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61. 发明申请

US20090145629A1 Micromachine and Method for Manufacturing the Same 有权
标题翻译：微机械及其制造方法
公开(公告)号：US20090145629A1
公开(公告)日：2009-06-11
申请号：US12327341
申请日：2008-12-03
申请人： Mayumi Mikami , Konami Izumi
发明人： Mayumi Mikami , Konami Izumi
IPC分类号： H05K1/09 , H05K1/00 , H05K3/10
CPC分类号： H01H59/0009 , B81B2201/018 , B81C1/00166 , H01H1/58 , H01H2001/0052 , H01H2001/0057 , Y10T29/49155
摘要： A structure which prevents thinning and disconnection of a wiring is provided, in a micromachine (MEMS structure body) formed with a surface micromachining technology. A wiring (upper auxiliary wiring) over a sacrificial layer is electrically connected to a different wiring (upper connection wiring) over the sacrificial layer, so that thinning, disconnection, and the like of the wiring formed over the sacrificial layer at a step portion generated due to the thickness of the sacrificial layer can be prevented. The wiring over the sacrificial layer is formed of the same conductive film as an upper driving electrode which is a movable electrode and is thus thin. However, the different wiring is formed over a structural layer, which is formed by a CVD method and has a rounded step, and has a thickness of 200 nm to 1 μm, whereby thinning, disconnection, and the like of the wiring can be further prevented.
摘要翻译：在形成有表面微机械加工技术的微型机械（MEMS机构）中，提供了防止配线断线和断线的结构。在牺牲层之上的布线（上辅助布线）在牺牲层上电连接到不同的布线（上连接布线），从而在生成的台阶部分上形成在牺牲层上的布线的变薄，断开等由于可以防止牺牲层的厚度。牺牲层上的布线由与作为可动电极的上驱动电极相同的导电膜形成，因此薄。然而，不同的布线形成在通过CVD法形成并具有圆形台阶的结构层上，并且具有200nm至1μm的厚度，由此可以进一步布线的变薄，断开等防止了

62. 发明申请

US20080211024A1 Memory Device and Manufacturing Method of the Same 有权
标题翻译：存储器件及其制造方法
公开(公告)号：US20080211024A1
公开(公告)日：2008-09-04
申请号：US10573527
申请日：2005-05-31
申请人： Kiyoshi Kato , Tetsuji Yamaguchi , Etsuko Asano , Konami Izumi
发明人： Kiyoshi Kato , Tetsuji Yamaguchi , Etsuko Asano , Konami Izumi
IPC分类号： H01L27/12 , H01L21/336
CPC分类号： G11C17/16 , H01L27/112 , H01L27/115 , H01L27/11517 , H01L27/1203
摘要： An easy-to-use and inexpensive memory device is provided while maintaining product specifications and productivity even when a memory is formed on the same substrate as other functional circuits. The memory device of the invention includes a memory cell formed on an insulating surface. The memory cell includes a semiconductor film having two impurity regions, a gate electrode, and two wirings connected to the respective impurity regions. The two wirings are insulated from each other by applying a voltage between the gate electrode and at least one of the two wirings to alter the state of the semiconductor film.
摘要翻译：提供易于使用和便宜的存储器件，同时在与其它功能电路形成在同一衬底上的存储器的同时保持产品规格和生产率。本发明的存储器件包括形成在绝缘表面上的存储单元。存储单元包括具有两个杂质区域的半导体膜，栅极电极和连接到各个杂质区域的两个布线。通过在栅电极和两条布线中的至少一个之间施加电压来改变半导体膜的状态，两个布线彼此绝缘。

63. 发明申请

US20070229271A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20070229271A1
公开(公告)日：2007-10-04
申请号：US11716693
申请日：2007-03-12
申请人： Yutaka Shionoiri , Konami Izumi , Jun Koyama , Yoshiyuki Kurokawa , Shunpei Yamazaki , Tomoaki Atsumi , Takeshi Osada , Takayuki Ikeda , Masato Ishii
发明人： Yutaka Shionoiri , Konami Izumi , Jun Koyama , Yoshiyuki Kurokawa , Shunpei Yamazaki , Tomoaki Atsumi , Takeshi Osada , Takayuki Ikeda , Masato Ishii
IPC分类号： G08B13/14 , H04Q5/22
CPC分类号： H01Q1/36 , G06K7/10178 , G06K19/0705 , G06K19/0707 , G06K19/0723 , H01Q1/2225 , H01Q1/38 , H01Q7/00 , H01Q9/285 , H02N2/186
摘要： Objects of the invention are to provide a semiconductor device including an RFID, which can transmit and receive individual information without a check of remaining capacity of the battery and a change of the battery in accordance with deterioration over time of the battery for a driving power supply; and which maintains a favorable communication state even when electric power, as a power supply for driving, from an external radio wave or electromagnetic wave (carrier wave) is not sufficient. A battery is provided as a power supply for supplying electric power in the RFID, and electric power obtained by a power generation element is charged in the battery.
摘要翻译：本发明的目的是提供一种包括RFID的半导体器件，其可以在不检查电池的剩余容量的情况下发送和接收各个信息，并且根据用于驱动电源的电池的时间的变化，提供电池的变化 ; 并且即使作为来自外部无线电波或电磁波（载波）的驱动用电源的电力不足，也保持良好的通信状态。提供电池作为用于在RFID中提供电力的电源，并且通过发电元件获得的电力被充电在电池中。

64. 发明授权

US08619003B2 Semiconductor device with wireless communication 有权
标题翻译：具有无线通信的半导体器件
公开(公告)号：US08619003B2
公开(公告)日：2013-12-31
申请号：US12053932
申请日：2008-03-24
申请人： Koji Dairiki , Konami Izumi
发明人： Koji Dairiki , Konami Izumi
IPC分类号： H01Q21/00 , H01Q1/38 , H01Q5/00 , H01Q9/04 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40 , H01L23/58
CPC分类号： H01L25/0657 , H01L21/6835 , H01L23/48 , H01L23/5385 , H01L23/58 , H01L23/645 , H01L23/66 , H01L24/32 , H01L24/48 , H01L2221/68318 , H01L2221/6835 , H01L2221/68368 , H01L2223/6677 , H01L2224/05554 , H01L2224/48091 , H01L2224/48157 , H01L2225/06506 , H01L2225/06527 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01054 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/07811 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1306 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01Q1/2283 , H01Q9/0407 , H01Q9/285 , H01Q13/10 , H01Q23/00 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： To provide a semiconductor device in which wireless communication is performed between devices formed over different substrates and connection defects of wirings are reduced. A first device having a first antenna is provided over a first substrate, a second device having a second antenna which can communicate with the first antenna is provided over a second substrate, and the first substrate and the second substrate are bonded to each other to manufacture a semiconductor device. The first substrate and the second substrate are bonded to each other by bonding with a bonding layer interposed therebetween, anodic bonding, or surface activated bonding.
摘要翻译：为了提供在不同基板之间形成的器件之间执行无线通信的半导体器件，并且布线的连接缺陷被减少。具有第一天线的第一装置设置在第一基板上，具有可与第一天线连通的第二天线的第二装置设置在第二基板上，并且第一基板和第二基板彼此接合以制造半导体器件。第一基板和第二基板通过与其间的接合层的粘合，阳极接合或表面活性接合而彼此接合。

65. 发明授权

US08159257B2 Element substrate, inspecting method, and manufacturing method of semiconductor device 有权
标题翻译：元件基板，检查方法和半导体器件的制造方法
公开(公告)号：US08159257B2
公开(公告)日：2012-04-17
申请号：US12910426
申请日：2010-10-22
申请人： Kiyoshi Kato , Konami Izumi , Masahiko Hayakawa , Koichiro Kamata
发明人： Kiyoshi Kato , Konami Izumi , Masahiko Hayakawa , Koichiro Kamata
IPC分类号： G01R31/26
CPC分类号： G01R31/2822 , G01R31/2886 , G01R31/3025 , H01L27/13
摘要： A substrate including a semiconductor layer, where characteristics of an element can be evaluated with high reliability, and an evaluating method thereof are provided. A substrate including a semiconductor layer of the invention has a closed-loop circuit in which an antenna coil and a semiconductor element are connected in series, and a surface of an area over which the circuit is formed is covered with an insulating film. By using such a circuit, a contactless inspection can be carried out. Further, a ring oscillator can be substituted for the closed-loop circuit.
摘要翻译：提供了包括可以以高可靠性评估元件的特性的半导体层的基板及其评价方法。包括本发明的半导体层的衬底具有一个闭环电路，其中天线线圈和半导体元件串联连接，并且形成有电路的区域的表面被绝缘膜覆盖。通过使用这样的电路，可以进行非接触检查。此外，环形振荡器可以代替闭环电路。

66. 发明授权

US08120538B2 Wireless chip 有权
公开(公告)号：US08120538B2
公开(公告)日：2012-02-21
申请号：US12981574
申请日：2010-12-30
申请人： Shunpei Yamazaki , Konami Izumi
发明人： Shunpei Yamazaki , Konami Izumi
IPC分类号： H01Q1/38
CPC分类号： G06K19/07775 , G06K19/04 , G06K19/07749 , H01L27/1214 , H01L27/1266 , H01Q1/38
摘要： The invention provides a wireless chip which can secure the safety of consumers while being small in size, favorable in communication property, and inexpensive, and the invention also provides an application thereof. Further, the invention provides a wireless chip which can be recycled after being used for managing the manufacture, circulation, and retail. A wireless chip includes a layer including a semiconductor element, and an antenna. The antenna includes a first conductive layer, a second conductive layer, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer, and has a spherical shape, an ovoid shape, an oval spherical shape like a go stone, an oval spherical shape like a rugby ball, or a disc shape, or has a cylindrical shape or a polygonal prism shape in which an outer edge portion thereof has a curved surface.

67. 发明申请

US20100227228A1 Power Storage Device 有权
标题翻译：蓄电装置
公开(公告)号：US20100227228A1
公开(公告)日：2010-09-09
申请号：US12719629
申请日：2010-03-08
申请人： Shunpei Yamazaki , Konami Izumi
发明人： Shunpei Yamazaki , Konami Izumi
IPC分类号： H01M10/26 , H01M2/16 , H01M4/38 , H01M10/00
CPC分类号： H01M10/058 , C23F4/00 , H01G9/016 , H01G9/02 , H01G9/038 , H01G9/058 , H01G9/155 , H01G11/24 , H01G11/26 , H01G11/28 , H01G11/52 , H01G11/60 , H01G11/68 , H01M2/16 , H01M4/0404 , H01M4/13 , H01M4/139 , H01M4/366 , H01M4/661 , H01M10/052 , H01M10/0525 , H01M10/0566 , H01M10/0569 , H01M2004/021 , H01M2300/0025 , Y02E60/122 , Y02E60/13 , Y02P70/54 , Y10T29/49115
摘要： The present invention relates to a power storage device including: a positive electrode having a positive-electrode current collector, a positive-electrode active material with a plurality of first projections on the positive-electrode current collector, and a first insulator on an end of each of the plurality of first projections; a negative electrode having a negative-electrode current collector, a negative-electrode active material with a plurality of second projections on a surface of the negative-electrode current collector, and a second insulator on an end of each of the plurality of second projections; a separator between the positive electrode and the negative electrode; and an electrolyte provided in a space between the positive electrode and the negative electrode and containing carrier ions. In each of the first projections and the second projections, a ratio of the height to the width is 3 or more and 1000 or less to 1, i.e. (3 to 1000):1.
摘要翻译：蓄电装置技术领域本发明涉及一种蓄电装置，其特征在于，具备：具有正极集电体的正极，在所述正极集电体上具有多个第一突起的正极活性物质，所述多个第一突起中的每一个; 具有负极集电体的负极，在负极集电体的表面上具有多个第二突起的负极活性物质，以及在所述多个第二突起中的每一个的端部上的第二绝缘体; 正极和负极之间的隔膜; 以及设置在正极和负极之间的空间中并含有载流子离子的电解质。在每个第一突起和第二突起中，高度与宽度之比为3以上且1000以下至1，即（3〜1000）：1。

68. 发明申请

US20090033350A1 Element Substrate, Inspecting Method, and Manufacturing Method of Semiconductor Device 有权
标题翻译：元件基板，检测方法和半导体器件的制造方法
公开(公告)号：US20090033350A1
公开(公告)日：2009-02-05
申请号：US11817435
申请日：2006-03-02
申请人： Kiyoshi Kato , Konami Izumi , Masahiko Hayakawa , Koichiro Kamata
发明人： Kiyoshi Kato , Konami Izumi , Masahiko Hayakawa , Koichiro Kamata
IPC分类号： G01R31/02 , H01L21/66
CPC分类号： G01R31/2822 , G01R31/2886 , G01R31/3025 , H01L27/13
摘要： A substrate including a semiconductor layer, where characteristics of an element can be evaluated with high reliability, and an evaluating method thereof are provided. A substrate including a semiconductor layer of the invention has a closed-loop circuit in which an antenna coil and a semiconductor element are connected in series, and a surface of an area over which the circuit is formed is covered with an insulating film. By using such a circuit, a contactless inspection can be carried out. Further, a ring oscillator can be substituted for the closed-loop circuit.
摘要翻译：提供了包括可以以高可靠性评估元件的特性的半导体层的基板及其评价方法。包括本发明的半导体层的衬底具有一个闭环电路，其中天线线圈和半导体元件串联连接，并且形成有电路的区域的表面被绝缘膜覆盖。通过使用这样的电路，可以进行非接触检查。此外，环形振荡器可以代替闭环电路。

69. 发明申请

US20060267769A1 Terminal device and communication system 审中-公开
标题翻译：终端设备和通信系统
公开(公告)号：US20060267769A1
公开(公告)日：2006-11-30
申请号：US11432348
申请日：2006-05-12
申请人： Masafumi Ito , Konami Izumi
发明人： Masafumi Ito , Konami Izumi
IPC分类号： G08B13/14
CPC分类号： G08B3/1008
摘要： One of the objects of the present invention is to provide a communication system in which a user in a specific area can obtain information immediately without operating a device. The communication system has an RFID card, a reader/writer for communication, a host computer, and an information communication means. The RFID card transmits and receives information wirelessly to and from the reader/writer for communication. Thus a user can carry the RFID card freely. The memory portion in the RFID card has a rewritable memory portion and a non-writable memory portion. Electric power required for operation of the RFID card is supplied wirelessly, which contributes to reduction is size and weight of the RFID card. By providing a display portion in the RFID card, information transmitted wirelessly can be displayed on the display portion and the user can recognize information immediately.
摘要翻译：本发明的目的之一是提供一种通信系统，其中特定区域中的用户可以在不操作设备的情况下立即获得信息。通信系统具有RFID卡，用于通信的读写器，主计算机和信息通信装置。 RFID卡以无线方式从读取器/写入器发送和接收信息以进行通信。因此，用户可以自由地携带RFID卡。 RFID卡中的存储器部分具有可重写存储器部分和不可写入存储器部分。无线地提供操作RFID卡所需的电力，这有助于减小RFID卡的尺寸和重量。通过在RFID卡中提供显示部分，可以在显示部分上显示无线传输的信息，用户可以立即识别信息。

70. 发明授权

US08435870B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08435870B2
公开(公告)日：2013-05-07
申请号：US12767108
申请日：2010-04-26
申请人： Mayumi Mikami , Konami Izumi
发明人： Mayumi Mikami , Konami Izumi
IPC分类号： H01L21/768 , H01L21/20
CPC分类号： H01L27/1266 , H01L21/76814 , H01L25/0657 , H01L27/124 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/00
摘要： A method for manufacturing a semiconductor device includes: forming a first and second layers not firmly adhering to each other over a substrate; forming a first semiconductor element layer and a first insulating layer over the second layer; forming a hole reaching the first layer in the first insulating layer; oxidizing the first layer exposed at a bottom of the hole; forming a wiring electrically connected to the first semiconductor element layer over the first insulating layer and in the hole; and separating the first layer and the substrate from the second layer and the first semiconductor element layer and expose the wiring. Further, another method includes providing an anisotropic conductive adhesive between a second semiconductor element layer separated through a manufacturing process similar to the above and the wiring, whereby the first and second semiconductor element layers are electrically connected through the anisotropic conductive adhesive and the wiring.
摘要翻译：一种制造半导体器件的方法包括：在衬底上形成彼此不牢固地粘合的第一和第二层; 在所述第二层上形成第一半导体元件层和第一绝缘层; 在所述第一绝缘层中形成到达所述第一层的孔; 氧化暴露在孔底部的第一层; 在所述第一绝缘层和所述孔中形成与所述第一半导体元件层电连接的布线; 以及将所述第一层和所述衬底与所述第二层和所述第一半导体元件层分离并使所述布线露出。此外，另一方法包括在通过类似于上述制造工艺分离的第二半导体元件层和布线之间提供各向异性导电粘合剂，由此第一和第二半导体元件层通过各向异性导电粘合剂和布线电连接。

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