专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明授权

US06841628B2 Resin composition, adhesives prepared therewith for bonding circuit members, and circuit boards 有权
标题翻译：树脂组合物，用于粘合电路构件的粘合剂和电路板
公开(公告)号：US06841628B2
公开(公告)日：2005-01-11
申请号：US10203408
申请日：2001-02-09
申请人： Satoru Oota , Masami Yusa , Akira Nagai
发明人： Satoru Oota , Masami Yusa , Akira Nagai
IPC分类号： C08F283/06 , C08L71/00 , C08L71/10 , C09J4/06 , C09J171/00 , H05K3/32 , H05K3/38 , H05K3/46 , C08L71/02
CPC分类号： C09J171/00 , C08F283/06 , C08G2650/56 , C08L63/00 , C08L71/00 , C08L2666/02 , C09J4/06 , H05K3/321 , H05K3/386 , H05K3/4626 , C08F222/1006
摘要： The present invention relates to a resin composition which gives a resin product with a low hygroscopic property, an adhesive for connecting a circuit member and a circuit board, and provides a resin composition, an adhesive for connecting a circuit member and a circuit board comprising (A) a polyhydroxy polyether resin represented by the formula (I): wherein R1 to R8 each represent H, C1-4 alkyl group, C2-5 alkenyl group, C1-4 hydroxyalkyl group or halogen atom; Ra represents H or C1-2 alkyl group; Rb represents C2-13 alkyl group; and n is a recurring number, or the following formula (II): wherein R9 to R12 each represent H, C1-6 alkyl group, C1-6 hydroxyalkyl group or halogen atom; Rc to Rf each represent H, C1-6 alkyl group, cyclohexyl group, aryl group, aralkyl group or halogen atom; and m is a recurring number, and (B) a three dimensionally cross-linkable resin.
摘要翻译：本发明涉及一种树脂组合物，其具有低吸湿性的树脂产品，用于连接电路部件和电路板的粘合剂，并提供树脂组合物，用于连接电路部件的粘合剂和电路板，其包括（ A）由式（I）表示的多羟基聚醚树脂：其中R 1至R 8各自表示H，C 1-4烷基，C 2-5烯基，C 1-4羟烷基或卤素原子; Ra表示H或C 1-2烷基; Rb表示C2-13烷基; n为重复数，或下式（II）：其中R 9至R 12各自表示H，C 1-6烷基，C 1-6羟基烷基或卤素原子; Rc至Rf各自表示H，C 1-6烷基，环己基，芳基，芳烷基或卤素原子; m为重复数，（B）为三维交联树脂。

62. 发明授权

US06791194B1 Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same 失效
标题翻译：具有粘合膜的电路带，半导体器件及其制造方法
公开(公告)号：US06791194B1
公开(公告)日：2004-09-14
申请号：US09493210
申请日：2000-01-28
申请人： Akira Nagai , Shuji Eguchi , Masahiko Ogino , Masanori Segawa , Toshiak Ishii , Nobutake Tsuyuno , Hiroyoshi Kokaku , Rie Hattori , Makoto Morishima , Ichiro Anjoh , Kunihiro Tsubosaki , Chuichi Miyazaki , Makoto Kitano , Mamoru Mita , Norio Okabe
发明人： Akira Nagai , Shuji Eguchi , Masahiko Ogino , Masanori Segawa , Toshiak Ishii , Nobutake Tsuyuno , Hiroyoshi Kokaku , Rie Hattori , Makoto Morishima , Ichiro Anjoh , Kunihiro Tsubosaki , Chuichi Miyazaki , Makoto Kitano , Mamoru Mita , Norio Okabe
IPC分类号： H01L2348
CPC分类号： H01L24/50 , H01L23/3107 , H01L23/4951 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10329 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/30107 , H01L2924/351 , H01L2924/00
摘要： A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200-250° C.).
摘要翻译：通过在半导体封装结构中设置用于吸收安装基板和半导体元件之间的热膨胀差的缓冲体，即使使用有机材料来安装基板，也可获得具有优异的连接可靠性的半导体器件。使用薄膜材料作为用于缓冲由安装基板和半导体元件之间的热膨胀差异产生的热应力的本体。膜材料在回流温度范围（200-250℃）中的弹性模量至少为1MPa。

63. 发明授权

US06639323B2 Semiconductor device and its manufacturing method 有权
公开(公告)号：US06639323B2
公开(公告)日：2003-10-28
申请号：US09983286
申请日：2001-10-23
申请人： Yukiharu Akiyama , Tomoaki Kudaishi , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Asao Nishimura , Ichiro Anjo , Kunihiro Tsubosaki , Chuichi Miyazaki , Hiroshi Koyama , Masanori Shibamoto , Akira Nagai , Masahiko Ogino
发明人： Yukiharu Akiyama , Tomoaki Kudaishi , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Asao Nishimura , Ichiro Anjo , Kunihiro Tsubosaki , Chuichi Miyazaki , Hiroshi Koyama , Masanori Shibamoto , Akira Nagai , Masahiko Ogino
IPC分类号： H01L2348
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/49572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/1433 , H01L2924/3025
摘要： A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elastic body and having openings in areas where the connection terminals are situated; plural leads formed on the top surface of the insulating tape, one end of each lead being connected to one of the connection terminals and the other end being disposed on the elastic body; plural bump electrodes formed on the other ends of the plural leads; and a resin body for sealing the connection terminals and one end of each of the leads, wherein the insulating tape protrudes beyond the chip where the plural connection terminals are arranged, and wherein the shape of the resin body is restricted by the protruding part of the insulating tape.

64. 发明授权

US06627997B1 Semiconductor module and method of mounting 失效
标题翻译：半导体模块及其安装方法
公开(公告)号：US06627997B1
公开(公告)日：2003-09-30
申请号：US09463431
申请日：2000-01-27
申请人： Shuji Eguchi , Akira Nagai , Haruo Akahoshi , Takumi Ueno , Toshiya Satoh , Masahiko Ogino , Asao Nishimura , Ichiro Anjo , Hideki Tanaka
发明人： Shuji Eguchi , Akira Nagai , Haruo Akahoshi , Takumi Ueno , Toshiya Satoh , Masahiko Ogino , Asao Nishimura , Ichiro Anjo , Hideki Tanaka
IPC分类号： H01L2348
CPC分类号： H01L24/97 , H01L21/561 , H01L21/565 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L2224/16225 , H01L2224/32014 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73253 , H01L2224/73265 , H01L2224/81191 , H01L2224/81815 , H01L2224/97 , H01L2225/1005 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/07802 , H01L2924/15787 , H01L2924/181 , H01L2924/3511 , H01L2224/85 , H01L2224/81 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： In a multi-chip module, a plurality of semiconductor chips are mounted on a single wiring board. Upper surfaces of the semiconductor chips are covered with a single heat spread plate, and the whole space around the semiconductor chips, sandwiched between the wiring board and the heat spread plate, is filled with resin. The semiconductor chips are interconnected through the resin so that any stress exerted on any chips is dispersed. This diminishes the occurrence of cracks caused by stress concentration. Since the semiconductor chips and the heat spread plate are bonded together with resin, even if there are variations in size of the chips, both can be bonded easily. Further, the bonding of all the chips and the heat spread plate can be done in a single process.
摘要翻译：在多芯片模块中，多个半导体芯片安装在单个布线板上。半导体芯片的上表面被单个扩散板覆盖，并且夹在布线板和扩散板之间的半导体芯片周围的整个空间填充有树脂。半导体芯片通过树脂相互连接，从而分散施加在任何芯片上的任何应力。这减少了由应力集中引起的裂纹的发生。由于半导体芯片和热扩散板与树脂粘合在一起，即使芯片的尺寸有变化，两者也可以容易地结合。此外，所有芯片和散热板的接合可以在单个工艺中完成。

65. 发明授权

US06433440B1 Semiconductor device having a porous buffer layer for semiconductor device 失效
标题翻译：具有用于半导体器件的多孔缓冲层的半导体器件
公开(公告)号：US06433440B1
公开(公告)日：2002-08-13
申请号：US09092138
申请日：1998-06-05
申请人： Masahiko Ogino , Shuji Eguchi , Akira Nagai , Takumi Ueno , Masanori Segawa , Hiroyoshi Kokaku , Toshiaki Ishii , Ichiro Anjoh , Asao Nishimura , Chuichi Miyazaki , Mamoru Mita , Norio Okabe
发明人： Masahiko Ogino , Shuji Eguchi , Akira Nagai , Takumi Ueno , Masanori Segawa , Hiroyoshi Kokaku , Toshiaki Ishii , Ichiro Anjoh , Asao Nishimura , Chuichi Miyazaki , Mamoru Mita , Norio Okabe
IPC分类号： H01L2348
CPC分类号： H01L24/50 , H01L23/3107 , H01L23/49572 , H01L23/49816 , H01L24/32 , H01L2224/29111 , H01L2224/73215 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/10253 , H01L2924/15311 , H01L2924/1532 , H01L2924/30107 , H01L2924/351 , H01L2224/29099 , H01L2924/00
摘要： In a semiconductor device having a three-layered buffer layer comprising core layer 1 having interconnected foams such as a three-dimensional reticular structure and adhesive layers 2 provided on both sides of the core layer as a stress buffer layer between semiconductor chip 5 and wiring 4 to lessen a thermal stress generated between the semiconductor device and the package substrate, where a thickness ratio of core layer 1 to total buffer layer is at least 0.2, the production process can be simplified by using such a buffer layer, thereby improving the mass production capacity and enhancing the package reliability.
摘要翻译：在具有三层缓冲层的半导体器件中，作为在半导体芯片5和布线4之间的应力缓冲层，芯层1具有三维网状结构的互连泡沫的芯层1和设置在芯层两侧的粘合层2 为了降低半导体器件与封装衬底之间产生的热应力，其中芯层1与总缓冲层的厚度比至少为0.2，可以通过使用这种缓冲层来简化制造工艺，从而提高批量生产容量和提高包装可靠性。

66. 发明授权

US09431883B2 Method of manufacturing laminated core having permanent magnets sealed with resin 有权
标题翻译：制造具有用树脂密封的永磁体的层叠铁心的方法
公开(公告)号：US09431883B2
公开(公告)日：2016-08-30
申请号：US14123869
申请日：2012-05-07
申请人： Satoshi Matsubayashi , Akira Nagai , Go Kato
发明人： Satoshi Matsubayashi , Akira Nagai , Go Kato
IPC分类号： H02K15/02 , H02K15/00 , H02K15/03 , H02K1/27
CPC分类号： H02K15/0025 , H02K1/276 , H02K15/03 , Y10T29/49009
摘要： A method of manufacturing a laminated core, having a laminated core body 10a formed by laminating plural core sheets 11 and having magnet insertion holes 13, 14 with openings 17, 18 opening to a inner space 15 or an external side, inserting and resin-sealing permanent magnets 20, 21 in the magnet insertion holes 13, 14, with the openings 17, 18 blocked by a blocking member 23, the method including: temporarily connecting blocking member pieces 32 to be the blocking member 23 in each of the core sheets 11 and removing the blocking member 23 with the laminated core body 10a resin-sealed. By this, without a special blocking member, the permanent magnets 20, 21 are resin-sealed while the magnet insertion holes 13, 14, parts of which have the openings 17, 18, are blocked.
摘要翻译：一种层叠铁芯的制造方法，具有层叠铁芯体10a，其通过层叠多个铁芯片11而形成，并且具有通向具有向内部空间15或外侧开口的开口17,18的磁体插入孔13,14，插入和树脂封闭磁体插入孔13,14中的永磁体20,21，其中开口17,18被阻挡构件23阻挡，该方法包括：在每个芯片11中临时连接作为阻挡构件23的阻挡构件片32 并且用树脂密封的层叠芯体10a移除阻挡构件23。由此，没有特殊的阻挡构件，永磁体20,21被树脂密封，同时其一部分具有开口17,18的磁体插入孔13,14被阻挡。

67. 发明授权

US08916254B2 Method for manufacturing laminated core and laminated core 有权
标题翻译：层叠铁心和层压铁芯的制造方法
公开(公告)号：US08916254B2
公开(公告)日：2014-12-23
申请号：US13319890
申请日：2010-04-23
申请人： Akira Nagai , Jin Oda , Tatsuhiko Mizutani , Yosuke Kurono
发明人： Akira Nagai , Jin Oda , Tatsuhiko Mizutani , Yosuke Kurono
IPC分类号： B32B3/02 , H02K1/16 , H02K15/02
CPC分类号： H02K1/16 , H02K15/024 , Y10T428/21 , Y10T428/24802
摘要： A method for manufacturing a laminated core is provided that makes positions of boundary parts of laminated blocks and improves an efficiency of a welding operation of the blocks. The above-described object is achieved by the method of manufacturing the laminated core 10 including a process that forms a plurality of blocks 12 having a plurality of welding parts 13 to 15 of different forms or colors at intervals of prescribed angles in the circumferential direction, a process that laminates the plurality of blocks 12 under a state that the blocks are rotated at intervals of the prescribed angles and a process that welds the welding parts 13 to 15 having the different forms or colors of the laminated blocks 12 to form integrally the plurality of blocks 12.
摘要翻译：提供一种层叠铁芯的制造方法，其形成层叠块的边界部的位置，提高块的焊接效率。上述目的是通过制造叠层铁芯10的方法来实现的，该方法包括在圆周方向上以规定角度间隔形成具有不同形式或颜色的多个焊接部13至15的多个块12的工序，在块以规定角度的间隔旋转的状态下层叠多个块12的处理以及对具有不同形状或颜色的层叠块12的焊接部13〜15进行焊接的工序，以一体形成多个的块12。

68. 发明授权

US08273458B2 Adhesive for bonding circuit members, circuit board and process for its production 有权
标题翻译：用于粘合电路元件，电路板及其生产工艺的粘合剂
公开(公告)号：US08273458B2
公开(公告)日：2012-09-25
申请号：US13166591
申请日：2011-06-22
申请人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： B32B27/38
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
摘要翻译：一种用于将半导体芯片接合并固定到电路板并电连接两个电极的粘合剂，并且包含粘合剂树脂组合物和无机填料，其含量为10至200重量份，100重量份的100重量份粘合剂树脂组合物。

69. 发明申请

US20120222289A1 METHOD OF MANUFACTURING LAMINATED ROTOR CORE 有权
标题翻译：制造层压转子芯的方法
公开(公告)号：US20120222289A1
公开(公告)日：2012-09-06
申请号：US13509190
申请日：2011-04-01
申请人： Akira Nagai , Mei Arazoe , Go Kato
发明人： Akira Nagai , Mei Arazoe , Go Kato
IPC分类号： H02K15/02
CPC分类号： H02K15/03 , H02K1/276
摘要： A method of manufacturing a laminated rotor core, including inserting permanent magnets into magnet insertion portions of an iron core formed by laminating plural core sheets; and thereafter to fix the magnets, injecting resin into the magnet insertion portions from a resin reservoir part in a die holding the iron core; the method comprising: a first process of placing a segment dummy plate between the body and the die, the plate covering one or more of the plural magnet insertion portions individually and including a resin injection hole continuing thereto; a second process of injecting the resin from the resin reservoir part of the die through the resin injection hole of the plate to the corresponding magnet insertion portions; and a third process of detaching the dummy plate with excess resin after the resin injected to the magnet insertion portions is cured; and the method improving a resin sealing process.
摘要翻译：一种叠层转子铁心的制造方法，其特征在于，包括：将永久磁铁插入通过层叠多个芯片而形成的铁心的磁铁插入部; 然后固定磁体，将树脂从保持铁芯的模具中的树脂储存部分注入到磁体插入部分中; 该方法包括：将主体和模具之间的段虚拟板放置在一起的第一工序，所述板单独地覆盖所述多个磁体插入部中的一个或多个，并且包括与其连续的树脂注入孔; 将树脂从模具的树脂储存部分通过板的树脂注入孔注入到相应的磁体插入部分的第二工序; 以及在注入到磁体插入部分中的树脂被固化之后用过量树脂分离虚拟板的第三过程; 以及改善树脂密封工艺的方法。

70. 发明申请

US20120091846A1 ROTOR CORE 有权
标题翻译：转子芯
公开(公告)号：US20120091846A1
公开(公告)日：2012-04-19
申请号：US13377938
申请日：2010-04-28
申请人： Akira Nagai , Go Kato
发明人： Akira Nagai , Go Kato
IPC分类号： H02K1/27
CPC分类号： H02K1/2766 , H02K15/03
摘要： There is provided a rotor core which increases the quality and reliability thereof by preventing the occurrence of a core separation of the rotor core. There is provided a rotor core including a plurality of substantially cylindrical core blocks which are stacked on each other; and a plurality of magnets, characterized in that a plurality of magnet holes extending in an axial direction are provided in the plurality of core blocks so as to extend over the plurality of core blocks in that the plurality of magnets are accommodated in each of the plurality of magnet accommodation holes and fixed therein with a resin, and in that an axial position of core block boundary planes where the plurality of core blocks are brought into abutment with each other and an axial position of magnet boundary planes where the plurality of magnets are brought into abutment with each other differ from each other.
摘要翻译：提供了一种通过防止转子芯的芯分离的发生而提高其质量和可靠性的转子芯。提供了一种转子芯，其包括彼此堆叠的多个基本上圆柱形的核心块; 以及多个磁体，其特征在于，在所述多个芯体中设置有沿轴向延伸的多个磁体孔，以便在所述多个磁芯块中延伸，因为所述多个磁体容纳在所述多个磁芯中的磁体容纳孔并且用树脂固定，并且其中多个芯块彼此抵接的芯块边界面的轴向位置以及多个磁体被带入的磁体边界平面的轴向位置彼此抵接彼此不同。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式