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61. 发明专利

JP2007067258A Cooler and power module 有权
标题翻译：冷却器和电源模块
公开(公告)号：JP2007067258A
公开(公告)日：2007-03-15
申请号：JP2005253159
申请日：2005-09-01
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGASE TOSHIYUKI , NEGISHI TAKESHI , NAGATOMO YOSHIYUKI , KUROMITSU YOSHIO , CHOKAI MAKOTO
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a cooler with higher cooling ability and a power module. SOLUTION: A cooler body 12 is provided having a mounting surface 21B wherein an insulation circuit substrate 3 is mounted on its surface. In the cooler body 12, first to third flow path groups 24 to 26 wherein flow paths 21A to 23A for circulating cooling liquid are disposed in a plurality each along the mounting surface 21B are formed to overlap in a direction perpendicular to the mounting surface 21B. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有更高冷却能力的冷却器和功率模块。解决方案：冷却器主体12设置有安装表面21B，其中绝缘电路基板3安装在其表面上。在冷却器主体12中，形成有与安装面21B垂直的方向上重叠的第一至第三流路组24〜26，其中，使流过冷却液的流路21A〜23A分别沿安装面21B配置。版权所有（C）2007，JPO＆INPIT

62. 发明专利

JP2006059859A Method for manufacturing substrate for power module 有权
标题翻译：用于制造功率模块的基板的方法
公开(公告)号：JP2006059859A
公开(公告)日：2006-03-02
申请号：JP2004237304
申请日：2004-08-17
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NEGISHI TAKESHI , NAGASE TOSHIYUKI
IPC分类号： H01L23/12 , C04B37/02 , H01L23/15
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To realize highly efficient production of a substrate for power module and also realize thinning of a conductor pattern. SOLUTION: A solder material foil 15a is temporarily fixed on the surface of a ceramics substrate by the surface tension force of a volatile organic medium, and a conductor pattern member 13b punched out from a base material 13a is temporarily fixed on the surface of the solder material foil 15a by the surface tension force. Then, they are heated to volatilize the volatile organic medium, and the conductor pattern member 13a is pressurized in the direction of its thickness and the solder material foil 15a is melt to join the conductor pattern member 13b with the surface of the ceramics substrate 12. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了实现功率模块用基板的高效生产，还实现导体图案的薄型化。解决方案：通过挥发性有机介质的表面张力将焊料材料箔15a临时固定在陶瓷基板的表面上，并且将从基材13a冲出的导体图案部件13b临时固定在表面上的焊料材料箔15a的表面张力。然后，将其加热挥发挥发性有机介质，并且导体图案部件13a在其厚度方向上被加压，并且焊料材料箔15a熔化以将导体图案部件13b与陶瓷基板12的表面接合。版权所有（C）2006，JPO＆NCIPI

63. 发明专利

JP2006019410A Heat sink, its production method, substrate for power module and power module 有权
标题翻译：散热片，其生产方法，功率模块和功率模块基板
公开(公告)号：JP2006019410A
公开(公告)日：2006-01-19
申请号：JP2004194164
申请日：2004-06-30
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGASE TOSHIYUKI , KUBO KAZUAKI , NAGATOMO YOSHIYUKI
IPC分类号： H01L23/36 , H01L23/373
CPC分类号： H01L23/3735 , H01L23/15 , H01L23/473 , H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a heat sink exhibiting low thermal expansibility and high thermal conductivity, and to suppress the warpage of the heat sink even if it is used under temperature circle. SOLUTION: In the heat sink 16 where a low thermal expansion body 18, having a thermal expansion coefficient lower than that of a heat sink body 17, is laminated on the heat sink body 17; heat of a heating element 30 provided on the surface side of the heat sink body 17 is conducted in the laminating direction and dissipated; a filling material 21, having a thermal expansion coefficient higher than that of the heat sink body 17, is arranged in a through hole 19 bored in the low thermal expansion body 18; and the heat sink body 17 is soldered to the low thermal expansion body 18 and the filling material 21. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有低热膨胀性和高导热性的散热器，并且即使在温度圈下使用也能抑制散热器的翘曲。解决方案：在散热器16中，具有低于散热体17的热膨胀系数的低热膨胀体18层叠在散热体17上; 设置在散热体17的表面侧的加热元件30的热量在层叠方向上导通并消散; 具有比散热体17的热膨胀系数高的热膨胀系数的填充材料21布置在钻孔在低热膨胀体18中的通孔19中; 并且散热体17被焊接到低热膨胀体18和填充材料21.版权所有（C）2006，JPO＆NCIPI

64. 发明专利

JP2004266002A Process for producing heat sink, heat sink, substrate for power module using the heat sink, and power module 有权
公开(公告)号：JP2004266002A
公开(公告)日：2004-09-24
申请号：JP2003053116
申请日：2003-02-28
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： KUBO KAZUAKI , NAGASE TOSHIYUKI
IPC分类号： H01L23/36 , H01L23/373 , H01L25/07 , H01L25/18
CPC分类号： H01L23/3735 , H01L23/15 , H01L23/473 , H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a process for producing a heat sink in which warp can be reduced regardless of difference in the thermal expansion coefficient between an insulating substrate and the heat sink and lowering of thermal conductivity can be suppressed, and to provide a heat sink, a substrate for power module employing that heat sink and a power module.
SOLUTION: A heat sink 16 for dissipating heat of a heat dissipated body comprises a heat sink body 17, and a low thermal expansion material 18 having a thermal expansion coefficient lower than that of the heat sink body 17. The heat sink body 17 is a multilayered body of a plate-like body 17a of pure Cu or a Cu alloy and a casting 17b of pure Al or an Al alloy wherein the plate-like body 17a is arranged on each outermost layer of the heat sink body 17 and the low thermal expansion material 18 is cast by the casting 17b between the plate-like bodies 17a.
COPYRIGHT: (C)2004,JPO&NCIPI

65. 发明专利

JP2004200568A Radiator and its producing process 审中-公开
标题翻译：散热器及其生产工艺
公开(公告)号：JP2004200568A
公开(公告)日：2004-07-15
申请号：JP2002369848
申请日：2002-12-20
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGASE TOSHIYUKI , NEGISHI TAKESHI , NAGATOMO YOSHIYUKI
IPC分类号： H01L23/36 , H01L23/373
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To reduce the weight while enhancing machinability and to attain a sufficient strength while preventing warp. SOLUTION: The radiator 16 has a metallic main component 17 provided with a filler 18 having a low thermal expansion coefficient. The main component 17 is formed of a so-called high heat conducting material having a high thermal conductivity, e.g. Cu or a Cu alloy. The filler 18 is a linear body having an appropriate size formed of a metal, e.g. Invar alloy, having a thermal expansion coefficient smaller than that of the main component 17 integrally with the main component 17. The filler 18 is oriented to a specified direction on a plane when the radiator 16 is formed. COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：为了减轻重量，同时提高机械加工性并获得足够的强度同时防止翘曲。解决方案：散热器16具有设置有热膨胀系数低的填料18的金属主要部件17。主要部件17由具有高导热性的所谓的高导热材料形成，例如， Cu或Cu合金。填料18是具有由金属形成的合适尺寸的线状体，例如。殷钢合金的热膨胀系数小于与主要部件17一体的主要部件17的热膨胀系数。当形成散热器16时，填料18在平面上朝向特定方向。版权所有（C）2004，JPO＆NCIPI

66. 发明专利

JP2004172457A Power module and substrate therefor 有权
公开(公告)号：JP2004172457A
公开(公告)日：2004-06-17
申请号：JP2002338085
申请日：2002-11-21
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NEGISHI TAKESHI , NAGATOMO YOSHIYUKI , NAGASE TOSHIYUKI
IPC分类号： H01L23/40 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a substrate for power module that can suppress warping regardless of the difference between the coefficients of thermal expansion of an insulating substrate and a heat sink and, at the same time, can prevent the falling of its coefficient of thermal conductivity, and to provide a power module.
SOLUTION: The substrate 10 for power module is provided with the insulating substrate 11 and heat sink 16 provided on one surface of the substrate 11. The heat sink 16 is provided with a main body 17, a low thermally expandable material 18 having a lower coefficient of thermal expansion than the main body 17 has, and fins 19 installed to the main body 17. The main body 17 and the fins 19 are composed of an integrally molded cast material. The fins 19 are arranged in the direction connecting one end sections C and D holding flexural rigidity lower than that held between the other ends A and B between them of the facing ends A, B, C, and D of the peripheral edge of the heat sink 16.
COPYRIGHT: (C)2004,JPO

67. 发明专利

JP2004146737A Power module substrate, and power module 有权
公开(公告)号：JP2004146737A
公开(公告)日：2004-05-20
申请号：JP2002312594
申请日：2002-10-28
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGATOMO YOSHIYUKI , NEGISHI TAKESHI , NAGASE TOSHIYUKI
IPC分类号： H01L23/36
CPC分类号： H01L23/3735 , H01L23/15 , H01L23/473 , H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To restrict deformation irrespective of the difference between thermal expansion coefficients of both of an insulating substrate and a heat radiator, and further suppress the lowering of thermal conductivity. SOLUTION: In the power module substrate 10 including a circuit layer 12 provided on the upper surface of the insulating substrate 11 and the heat radiator 16 provided on the lower surface of the insulating substrate 11, a low thermal expansion member 18 is laminated on a radiator body 17 of the heat radiator 16, and the low thermal expansion member 18 is made of a material having the quality of a low thermal expansion coefficient than that of the radiator body 17, for example invar alloy. In the low thermal expansion member 18, there is provided a stepped portion 20 in the direction of the thickness of a region facing the insulating substrate 11. A disposition position of the stepped portion 20 in the direction along the stepped portion 20 and in the direction along the lamination is determined by the disposition position in the direction along the surface of the insulating substrate 11 and a difference between the thermal expansion coefficients of the insulating substrate 11 and the radiator 16. COPYRIGHT: (C)2004,JPO

68. 发明专利

JP2015032424A ヒューズ审中-公开
标题翻译：保险丝
公开(公告)号：JP2015032424A
公开(公告)日：2015-02-16
申请号：JP2013160518
申请日：2013-08-01
申请人：三菱マテリアル株式会社 , Mitsubishi Materials Corp
发明人： SHIRATA TAKAHARU , NAGASE TOSHIYUKI
IPC分类号： H01H85/175 , H01H85/045 , H01H85/06 , H01H85/08
摘要：【課題】高耐圧でありながら小型化が可能なヒューズを提供すること。【解決手段】絶縁性基板2と、絶縁性基板上に形成された一対の電極3と、一対の電極に両端が接続されたヒューズ部4と、絶縁性基板上で少なくともヒューズ部を覆う絶縁性封止材5とを備え、ヒューズ部が、前記両端の間の中間部において少なくとも一部が盛り上がって形成され、中間部と絶縁性基板との間に少なくとも一対の電極間にわたって空間Sが設けられている。また、ヒューズ部は、一対の電極間を横切る断面形状が略波状とされた略波板状に形成されている。【選択図】図2
摘要翻译：要解决的问题：提供即使在高击穿电压下也可以变小的熔丝。解决方案：熔丝包括绝缘基板2，形成在绝缘基板上的一对电极3，两端连接的熔丝部分4 一对电极，以及至少覆盖绝缘基板上的熔断部的绝缘密封材料5。保险丝部分形成为使得至少一个部分在两端之间的中间部分处膨胀，并且在中间部分和绝缘基板之间的至少一对电极之间设置空间S. 此外，熔丝部分形成为大致波浪形状，使得在一对电极之间交叉的横截面形状具有近似波形。

69. 发明专利

JP2014078558A Semiconductor device, ceramic circuit board, and method for manufacturing semiconductor device 有权
标题翻译：半导体器件，陶瓷电路板及制造半导体器件的方法
公开(公告)号：JP2014078558A
公开(公告)日：2014-05-01
申请号：JP2012224257
申请日：2012-10-09
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NISHIMOTO SHUJI , NAGATOMO YOSHIYUKI , NAGASE TOSHIYUKI
IPC分类号： H01L25/07 , H01L21/52 , H01L25/18
CPC分类号： H01L24/32 , C04B37/026 , C04B2237/06 , C04B2237/125 , C04B2237/126 , C04B2237/366 , C04B2237/402 , C04B2237/597 , C04B2237/708 , C04B2237/72 , H01L23/3735 , H01L23/473 , H01L23/49822 , H01L24/29 , H01L24/48 , H01L24/83 , H01L25/07 , H01L25/18 , H01L33/641 , H01L2224/2731 , H01L2224/2732 , H01L2224/27505 , H01L2224/29082 , H01L2224/29083 , H01L2224/29188 , H01L2224/29294 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29387 , H01L2224/29388 , H01L2224/32225 , H01L2224/32227 , H01L2224/32245 , H01L2224/4809 , H01L2224/48227 , H01L2224/48245 , H01L2224/73265 , H01L2224/83192 , H01L2224/83203 , H01L2224/83539 , H01L2224/83595 , H01L2224/83695 , H01L2224/8384 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/0541 , H01L2924/01047 , H01L2224/45099
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which can efficiently transfer heat from a semiconductor element to a circuit layer side and in which a circuit layer and a semiconductor element are surely bonded using a bonding material containing at least one or both of a metal particle and a metal oxide particle and an organic material, a ceramic circuit board used in the semiconductor device, and a method for manufacturing the semiconductor device.SOLUTION: A semiconductor device 1 comprises a circuit layer 12 composed of a conductive material and a semiconductor element 3 mounted on the circuit layer 12. A base layer 31 in which a porosity is not less than 5% and not more than 55% is formed on one surface of the circuit layer 12. A bonding layer 38 composed of a fired body of a bonding material containing at least one or both of a metal particle and a metal oxide particle and an organic material is formed on the base layer 31. The circuit layer 12 and the semiconductor element 3 are bonded via the base layer 31 and the bonding layer 38.
摘要翻译：要解决的问题：提供一种半导体器件，其可以有效地将热量从半导体元件传递到电路层侧，并且其中电路层和半导体元件使用包含至少一种或两种金属的接合材料可靠地接合颗粒和金属氧化物颗粒和有机材料，用于半导体器件的陶瓷电路板及其制造方法。半导体器件1包括由导电材料和半导体元件构成的电路层12 安装在电路层12上。在电路层12的一个表面上形成孔隙率不小于5％且不大于55％的基底层31.由烧结体在基底层31上形成包含金属粒子和金属氧化物粒子以及有机材料中的至少一种或两者的结合材料。电路层12和半导体元件 ent 3通过基底层31和结合层38结合。

70. 发明专利

JP2013207236A Power module substrate and manufacturing method thereof 有权
标题翻译：功率模块基板及其制造方法
公开(公告)号：JP2013207236A
公开(公告)日：2013-10-07
申请号：JP2012077401
申请日：2012-03-29
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGASE TOSHIYUKI , KITAHARA JOJI , MURANAKA AKIRA
IPC分类号： H01L23/14 , C04B37/02 , H01L23/12 , H01L23/36 , H01L25/07 , H01L25/18
CPC分类号： B23K1/0016 , B23K1/19 , B32B15/04 , B32B18/00 , B32B2457/00 , C04B37/026 , C04B2235/6581 , C04B2235/723 , C04B2235/963 , C04B2237/121 , C04B2237/126 , C04B2237/128 , C04B2237/366 , C04B2237/402 , C04B2237/52 , C04B2237/60 , C04B2237/704 , C04B2237/706 , C04B2237/708 , C04B2237/86 , H01L23/3735 , H01L23/3736 , H01L23/473 , H01L2224/48091 , H01L2224/73265 , H05K1/0306 , H05K3/382 , H05K3/383 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a power module substrate which has had minute voids in junctions reduced to prevent separation and a method for manufacturing the power module substrate.SOLUTION: A metal plate consisting of aluminum or aluminum alloy is joined by soldering to the face on at least one side of a ceramic substrate. When the cross section of the metal plate in a depth range of 5 μm from a junction interface between the metal plate and the ceramic substrate within a region of 200 μm in width from a side edge of the metal plate is observed by a scanning electron microscope in a 3000-fold magnified field of vision, a total length of continuous residual oxide existing continuously 2 μm or more along the junction interface is 70% or less of the length of the visual field.
摘要翻译：要解决的问题：提供一种功率模块基板，其在接合处具有微小的空隙以防止分离，以及制造功率模块基板的方法。解决方案：由铝或铝合金组成的金属板通过焊接连接到表面在陶瓷基板的至少一侧上。当通过扫描电子显微镜观察金属板的距离金属板和陶瓷基板之间的接合界面的距离金属板的侧边宽度在200μm宽度范围内的金属板的横截面在3000倍放大视野中，沿着接合界面连续存在2μm以上的连续残余氧化物的总长度为视野长度的70％以下。

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