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    • 61. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08263452B2
    • 2012-09-11
    • US12554339
    • 2009-09-04
    • Reika IchiharaYoshinori TsuchiyaHiroki TanakaMasato Koyama
    • Reika IchiharaYoshinori TsuchiyaHiroki TanakaMasato Koyama
    • H01L21/8238H01L21/302H01L29/76
    • H01L21/823842H01L21/823864
    • A semiconductor device has an n-channel MIS transistor and a p-channel MIS transistor on a substrate. The n-channel MIS transistor includes a p-type semiconductor region formed on the substrate, a lower layer gate electrode which is formed via a gate insulating film above the p-type semiconductor region and which is one monolayer or more and 3 nm or less in thickness, and an upper layer gate electrode which is formed on the lower layer gate electrode, whose average electronegativity is 0.1 or more smaller than the average electronegativity of the lower layer gate electrode. The p-channel MIS transistor includes an n-type semiconductor region formed on the substrate and a gate electrode which is formed via a gate insulating film above the n-type semiconductor region and is made of the same metal material as that of the upper layer gate electrode.
    • 半导体器件在衬底上具有n沟道MIS晶体管和p沟道MIS晶体管。 n沟道MIS晶体管包括形成在基板上的p型半导体区域,通过p型半导体区域上方的栅极绝缘膜形成并且为单层以上且3nm以下的下层栅电极 以及形成在下层栅电极上的上层栅电极,其平均电负性比下层栅电极的平均电负性小0.1或更小。 p沟道MIS晶体管包括形成在衬底上的n型半导体区域和通过n型半导体区域上方的栅极绝缘膜形成并由与上层相同的金属材料制成的栅电极 栅电极。
    • 62. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US08169040B2
    • 2012-05-01
    • US12824266
    • 2010-06-28
    • Yoshinori TsuchiyaMasato KoyamaMasahiko Yoshiki
    • Yoshinori TsuchiyaMasato KoyamaMasahiko Yoshiki
    • H01L21/70
    • H01L21/823842H01L21/28079H01L21/28097H01L21/823835H01L21/823857H01L27/092H01L29/495H01L29/4975H01L29/517H01L29/665
    • A semiconductor device includes: an n-channel MIS transistor and a p-channel MIS transistor. An n-channel MIS transistor includes: a first gate insulating film having an amorphous layer or an epitaxial layer formed on a p-type semiconductor region between a first source/drain regions; and a first gate electrode having a stack structure formed with a first metal layer and a first compound layer. The first metal layer is formed on the first gate insulating film and made of a first metal having a work function of 4.3 eV or smaller, and the first compound layer is formed on the first metal layer and contains a compound of a second metal and a IV-group semiconductor. The second metal is different from the first metal. A p-channel MIS transistor includes a second gate electrode having a second compound layer containing a compound of the same composition as the first compound layer.
    • 半导体器件包括:n沟道MIS晶体管和p沟道MIS晶体管。 n沟道MIS晶体管包括:具有在第一源极/漏极区之间的p型半导体区域上形成的非晶层或外延层的第一栅极绝缘膜; 以及具有形成有第一金属层和第一化合物层的堆叠结构的第一栅电极。 第一金属层形成在第一栅极绝缘膜上,由功函数为4.3eV以下的第一金属构成,第一金属层形成在第一金属层上,并且含有第二金属和 IV族半导体。 第二种金属与第一种金属不同。 P沟道MIS晶体管包括具有第二化合物层的第二栅电极,第二化合物层含有与第一化合物层相同组成的化合物。
    • 64. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US08129792B2
    • 2012-03-06
    • US12233055
    • 2008-09-18
    • Reika IchiharaYoshinori TsuchiyaHiroki TanakaMasahiko YoshikiMasato Koyama
    • Reika IchiharaYoshinori TsuchiyaHiroki TanakaMasahiko YoshikiMasato Koyama
    • H01L27/092H01L21/8238
    • H01L21/823835H01L21/823842
    • A semiconductor device includes n- and p-type semiconductor regions separately formed on a substrate, an interlayer insulator formed on the substrate and having first and second trenches formed to reach the n- and p-type regions. There are further included first and second gate insulators formed inside of the first and second trenches, a first metal layer formed inside of the first trench via the first gate insulator, a second metal layer formed in a thickness of 1 monolayer or more and 1.5 nm or less inside of the second trench via the second gate insulator, a third metal layer formed on the second metal layer and containing at least one of a simple substance, a nitride, a carbide and an oxide of at least one metal element of alkaline earth metal elements and group III elements, first and second source/drain regions formed on the n- and p-type regions.
    • 半导体器件包括分别形成在衬底上的n型和p型半导体区,形成在衬底上的层间绝缘体,并且具有形成为达到n型和p型区的第一和第二沟槽。 还包括形成在第一和第二沟槽内的第一和第二栅极绝缘体,经由第一栅极绝缘体形成在第一沟槽内部的第一金属层,形成为厚度为1单层或更多和1.5nm的第二金属层 或更少的内部经由所述第二栅极绝缘体,形成在所述第二金属层上并且包含至少一种碱土金属元素的单质,氮化物,碳化物和氧化物中的至少一种的第三金属层 金属元素和III族元素,形成在n型和p型区上的第一和第二源/漏区。
    • 65. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20120049289A1
    • 2012-03-01
    • US13290552
    • 2011-11-07
    • Reika ICHIHARAMasato Koyama
    • Reika ICHIHARAMasato Koyama
    • H01L27/092
    • H01L27/092H01L21/823842H01L29/4966H01L29/518H01L29/6659
    • A semiconductor device includes pMISFET and nMIS formed on the semiconductor substrate. The pMISFET includes, on the semiconductor substrate, first source/drain regions, a first gate dielectric formed therebetween, first lower and upper metal layers stacked on the first gate dielectric, a first upper metal layer containing at least one metallic element belonging to groups IIA and IIIA. The nMISFET includes, on the semiconductor substrate, second source/drain regions, second gate dielectric formed therebetween, a second lower and upper metal layers stacked on the second gate dielectric and the second upper metal layer substantially having the same composition as the first upper metal layer. The first lower metal layer is thicker than the second lower metal layer, and the atomic density of the metallic element contained in the first gate dielectric is lower than the atomic density of the metallic element contained in the second gate dielectric.
    • 半导体器件包括在半导体衬底上形成的pMISFET和nMIS。 pMISFET在半导体衬底上包括第一源极/漏极区域,在其间形成的第一栅极电介质,堆叠在第一栅极电介质上的第一下部和上部金属层,包含至少一个属于IIA族金属元素的第一上部金属层 和IIIA。 nMISFET在半导体衬底上包括第二源极/漏极区域,在其间形成的第二栅极电介质,堆叠在第二栅极电介质上的第二下部和上部金属层,以及基本上具有与第一上部金属相同的组成的第二上部金属层 层。 第一下金属层比第二下金属层厚,并且包含在第一栅极电介质中的金属元素的原子密度低于包含在第二栅极电介质中的金属元素的原子密度。