can be carried out with high plane uniformity at a high etching rate.
    • 64. 发明专利
    • METHOD FOR GENERATING RADICAL BEAM
    • JPH05315099A
    • 1993-11-26
    • JP13968592
    • 1992-05-01
    • NISSIN ELECTRIC CO LTD
    • HAYASHI TSUKASAKIRIMURA HIROYAKUWABARA SO
    • H05H3/02
    • PURPOSE:To generate a radical beam by applying high frequency power, to which the first modulation of interrputing a high frequency of saw tooth or chopping wave and the second modulation of interrupting the high frequency by a period shorter than the first modulation are applied, relating to a discharge electrode. CONSTITUTION:A waveform generator 18 possible to generate an arbitrary waveform and a power supply 10a of including a high frequency power amplifier 20 are used. High frequency power, to which the first modulation of interrupting a high frequency of original chopping wave by a period T and the second modulation of interrputing the high frequency by a period shorter than the period T are applied, is added to a discharge electrode 6 of a radical beam source 2. An electron plays the leading role of converting energy in generated plasma 14, and the electron accelerated by an electric field collides against an ion and a neutral particle to produce various radical ions. A proportion of the various radicals is changed by electronic energy in the plasma. By control with the high frequency power of double modulating the electronic energy, selectivity is improved to increase only the necessary radical.
    • 69. 发明专利
    • FORMATION OF BORON NITRIDE THIN FILM
    • JPH04124259A
    • 1992-04-24
    • JP24350890
    • 1990-09-12
    • NISSIN ELECTRIC CO LTD
    • MIKAMI TAKASHINISHIYAMA SATORUKUWABARA SOOGATA KIYOSHIKIRIMURA HIROYA
    • C23C14/06C23C14/22
    • PURPOSE:To form the BN thin film essentially consisting of a c-BN structure on the surface of a base body at a low temp. by irradiating the surface of the base body with rare gaseous ions and nitrogen ions at specific irradiation energy and irradiation quantity ratio simultaneously with the vapor deposition of an evaporating material contg. boron on the surface of the base body. CONSTITUTION:An evaporating source 3 is heated in a vacuum device to deposit the evaporating material 4 contg. a boron element (B) by evaporation on the surface of the base body 2. This base body is irradiated with at least >=1 kinds of the rare gaseous ions the nitrogen ions 6b from an ion source 5 simultaneously with the above- mentioned vapor deposition. The value of this irradiation energy is set at 2KeV to 10KeV in order to more selectively form the BN thin film having the c-BN structure. The ratio of the irradiation quantity of the rare gaseous ions 6a and nitrogen ions 6b with which the base body 2 are irradiated is set in a 0.05 to 2.0 range. Further, the ratio (B/N compsn. ratio) of the number of the particles of the boron and nitrogen in the BN thin film formed on the surface of the base body 2 is so adjusted as to be kept within a 0.5 to 7.0 range. The boron nitride(BN) thin film which consists essentially of the c-BN structure and has high hardness is formed on the base body 2 at the low temp. in this way.
    • 70. 发明专利
    • FORMATION OF BORON NITRIDE THIN FILM
    • JPH04124258A
    • 1992-04-24
    • JP24350790
    • 1990-09-12
    • NISSIN ELECTRIC CO LTD
    • MIKAMI TAKASHINISHIYAMA SATORUKUWABARA SOOGATA KIYOSHIKIRIMURA HIROYA
    • C23C14/06C23C14/22C23C14/48
    • PURPOSE:To form the BN thin film essentially consisting of a c-BN structure on the surface of a base body at a low temp. by irradiating the surface of the base body with rare gaseous ions and nitrogen ions at specific irradiation energy and irradiation quantity ratio simultaneously with the vapor deposition of an evaporating material contg. boron on the surface of the base body. CONSTITUTION:An evaporating source 3 is heated in a vacuum device to deposit the evaporating material 4 contg. a boron element B by evaporation on the surface of the base body 2. This base body is irradiated with at least >=1 kinds of the rare gaseous ions 6a and the nitrogen ions 6b from an ion source 5 simultaneously with the above-mentioned vapor deposition. The value of this irradiation energy is set at 100 to 500eV in order to form the BN thin film having the extremely few damages and defects of the crystal structure. The ratio of the irradiation quantity of the rare gaseous ions 6a and nitrogen ions 6b with which the base body 2 are irradiated is set in a 0.05 to 2.0 range. Further, the ratio (B/N compsn. ratio) of the number of the particles of the boron and nitrogen in the BN thin film formed on the surface of the base body 2 is so adjusted as to be kept within a 0.5 to 3.0 range. The boron nitride (BN) thin film which consists essentially of the c-BN structure and has high hardness is formed on the base body 2 at the low temp. in this way.