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    • 63. 发明授权
    • Method and apparatus for detecting end point
    • 检测终点的方法和装置
    • US07377992B2
    • 2008-05-27
    • US11340540
    • 2006-01-27
    • Takeshi YamashitaTakao Yamaguchi
    • Takeshi YamashitaTakao Yamaguchi
    • C23F1/00
    • G03F7/70608H01J37/32935
    • A mask layer and a to-be-processed layer are irradiated with light to measure interference light formed of reflected lights from the mask layer and reflected lights from the to-be-processed layer. Thereafter, an interference component brought by the mask layer is removed from the waveform of the measured interference light, thereby calculating the waveform of the interference light brought by the to-be-processed layer. The thickness of the remaining to-be-processed layer is determined on the basis of the calculated waveform of the interference light and the thickness of the remaining to-be-processed layer is compared with a desired thickness thereof. In this way, an end point of processing on the to-be-processed layer is detected.
    • 用光照射掩模层和待处理层,以测量由掩模层反射的光和来自待处理层的反射光形成的干涉光。 然后,从测定的干涉光的波形中除去由掩模层带来的干涉成分,计算被处理层带来的干涉光的波形。 基于干涉光的计算波形确定剩余待处理层的厚度,并将剩余待处理层的厚度与其期望厚度进行比较。 以这种方式,检测待处理层的处理终点。
    • 64. 发明申请
    • Friction testing apparatus and friction testing method
    • 摩擦试验装置和摩擦试验方法
    • US20070169539A1
    • 2007-07-26
    • US11569344
    • 2005-05-17
    • Yusaku FujiiTakao Yamaguchi
    • Yusaku FujiiTakao Yamaguchi
    • G01N21/84G01L5/00G01L1/24G01N19/02
    • G01N19/02
    • In a friction testing apparatus and method for accurately detecting a physical quantity relating to a friction such as a friction force or the like indicating a friction characteristic between objects to be measured in a dynamic states a first object (21) to be measured is mounted to a movable portion (10C) provided so as to be movable along a guide portion (10B), a second object (22) to be measured is pressed against the first object (21) to be measured mounted to the movable portion (10C), an object, in which the first object to be measured and the movable portion are integrated with each other, is moved in a state in which the second object to be measured is pressed against the first object to be measured, and an inertia force of the object at a time of moving the object is detected as a friction force acting between the first object to be measured and the second object to be measured.
    • 在用于精确地检测与在动态状态下表示被测量物体之间的摩擦特性的摩擦力等摩擦力相关的物理量的摩擦试验装置和方法中,将要测量的第一物体(21)安装到 设置成能够沿着引导部分(10B)移动的可动部分(10C),待测量的第二物体(22)被压靠在被安装到可动部分(10)上的待测量的第一物体 其中第一被测量物体和可动部分彼此一体化的物体在被测量的第二物体压靠在第一待测物体上的状态下移动,并且惯性 检测到物体在移动物体时的力作为在待测量的第一被测物体和第二待测物体之间的摩擦力。
    • 68. 发明授权
    • Edge-holding aligner
    • 边缘固定对准器
    • US07019817B2
    • 2006-03-28
    • US10884989
    • 2004-07-07
    • Yasuhiko HashimotoYasuo HirookaTakao YamaguchiHiroshi Kanda
    • Yasuhiko HashimotoYasuo HirookaTakao YamaguchiHiroshi Kanda
    • G03B27/58G03B27/62
    • G03B27/58
    • The angular position of a notch (17) is determined on the basis of data provided by second notch detectors (24a) and (24b) and an encoder (25). A controller (38) turns a rotational arm (22) for angular displacement such that holders (26) and (27) are displaced in a circumferential direction B from the notch (17), and then the holders (26) and (27) hold a wafer (19). Since the holders (26) and (27) are in touch with edges in which the notch (17) is not formed, the first notch detector (23) is able to detect the notch (17) without difficulty. Thus the position of the wafer (19) relative to the rotational arm (22) does not need to be changed several times depending on positions at which the holders (26) and (27) hold the wafer (19), which is necessary in the prior technology. The aligner (20) touches parts, not including the notch (17), of the wafer (19) and is capable of adjusting the position of the wafer (19) in a short time.
    • 基于由第二陷波检测器(24a)和(24b)和编码器(25)提供的数据确定凹口(17)的角位置。 控制器(38)转动用于角位移的旋转臂(22),使得保持器(26)和(27)从凹口(17)沿圆周方向B移位,然后保持器(26)和(27) 握住晶片(19)。 由于保持器(26)和(27)与未形成切口(17)的边缘接触,所以第一切口检测器(23)能够毫无困难地检测凹口(17)。 因此,根据保持器(26)和(27)保持晶片(19)的位置,晶片(19)相对于旋转臂(22)的位置不需要改变几次,这是在 先前的技术。 对准器(20)接触不包括晶片(19)的凹口(17)的部分,并且能够在短时间内调节晶片(19)的位置。