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    • 67. 发明授权
    • Polycarbonate styrene copolymer blends with improved properties
    • 具有改进性能的聚碳酸酯苯乙烯共聚物共混物
    • US07265172B2
    • 2007-09-04
    • US10510478
    • 2003-04-08
    • Martin WeberXaver HopfenspirgerReinhard JakobiWalter Heckmann
    • Martin WeberXaver HopfenspirgerReinhard JakobiWalter Heckmann
    • C08L69/00C08L51/04
    • C08L55/02C08F265/04C08L25/12C08L51/04C08L69/00C08L2205/035C08L2666/02C08L2666/14C08L2666/04
    • Thermoplastic molding composition comprising components A, B, C and D and, if appropriate, E, F, G and H, A) from 1 to 97.5% by weight of at least one aromatic polycarbonate A, B) from 1 to 97.5% by weight of at least one graft polymer B made from b1) from 40 to 80% by weight of a graft base made from an elastomeric polymer B1, b2) from 20 to 60% by weight of a graft B2 made from b21) from 60 to 95% by weight of styrene or of substituted styrenes B21 and b22) from 5 to 40% by weight of at least one unsaturated nitrile B22, C) from 1 to 97.5% by weight of at least one thermoplastic copolymer C made from c1) from 60 to 85% by weight of styrene or of substituted styrenes C1 or mixtures thereof and c2) from 15 to 40% by weight of at least one unsaturated nitrile C2, D) from 0.5 to 50% by weight of at least one copolymer D, obtainable via reaction of d1) from 5 to 95% by weight of at least one thermoplastic methacrylate polymer D1 containing at least one type of functional groups selected from epoxy, carboxy, hydroxy, anhydride and oxazoline, with d2) from 5 to 95% by weight of at least one thermoplastic polyester D2, E) from 0 to 40% by weight of at least one filler E, F) from 0 to 2% by weight of at least one organic acid F, G) from 0 to 25% by weight of at least one halogen-free phosphorus compound G, H) from 0 to 45% by weight of other additives H.
    • 包含组分A,B,C和D以及如果合适的话,E,F,G和H的热塑性模塑组合物,A)1至97.5重量%的至少一种芳族聚碳酸酯A,B)1至97.5% 由b1)制成的至少一种接枝聚合物B的重量为40〜80重量%的由弹性体聚合物B1制成的接枝基料,b2)20〜60重量%的由b21制得的接枝体B2从60〜 95重量%的苯乙烯或取代的苯乙烯B21和b22)5至40重量%的至少一种不饱和腈B22,C)1至97.5重量%的至少一种由c1)制成的热塑性共聚物C 60至85重量%的苯乙烯或取代的苯乙烯或其混合物,c2)15至40重量%的至少一种不饱和腈C2,D)0.5至50重量%的至少一种共聚物D, 可通过d1)5至95重量%的至少一种含至少一种选自以下的官能团的热塑性甲基丙烯酸酯聚合物D1 环氧基,羧基,羟基,酸酐和恶唑啉,d2)5至95重量%的至少一种热塑性聚酯D2,E)0至40重量%的至少一种填料E,F)0至 2重量%的至少一种有机酸F,G)0至25重量%的至少一种无卤素磷化合物G,H)0至45重量%的其它添加剂H.
    • 68. 发明申请
    • Thermoplastic Molding Masses Made From Styrol Copolymers And Polyamides
    • 由苯乙烯共聚物和聚酰胺制成的热塑性成型体
    • US20070161746A1
    • 2007-07-12
    • US10586384
    • 2005-01-15
    • Martin Weber
    • Martin Weber
    • C08L77/00
    • C08L55/02C08F279/02C08F279/04C08L25/08C08L25/10C08L25/12C08L25/14C08L51/003C08L51/04C08L77/00C08L77/02C08L77/06C08L2205/02C08L2205/03C08L2666/02C08L51/00C08L2666/14C08L2666/24
    • Thermoplastic molding compositions composed of A) a polyamide having amino or carboxy end groups or a mixture of these end groups, B) a mixture composed of at least two graft copolymers, each comprising a rubber as graft base and a graft based on an unsaturated monomer, where these differ at least 5% by weight from one another in their rubber contents, C) a rubber-free copolymer, comprising c1) at least 30% by weight, based on the total weight of all of the units present in C), of units which derive from a vinylaromatic monomer, c2) units which derive from a monomer which comprises a functional group which can react with the end groups of the polyamide A), and c3) units which derive from a monomer which comprises no functional groups which react with the end groups of the polyamide A), and also moreover, if desired, D) a rubber-free matrix polymer, E) a low-molecular-weight compound which comprises a dicarboxylic anhydride group, and F) an additive, or a mixture of various additives.
    • 由A)具有氨基或羧基端基的聚酰胺或这些端基的混合物组成的热塑性模塑组合物,B)由至少两种接枝共聚物组成的混合物,每种接枝共聚物包含作为接枝基质的橡胶和基于不饱和单体的接枝 ,其中它们的橡胶含量彼此不同至少5重量%,C)无橡胶共聚物,其包含c1)至少30重量%,基于C)中存在的所有单元的总重量, 来自乙烯基芳族单体的单元,c2)衍生自包含可与聚酰胺A的端基反应的官能团的单体的单元)和c3)衍生自不含官能团的单体的单元 其与聚酰胺A)的端基反应,并且如果需要,D)无橡胶基质聚合物E)包含二羧酸酐基团的低分子量化合物和F)添加剂, 或各种添加剂的混合物。
    • 70. 发明授权
    • Process for producing a silicon single crystal which is doped with highly volatile foreign substances
    • 用于制造掺杂有高挥发性异物的硅单晶的方法
    • US07070649B2
    • 2006-07-04
    • US10690415
    • 2003-10-21
    • Martin WeberPeter VilzmannErich GmeilbauerRobert Vorbuchner
    • Martin WeberPeter VilzmannErich GmeilbauerRobert Vorbuchner
    • C30B15/20
    • C30B29/06C30B15/00
    • A process for producing a doped silicon single crystal, comprising after-doping the melt during the pulling process with a quantity of volatile dopant ΔN(t), calculated according to the equation ΔN(t)=N0−N(t)=N0·(1−e−λa·t) or according to the approximation equation ΔN(t)=N0·λa·t where λa is an evaporation coefficient which describes process-specific evaporation behavior of the foreign substance and which is obtained after a resistance profile R(t) of a further single crystal has been measured and calculated according to the equation R(t)=R0·eλa·t, where R0 is a starting resistivity and the further single crystal is pulled under the same process conditions without being after-doped with the foreign substance.
    • 一种制造掺杂硅单晶的方法,包括在拉伸过程中用一定量的挥发性掺杂剂ΔN(t)对熔体进行后掺杂,根据方程式<?in-line-formula description =“In-Line Formulas “end =”lead“?> DeltaN(t)= N 0 -N(t)= N 0(1-e-O) > a .t )<?in-line-formula description =“In-line Formulas”end =“tail”?>或根据 到近似方程式<?in-line-formula description =“In-line Formulas”end =“lead”?> DeltaN(t)= N <?in-line-formula description =“In-line Formulas”end =“tail”?>其中lambda是一个蒸发系数,它描述异物的过程特定的蒸发行为, 已经根据方程式<?in-line-formula description =“In-line Formulas”end =“lead”?> R(t)= 1)测量并计算另一单晶的电阻分布R(t) R&lt; 0&lt;&lt; SU > .t ,<?in-line-formula description =“In-line Formulas”end =“ 尾“→其中R 0 <0>是起始电阻率,并且在相同的工艺条件下拉伸另外的单晶而不用异物进行后掺杂。