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    • 63. 发明申请
    • REFERENCE VOLTAGE GENERATION CIRCUIT AND BIAS CIRCUIT
    • 参考电压发生电路和偏置电路
    • US20100127689A1
    • 2010-05-27
    • US12417730
    • 2009-04-03
    • Kazuya YamamotoMiyo Miyashita
    • Kazuya YamamotoMiyo Miyashita
    • G05F3/16G05F1/10
    • G05F3/185
    • A reference voltage generation circuit comprises: a first depletion mode FET; a second depletion mode FET; a first resistor; a first bipolar transistor; a second resistor; a second bipolar transistor; a third bipolar transistor; a third resistor; a third depletion mode FET having its drain connected to a second end of the first resistor and to the collector of the first bipolar transistor; and a fourth bipolar transistor having its base and collector connected to the gate and the source of the third depletion mode FET, and its emitter grounded, wherein source voltage of the second depletion mode FET is output as a reference voltage.
    • 参考电压产生电路包括:第一耗尽型FET; 第二耗尽型FET; 第一个电阻; 第一双极晶体管; 第二电阻器; 第二双极晶体管; 第三双极晶体管; 第三电阻; 第三耗尽型FET,其漏极连接到第一电阻器的第二端和第一双极晶体管的集电极; 以及第四双极晶体管,其基极和集电极连接到第三耗尽型FET的栅极和源极,并且其发射极接地,其中第二耗尽型FET的源极电压作为参考电压输出。
    • 67. 发明申请
    • Film formation apparatus for semiconductor process
    • 用于半导体工艺的成膜装置
    • US20090114156A1
    • 2009-05-07
    • US12285512
    • 2008-10-07
    • Nobutake NoderaJun SatoKazuya YamamotoKazuhide Hasebe
    • Nobutake NoderaJun SatoKazuya YamamotoKazuhide Hasebe
    • C23C16/00
    • C23C16/4405C23C16/345C23C16/45525H01L21/3185
    • A film formation apparatus for a semiconductor process includes a support member having a plurality of support levels configured to support target substrates inside a reaction chamber; a film formation gas supply system configured to supply a film formation gas into the reaction chamber and including a gas distribution nozzle; a cleaning gas supply system configured to supply a cleaning gas for etching a by-product film deposited inside the reaction chamber; and an exhaust system configured to exhaust gas from inside the reaction chamber. The cleaning gas supply system includes a gas nozzle disposed near a bottom of the reaction chamber and having a gas supply port at its top directed upward, and the gas supply port is located below the lowermost one of the support levels of the support member.
    • 一种用于半导体工艺的成膜装置包括:支撑构件,其具有多个支撑层,构造成支撑反应室内的目标基板; 成膜气体供给系统,其构造成将成膜气体供给到所述反应室中并且包括气体分配喷嘴; 清洁气体供给系统,被配置为提供用于蚀刻沉积在所述反应室内的副产物膜的清洁气体; 以及构造成从反应室内排出气体的排气系统。 清洁气体供给系统包括设置在反应室底部附近的气体喷嘴,其顶部朝向上方具有气体供给口,气体供给口位于支撑构件的支撑水平面的最下方。
    • 68. 发明申请
    • POWER AMPLIFIER
    • 功率放大器
    • US20090051437A1
    • 2009-02-26
    • US11946931
    • 2007-11-29
    • Kazuya YamamotoMiyo Miyashita
    • Kazuya YamamotoMiyo Miyashita
    • H03G3/10
    • H03F1/302H03F3/19H03F2200/18H03F2200/447H03F2200/451H03G1/0035
    • An emitter follower circuit applies to an input terminal of a second amplifying device a voltage according to a reference voltage applied to a reference terminals. First and second resistors are connected in series between the reference terminal and an input terminal of a first amplifying device. The collector of a first transistor is connected to the reference terminal, and a control voltage is applied to the base of the first transistor. A third resistor is connected between the emitter of the first transistor and a grounding point. A current mirror circuit draws a current proportional to a current input from the collector of the first transistor from a connection point of the first and second resistors.
    • 射极跟随器电路根据施加到参考端子的参考电压向第二放大器件的输入端子施加电压。 第一和第二电阻串联连接在参考端和第一放大器的输入端之间。 第一晶体管的集电极连接到参考端子,并且控制电压被施加到第一晶体管的基极。 第三电阻连接在第一晶体管的发射极和接地点之间。 电流镜电路从第一和第二电阻器的连接点吸取与来自第一晶体管的集电极的电流成比例的电流。
    • 70. 发明申请
    • Film formation apparatus and method for using the same
    • 成膜装置及其使用方法
    • US20080003362A1
    • 2008-01-03
    • US11819500
    • 2007-06-27
    • Nobutake NoderaKazuhide HasebeKazuya Yamamoto
    • Nobutake NoderaKazuhide HasebeKazuya Yamamoto
    • C23C16/00B05C11/00
    • H01L21/67109C23C16/4404C23C16/4405Y10S438/905
    • A method for using a film formation apparatus includes performing film formation of a product film selected from the group consisting of a silicon nitride film and a silicon oxynitride film on a target substrate within a reaction chamber of the film formation apparatus; and unloading the target substrate from the reaction chamber. Thereafter, the method includes first heating an inner surface of the reaction chamber at a post process temperature while supplying a post process gas for nitridation into the reaction chamber, thereby performing nitridation of a by-product film deposited on the inner surface of the reaction chamber; then rapidly cooling the inner surface of the reaction chamber, thereby cracking the by-product film by a thermal stress; and then forcibly exhausting gas from inside the reaction chamber to carry the by-product film, thus peeled off from the inner surface.
    • 使用成膜装置的方法包括在成膜装置的反应室内的目标基板上进行选自由氮化硅膜和氮氧化硅膜组成的组中的产品膜的成膜; 并从反应室卸载目标衬底。 此后,该方法包括在后处理温度下先加热反应室的内表面,同时向反应室供应用于氮化的后处理气体,从而对沉积在反应室内表面上的副产物膜进行氮化 ; 然后快速冷却反应室的内表面,从而通过热应力裂解副产物膜; 然后从反应室内强制排出气体以携带副产物膜,从而从内表面剥离。