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    • 61. 发明申请
    • Navigating Analytical Tools Using Layout Software
    • 使用布局软件导航分析工具
    • US20130061199A1
    • 2013-03-07
    • US13611776
    • 2012-09-12
    • Franco StellariPeilin Song
    • Franco StellariPeilin Song
    • G06F17/50
    • G06F17/5081G06F17/5022G06F17/5036
    • A background process installs a system hook for message interception of integrated circuit chip layout display software. A call message is intercepted through the system hook, and current layout coordinates are read from the integrated circuit chip layout display software. A representation of the current layout coordinates is entered into tool control software configured to control a physical tool for analyzing integrated circuits, and the physical tool is controlled with the tool control software. In an “inverse” approach, a background process is used to install at least one system hook for message interception of tool control software configured to control a physical tool for analyzing integrated circuits, and a call message is intercepted through the system hook. Current coordinates are read from the tool control software. A representation of the current coordinates is entered into integrated circuit chip layout display software, and at least a portion of an integrated circuit layout is displayed.
    • 背景过程安装了用于消息拦截集成电路芯片布局显示软件的系统挂钩。 通过系统挂钩截取通话消息,从集成电路芯片布局显示软件中读取当前布局坐标。 将当前布局坐标的表示输入到被配置为控制用于分析集成电路的物理工具的工具控制软件中,并且物理工具由工具控制软件控制。 在逆向方法中,使用后台处理来安装至少一个用于消息拦截的系统钩子,用于控制用于分析集成电路的物理工具的工具控制软件,并且通过系统钩子拦截呼叫消息。 从刀具控制软件读取当前坐标。 将当前坐标的表示输入到集成电路芯片布局显示软件中,并且显示集成电路布局的至少一部分。
    • 62. 发明授权
    • Navigating analytical tools using layout software
    • 使用布局软件浏览分析工具
    • US08312413B2
    • 2012-11-13
    • US12692198
    • 2010-01-22
    • Franco StellariPeilin Song
    • Franco StellariPeilin Song
    • G06F17/50G06F9/44
    • G06F17/5081G06F17/5022G06F17/5036
    • A background process is used to install at least one system hook for message interception of integrated circuit chip layout display software. A call message is intercepted through the system hook, and, responsive to the call message, current layout coordinates are read from the integrated circuit chip layout display software. A representation of the current layout coordinates is entered into tool control software configured to control a physical tool for analyzing integrated circuits, and the physical tool is controlled with the tool control software, based on the representation of the current layout coordinates. In an “inverse” approach, a background process is used to install at least one system hook for message interception of tool control software configured to control a physical tool for analyzing integrated circuits, and a call message is intercepted through the system hook. Responsive to the call message, current coordinates are read from the tool control software. A representation of the current coordinates is entered into integrated circuit chip layout display software, and at least a portion of an integrated circuit layout, corresponding to the representation of the current coordinates from the tool control software, is displayed.
    • 后台进程用于安装至少一个系统挂钩,用于消息拦截集成电路芯片布局显示软件。 通过系统挂钩拦截呼叫消息,并响应于呼叫消息,从集成电路芯片布局显示软件读取当前布局坐标。 将当前布局坐标的表示输入到被配置为控制用于分析集成电路的物理工具的工具控制软件中,并且基于当前布局坐标的表示,通过工具控制软件来控制物理工具。 在逆向方法中,使用后台处理来安装至少一个用于消息拦截的系统钩子,用于控制用于分析集成电路的物理工具的工具控制软件,并且通过系统钩子拦截呼叫消息。 响应于通话消息,从工具控制软件读取当前坐标。 将当前坐标的表示输入到集成电路芯片布局显示软件中,并且显示对应于来自刀具控制软件的当前坐标的表示的集成电路布局的至少一部分。
    • 63. 发明授权
    • Constructing variability maps by correlating off-state leakage emission images to layout information
    • 通过将非状态泄漏图像与布局信息相关联来构建变异性图
    • US08131056B2
    • 2012-03-06
    • US12241926
    • 2008-09-30
    • Stanislav PolonskyPeilin SongFranco StellariAlan J. Weger
    • Stanislav PolonskyPeilin SongFranco StellariAlan J. Weger
    • G06K9/00
    • G06T7/001G06T2207/30148
    • Improved techniques are disclosed for monitoring or sensing process variations in integrated circuit designs. Such techniques provide such improvements by constructing variability maps correlating leakage emission images to layout information. By way of example, a method for monitoring one or more manufacturing process variations associated with a device under test (e.g., integrated circuit) comprises the following steps. An emission image representing an energy emission associated with a leakage current of the device under test is obtained. The emission image is correlated with a layout of the device under test to form a cross emission image. Common structures on the cross emission image are selected and identified as regions of interest. One or more variability measures (e.g., figures of merit) are calculated based on the energy emissions associated with the regions of interest. A variability map is created based on the calculated variability measures, wherein the variability map is useable to monitor the one or more manufacturing process variations associated with the device under test.
    • 公开了用于监测或感测集成电路设计中的工艺变化的改进的技术。 这样的技术通过构建将泄漏发射图像与布局信息相关联的可变性图来提供这样的改进。 作为示例,用于监测与被测器件(例如,集成电路)相关联的一个或多个制造工艺变化的方法包括以下步骤。 获得表示与被测设备的泄漏电流相关联的能量发射的发射图像。 发射图像与待测器件的布局相关,以形成交叉发射图像。 选择交叉发射图像上的共同结构并将其识别为感兴趣的区域。 基于与感兴趣区域相关联的能量排放来计算一个或多个可变性度量(例如,品质因素)。 基于所计算的变异性度量创建变异性图,其中可变性图可用于监测与被测设备相关联的一个或多个制造过程变化。
    • 68. 发明申请
    • CREATING EMISSION IMAGES OF INTEGRATED CIRCUITS
    • 创建集成电路的排放图像
    • US20100329586A1
    • 2010-12-30
    • US12493686
    • 2009-06-29
    • Franco StellariPeilin Song
    • Franco StellariPeilin Song
    • G06K9/36
    • H04N5/33G01R31/303G06T7/32G06T2200/32G06T2207/10056G06T2207/30148H04N5/2259H04N5/2621H04N5/2625H04N5/2628H04N5/332
    • A method, system and computer program product are disclosed for creating an image from a device. In one embodiment, the method comprises acquiring first and second images from the device, said first and second images having overlapping portions, and estimating said overlapping portions to obtain an approximate shift amount to align approximately said first and second images. This method further comprises analyzing the overlapping portions, using a defined cross-correlation algorithm, to calculate a precise shift amount to align the first and second images; and using said precise shift amount to join the first and second images together. In one embodiment, an optical system is used to acquire the images, a stage is used to move either the device or the optical system to acquire the first and second images, and the estimating includes using movement of the stage to estimate the overlapping areas.
    • 公开了用于从设备创建图像的方法,系统和计算机程序产品。 在一个实施例中,该方法包括从设备获取第一和第二图像,所述第一和第二图像具有重叠部分,并且估计所述重叠部分以获得近似偏移量以对准所述第一和第二图像。 该方法还包括使用定义的互相关算法来分析重叠部分以计算精确偏移量以对齐第一和第二图像; 并且使用所述精确位移量将第一和第二图像连接在一起。 在一个实施例中,使用光学系统来获取图像,阶段用于移动设备或光学系统以获取第一和第二图像,并且估计包括使用平台的运动来估计重叠区域。
    • 69. 发明授权
    • Angular spectrum tailoring in solid immersion microscopy for circuit analysis
    • 用于电路分析的固体浸液显微镜中的角度光谱裁剪
    • US07826045B2
    • 2010-11-02
    • US12020157
    • 2008-01-25
    • Stephen Bradley IppolitoDarrell L. MilesPeilin SongJohn D. Sylvestri
    • Stephen Bradley IppolitoDarrell L. MilesPeilin SongJohn D. Sylvestri
    • G01N21/00
    • G01R31/311
    • A method and structure for locating a fault in a semiconductor chip. The chip includes a substrate on a dielectric interconnect. A first electrical response image of the chip, which includes a spot representing the fault, is overlayed on a first reflection image for monochromatic light in an optical path from an optical microscope through a SIL/NAIL and into the chip. The index of refraction of the substrate exceeds that of the dielectric interconnect and is equal to that of the SIL/NAIL. A second electrical response image of the chip is overlayed on a second reflection image for the monochromatic light in an optical path in which an optical stop prevents all subcritical angular components of the monochromatic light from being incident on the SIL/NAIL. If the second electrical response image includes or does not include the spot, then the fault is in the substrate or the dielectric interconnect, respectively.
    • 一种用于定位半导体芯片中的故障的方法和结构。 芯片包括电介质互连上的衬底。 包括代表故障的点的芯片的第一电响应图像重叠在从光学显微镜通过SIL / NAIL并进入芯片的光路中的单色光的第一反射图像上。 衬底的折射率超过电介质互连的折射率,等于SIL / NAIL的折射率。 芯片的第二电响应图像覆盖在光路中的单色光的第二反射图像上,其中光学停止器防止单色光的所有亚临界角分量入射到SIL / NAIL上。 如果第二电响应图像包括或不包括点,则故障分别在基板或电介质互连中。