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    • 64. 发明授权
    • Power semiconductor device
    • 功率半导体器件
    • US5714775A
    • 1998-02-03
    • US633688
    • 1996-04-19
    • Tomoki InoueIchiro OmuraHiromichi Ohashi
    • Tomoki InoueIchiro OmuraHiromichi Ohashi
    • H01L29/06H01L29/10H01L29/32H01L29/739H01L29/74H01L31/111
    • H01L29/7397H01L29/0696H01L29/1095H01L29/32
    • A p-type emitter layer having a low resistivity is arranged on a bottom surface of an n-type base layer having a high resistivity. A p-type base layer is formed in a top surface of the n-type base layer. Trenches are formed in the p-type base layer and the n-type base layer such that each trench penetrates the p-type base layer and reaches down to a halfway depth in the n-type base layer. Inter-trench regions made of semiconductor are defined between the trenches. An n-type emitter layer having a low resistivity is formed in a surface of the p-type base layer to be in contact with the upper part of each trench. A gate electrode is buried via a gate insulating film in each trench. That side surface of each inter-trench region which faces the gate electrode consists of a {100} plane.
    • 具有低电阻率的p型发射极层布置在具有高电阻率的n型基极层的底表面上。 p型基底层形成在n型基底层的顶表面上。 在p型基底层和n型基底层中形成沟槽,使得每个沟槽穿过p型基底层并在n型基底层中下降到中间深度。 在沟槽之间限定由半导体制成的沟槽间区域。 在p型基底层的表面上形成具有低电阻率的n型发射极层,以与每个沟槽的上部接触。 每个沟槽中的栅极绝缘膜埋入栅电极。 面对栅电极的每个沟槽间区域的侧表面由{100}平面组成。
    • 68. 发明授权
    • ESD protection device
    • ESD保护装置
    • US07750439B2
    • 2010-07-06
    • US11563848
    • 2006-11-28
    • Tomoki Inoue
    • Tomoki Inoue
    • H01L23/62
    • H01L27/0255
    • An ESD protection device includes: a semiconductor substrate of a first conductivity type having a first major surface and a second major surface; a signal input electrode formed on the first major surface of the semiconductor substrate; a base region of a second conductivity type formed on a surface region of the second major surface of the semiconductor substrate; a diffusion region of the first conductivity type; a resistor layer formed on the second major surface of the semiconductor substrate of the first conductivity type; a signal output electrode electrically connected to the diffusion region of the first conductivity type; and a ground electrode electrically connected to the resistor layer. The diffusion region is selectively formed on a surface region of the base region of the second conductivity type in the semiconductor substrate of the first conductivity type. The resistor layer is electrically connected to the diffusion region of the first conductivity type.
    • ESD保护装置包括:具有第一主表面和第二主表面的第一导电类型的半导体衬底; 形成在所述半导体衬底的所述第一主表面上的信号输入电极; 形成在所述半导体衬底的所述第二主表面的表面区域上的第二导电类型的基极区域; 第一导电类型的扩散区; 形成在第一导电类型的半导体衬底的第二主表面上的电阻层; 电连接到第一导电类型的扩散区的信号输出电极; 以及电连接到电阻层的接地电极。 扩散区选择性地形成在第一导电类型的半导体衬底中的第二导电类型的基极区域的表面区域上。 电阻层电连接到第一导电类型的扩散区域。
    • 70. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20080173894A1
    • 2008-07-24
    • US12014449
    • 2008-01-15
    • Tomoki Inoue
    • Tomoki Inoue
    • H01L29/74
    • H01L29/87H01L27/0262
    • A semiconductor substrate has a second conductivity type cathode layer formed thereon. The cathode layer has a first conductivity type base layer formed thereon. A first anode region of the second conductivity type is formed in the surface of the base layer. A second anode region of the first conductivity type is formed in the first anode region. A first semiconductor region of the first conductivity type is formed in contact with the semiconductor substrate. A second semiconductor region of the second conductivity type is formed adjacent to the first semiconductor region and in contact with the cathode layer. An intermediate electrode is formed on the surfaces of the first semiconductor region and the contact region.
    • 半导体衬底具有形成在其上的第二导电类型的阴极层。 阴极层具有在其上形成的第一导电型基底层。 第二导电类型的第一阳极区域形成在基层的表面中。 第一导电类型的第二阳极区域形成在第一阳极区域中。 第一导电类型的第一半导体区域形成为与半导体衬底接触。 第二导电类型的第二半导体区域形成为与第一半导体区域相邻并与阴极层接触。 在第一半导体区域和接触区域的表面上形成中间电极。