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61. 发明申请

US20050196886A1 Process for the production of light-emitting diode light sources with a luminescence conversion element 有权
标题翻译：具有发光转换元件的发光二极管光源的制造方法
公开(公告)号：US20050196886A1
公开(公告)日：2005-09-08
申请号：US10735507
申请日：2003-12-11
申请人： Harald Jager , Herbert Brunner
发明人： Harald Jager , Herbert Brunner
IPC分类号： B29C45/14 , H01L33/52 , H01L21/00
CPC分类号： B29C45/14639 , B29L2011/00 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00014
摘要： A plurality of light-emitting diode light sources of the same kind are produced simultaneously. Each light source includes a light-emitting diode chip and a luminescence conversion element, which converts the wavelength of at least part of an electromagnetic radiation emitted by the light-emitting diode chip. In a first process, a layer composite with a light-emitting diode layer sequence applied to a carrier substrate is provided. The wafer is provided with trenches and then inserted into a cavity of a mold. A molding compound, which contains a luminescence conversion material, is driven in, so that the trenches are at least partly filled with the molding compound. The mold is then removed and the light-emitting diode light sources are separated from the layer composite. In a second process, instead of the layer composite, a plurality of light-emitting diode chips which are applied to a common carrier in a regular arrangement are provided.
摘要翻译：同时产生同一种类的多个发光二极管光源。每个光源包括发光二极管芯片和发光转换元件，其转换由发光二极管芯片发射的电磁辐射的至少一部分的波长。在第一种方法中，提供了一种施加到载体衬底的发光二极管层序列的层复合物。晶片设置有沟槽，然后插入模具的空腔中。包含发光转换材料的模塑料被驱入，使得沟槽至少部分地被模塑料填充。然后去除模具，并且发光二极管光源与层复合物分离。在第二过程中，提供以规则排列施加到公共载体的多个发光二极管芯片代替层复合物。

62. 发明授权

US5742098A Semiconductor component with plastic sheath and method for producing the same 失效
标题翻译：具有塑料护套的半导体元件及其制造方法
公开(公告)号：US5742098A
公开(公告)日：1998-04-21
申请号：US616319
申请日：1996-03-15
申请人： Herbert Brunner
发明人： Herbert Brunner
IPC分类号： H01L23/28 , H01L21/56 , H01L23/29 , H01L23/31 , H01L29/06 , H01L31/0236 , H01L33/22 , H01L33/52 , H01L23/04 , H01L33/00 , H05K5/00
CPC分类号： H01L33/52 , H01L23/3142 , H01L24/32 , H01L29/0657 , H01L31/0236 , H01L33/22 , H01L2224/05624 , H01L2224/29111 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48624 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01016 , H01L2924/01019 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/10156 , H01L2924/10157 , H01L2924/10329 , H01L2924/12041 , H01L2924/12043 , H01L2924/181 , H01L2924/18301 , Y02E10/50
摘要： A semiconductor component includes a semiconductor body. At least one contact metallizing covers at least one portion of a surface of the semiconductor body, defining at least one free portion of the surface not covered by the at least one contact metallizing. A plastic sheath adjoins the semiconductor body having the at least one contact metallizing. The at least one free portion of the surface has a roughening forming a microscopic toothing between the semiconductor body and the plastic sheath. A method for producing a semiconductor component includes producing a semiconductor body, contact metallizings on the semiconductor body, and a microscopic tooth structure on a surface of the semiconductor body. The semiconductor body with the contact metallizings and the microscopic tooth structure is mounted on a system substrate. At least one terminal lead is bonded to one of the contact metallizings and to terminal prongs of the system substrate. The semiconductor body, the contact metallizings, the at least one terminal lead, portions of the terminal prongs and at least portions of the system substrate are sheathed with plastic, while penetrating, filling and curing the plastic in the microscopic tooth structure.
摘要翻译：半导体部件包括半导体本体。至少一个接触金属化覆盖半导体主体的表面的至少一部分，限定未被至少一个接触金属化覆盖的表面的至少一个自由部分。塑料护套与具有至少一个接触金属化的半导体本体相邻。表面的至少一个自由部分具有在半导体本体和塑料护套之间形成微观齿的粗糙化。一种制造半导体部件的方法包括制造半导体本体，半导体本体上的接触镀层以及半导体本体表面上的微观齿结构。具有接触镀层和微观齿结构的半导体主体安装在系统基板上。至少一个端子引线接合到系统基板的接触镀层和端子尖端之一。半导体主体，接触镀层，至少一个端子引线，端子插脚的部分和系统基板的至少部分被塑料包覆，同时穿透，填充和固化微观齿结构中的塑料。

63. 发明授权

US4762690A Process for the separation of cations from aqueous solutions 失效
标题翻译：从水溶液中分离阳离子的方法
公开(公告)号：US4762690A
公开(公告)日：1988-08-09
申请号：US937164
申请日：1986-12-02
申请人： Herbert Brunner , Reinhard Ballhorn , Roland Schwab
发明人： Herbert Brunner , Reinhard Ballhorn , Roland Schwab
IPC分类号： B01J39/02 , A62D3/33 , A62D101/24 , A62D101/40 , A62D101/43 , B01J20/02 , C01B25/45 , C02F1/28 , G21F9/00 , G21F9/12 , A62D3/00
CPC分类号： A62D3/33 , B01J20/0207 , B01J20/0292 , B01J20/041 , B01J20/048 , B01J20/06 , C01B25/45 , C02F1/281 , G21F9/12 , A62D2101/24 , A62D2101/40 , A62D2101/43
摘要： Synthetic Crandallites of the general composition MeAl.sub.3 (PO.sub.4) (OH).sub.5.H.sub.2 O (Me=alkaline earth metal) are used for the separation of cations, especially alkaline earth metals, lanthanides and actinides, at a pH greater than 6 and temperature above 40.degree. C.
摘要翻译：通常组合物MeAl3（PO4）（OH）5.H2O（Me =碱土金属）的合成二硬脂酸盐用于分离阳离子，特别是碱土金属，镧系元素和锕系元素，pH大于6，温度高于40 DEG C.

64. 发明授权

US08853732B2 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US08853732B2
公开(公告)日：2014-10-07
申请号：US13499622
申请日：2010-08-31
申请人： Klaus Müller , Günter Spath , Siegfried Herrmann , Ewald Karl Michael Günther , Herbert Brunner
发明人： Klaus Müller , Günter Spath , Siegfried Herrmann , Ewald Karl Michael Günther , Herbert Brunner
IPC分类号： H01L33/62 , H01L31/0224
CPC分类号： H01L31/0224 , H01L25/0753 , H01L25/167 , H01L33/0079 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/4554
摘要： The invention relates to an optoelectronic component, having —a carrier (1) comprising a first main surface (Ia), —at least one optoelectronic semiconductor chip (2) having no substrate, and —a contact metallization (3a, 3b), wherein —the carrier (1) is electrically insulating, —the at least one optoelectronic semiconductor chip (2) is fastened to the first main surface (Ia) of the carrier (1) by means of a bonding material (4), particularly a solder material, —the contact metallization (3a, 3b) covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (2), and —the contact metallization (3a, 3b) is electrically conductively connected to the optoelectronic semiconductor chip (2).
摘要翻译：本发明涉及一种具有载体（1）的光电子部件，载体（1）包括第一主表面（Ia）， - 至少一个不具有基板的光电子半导体芯片（2）和 - 接触金属化（3a，3b），其中 - 载体（1）是电绝缘的， - 至少一个光电子半导体芯片（2）通过接合材料（4）紧固到载体（1）的第一主表面（1a），特别是焊料材料， - 接触金属化（3a，3b）覆盖不含光电子半导体芯片（2）的第一主表面（1a）的至少一个区域，并且接触金属化层（3a，3b）导电地连接到光电半导体芯片（2）。

65. 发明授权

US08716729B2 Lighting device 有权
标题翻译：照明设备
公开(公告)号：US08716729B2
公开(公告)日：2014-05-06
申请号：US12809729
申请日：2008-12-11
申请人： Burkard Wiesmann , Herbert Brunner , Joerg Strauss , Julius Muschaweck , Kirstin Petersen
发明人： Burkard Wiesmann , Herbert Brunner , Joerg Strauss , Julius Muschaweck , Kirstin Petersen
IPC分类号： H01L33/00
CPC分类号： H01L33/50 , H01L33/44 , H01L2224/48091 , H01L2924/00014
摘要： A lighting device (1) comprises at least one element (2) emitting light which is at least in part visible, and at least one conversion medium (3), which converts at least part of the radiation emitted by the element (2) into radiation of another frequency. In addition, the lighting device (1) comprises at least one filter medium (4) which filters at least part of the radiation, and which is configured such that the quantity of the conversion medium (4) to be used is reduced for at least one predetermined color saturation and/or one predetermined hue. This means that, compared with a light source corresponding to the lighting device (1) apart from the filter medium (4), savings are made in conversion medium (3) while achieving the same color saturation or the same hue. Light of a predetermined color saturation or of a predetermined hue may be efficiently generated by such a lighting device (1) and the lighting device (1) may be inexpensively produced. In operation, it also has high light intensities and a long service life.
摘要翻译：照明装置（1）包括发射至少部分可见的光的至少一个元件（2）和至少一个转换介质（3），其将由元件（2）发射的辐射的至少一部分转换成另一个频率的辐射。此外，照明装置（1）包括至少一个过滤介质（4），其过滤至少部分辐射，并且被配置为使得要使用的转化介质（4）的量至少减少一个预定的色彩饱和度和/或一个预定色调。这意味着与对应于照明装置（1）的与过滤介质（4）相对应的光源相比，在转换介质（3）中节省了同样的颜色饱和度或相同的色相。可以通过这种照明装置（1）有效地生成预定色彩饱和度的光或预定色调的光，并且可以廉价地制造照明装置（1）。使用寿命长，光线强度高，使用寿命长。

66. 发明授权

US07666715B2 Radiation-emitting and/or radiation-receiving semiconductor component and method for the production thereof 有权
标题翻译：辐射发射和/或辐射接收半导体元件及其制造方法
公开(公告)号：US07666715B2
公开(公告)日：2010-02-23
申请号：US10578854
申请日：2004-12-14
申请人： Herbert Brunner , Harald Jäger , Jörg Erich Sorg
发明人： Herbert Brunner , Harald Jäger , Jörg Erich Sorg
IPC分类号： H01L23/31
CPC分类号： H01L33/56 , H01L31/0203 , H01L33/486 , H01L33/501 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/01004 , H01L2924/01068 , H01L2924/01078 , H01L2924/12041 , H01L2924/00 , H01L2924/00014
摘要： A radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic part which is transparent to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by which the semiconductor chip is at least partially overmolded, and external electrical leads that are electrically connected to electrical contact areas of the semiconductor chip. The molded plastic part is made of a reaction-curing silicone molding compound. A method of making such a semiconductor component is also specified.
摘要翻译：包含辐射发射和/或辐射接收半导体芯片的辐射发射和/或辐射接收半导体部件，对半导体部件要发射和/或接收的电磁辐射透明的模制塑料部件半导体芯片至少部分地包覆成型，以及电连接到半导体芯片的电接触区域的外部电引线。模制塑料部件由反应固化硅树脂模塑料制成。还规定了制造这种半导体部件的方法。

67. 发明申请

US20090197361A1 Method for Producing an LED Light Source Comprising a Luminescence Conversion Element 有权
标题翻译：用于产生包含发光转换元件的LED光源的方法
公开(公告)号：US20090197361A1
公开(公告)日：2009-08-06
申请号：US12421814
申请日：2009-04-10
申请人： Bert Braune , Herbert Brunner
发明人： Bert Braune , Herbert Brunner
IPC分类号： H01L21/56
CPC分类号： H01L33/505 , H01L33/38 , H01L2224/11 , H01L2933/0016 , H01L2933/0041
摘要： The invention describes a method for producing a light-emitting-diode (LED) light source, particularly comprising mixed-color LEDs, wherein at least a portion of primary radiation emitted by a chip is transformed by luminescence conversion. Said chip comprises a front-side (i.e., the side facing in the direction of radiation) electrical contact to whose surface a luminescence conversion material is applied in the form of a thin layer. Prior to coating, the front-side electrical contact is raised by the application of an electrically conductive material to the electrical contact surface. The method enables specific color coordinates to be adjusted selectively by monitoring the color coordinates (IEC chromaticity diagram) and thinning the layer of luminescence conversion material. In addition, the method is suited in particular for simultaneously producing a plurality of LED light sources from a multiplicity of similar chips in a wafer composite.
摘要翻译：本发明描述了一种用于制造发光二极管（LED）光源的方法，特别地包括混合彩色LED，其中由芯片发射的初级辐射的至少一部分通过发光转换而变换。所述芯片包括前表面（即面向辐射方向的一侧）电接触，其表面以薄层的形式施加发光转换材料。在涂覆之前，通过将导电材料施加到电接触表面来提高前侧电接触。该方法通过监视颜色坐标（IEC色度图）和稀释发光转换材料层来选择性地调整特定的颜色坐标。此外，该方法特别适用于从晶片复合材料中的多个类似的芯片同时制造多个LED光源。

68. 发明授权

US07436002B2 Surface-mountable radiation-emitting component 有权
标题翻译：表面贴装辐射发射元件
公开(公告)号：US07436002B2
公开(公告)日：2008-10-14
申请号：US10747703
申请日：2003-12-29
申请人： Herbert Brunner , Klaus Höhn , Harald Jäger , Josef Schmid
发明人： Herbert Brunner , Klaus Höhn , Harald Jäger , Josef Schmid
IPC分类号： H01L33/00 , H05K3/34
CPC分类号： H01L33/486 , H01L24/32 , H01L24/48 , H01L24/73 , H01L33/54 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/4848 , H01L2224/73265 , H01L2924/00014 , H01L2924/0102 , H01L2924/01021 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H05K3/3426 , Y02P70/613 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A radiation-emitting surface-mountable component has a light-emitting diode chip mounted on a leadframe. A molding material encapsulates the leadframe and the light-emitting diode chip.
摘要翻译：辐射发射表面可安装部件具有安装在引线框架上的发光二极管芯片。成型材料封装引线框和发光二极管芯片。

69. 发明授权

US07319245B2 Radiation emitting semiconductor component with luminescent conversion element 有权
标题翻译：具有发光转换元件的辐射发射半导体元件
公开(公告)号：US07319245B2
公开(公告)日：2008-01-15
申请号：US11487742
申请日：2006-07-17
申请人： Herbert Brunner , Alexandra Debray , Harald Jäger , Günther Waitl
发明人： Herbert Brunner , Alexandra Debray , Harald Jäger , Günther Waitl
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/505 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/8592 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H01L2933/0041 , H01L2924/00012 , H01L2224/4554
摘要： A radiation-emitting semiconductor component, comprising a semiconductor body which emits a primary light, a luminescent conversion element which emits fluorescent light, in which the luminescent conversion element comprises a suspension of a luminous substance in a matrix material, wherein the luminescent conversion element is in direct contact with a part of the surface of said semiconductor body, and wherein the fluorescent light emitted from said luminescent conversion element is approximately half the total emission of the light of the radiation-emitting semiconductor component.
摘要翻译：一种辐射发射半导体部件，包括发射一次光的半导体本体，发射荧光的发光转换元件，其中发光转换元件包括基质材料中的发光物质的悬浮液，其中发光转换元件为与所述半导体本体的表面的一部分直接接触，并且其中从所述发光转换元件发射的荧光大约是辐射发射半导体部件的光的总发射的一半。

70. 发明申请

US20070269927A1 Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body 有权
标题翻译：用于制造具有图案化金属化封装体的光电子器件的方法和用于含塑料体的图案化金属化的方法
公开(公告)号：US20070269927A1
公开(公告)日：2007-11-22
申请号：US11880717
申请日：2007-07-23
申请人： Thomas Hofer , Herbert Brunner , Frank Mollmer , Gunter Waitl , Rainer Sewald , Markus Zeiler
发明人： Thomas Hofer , Herbert Brunner , Frank Mollmer , Gunter Waitl , Rainer Sewald , Markus Zeiler
IPC分类号： H01L21/58 , B27N7/00
CPC分类号： H01L33/60 , B29C45/14639 , B29C45/1671 , B29C2045/0079 , H01L24/48 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.
摘要翻译：一种用于含塑料体的图案化金属化的方法，其包括以下步骤：通过具有至少两种塑料的双组分注射成型工艺生产所述主体，其中一种是不可金属化的，并且将所述主体金属化在这种形成金属化区域和非金属化区域的方式，其中非金属化区域由非金属化塑料确定。还提供了一种用于含塑料体的图案化金属化的方法，特别是用于光电子器件的封装体。

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