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61. 发明申请

US20080009128A1 Buried pattern substrate and manufacturing method thereof 审中-公开
标题翻译：埋地图案基板及其制造方法
公开(公告)号：US20080009128A1
公开(公告)日：2008-01-10
申请号：US11708339
申请日：2007-02-21
申请人： Shuhichi Okabe , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Ji-Eun Kim
发明人： Shuhichi Okabe , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Ji-Eun Kim
IPC分类号： H01L21/44
CPC分类号： H05K3/205 , H05K3/4038 , H05K3/4617 , H05K2203/0733 , H05K2203/1572
摘要： A buried pattern substrate and a manufacturing method thereof are disclosed. A method of manufacturing a buried pattern substrate having a circuit pattern formed on a surface, in which the circuit pattern is connected electrically by a stud bump, includes (a) forming the circuit pattern and the stud bump by depositing a plating layer selectively on a seed layer of a carrier film, where the seed layer is laminated on a surface of the carrier film, (b) laminating and pressing the carrier film on an insulation layer such that the circuit pattern and the stud bump face the insulation layer, and (c) removing the carrier film and the seed layer, allows the circuit interconnection to be realized using a copper (Cu) stud bump, so that a drilling process for interconnection is unnecessary, the degree of freedom for circuit design is improved, a via land is made unnecessary and the size of a via is small, to allow higher density in a circuit.
摘要翻译：公开了掩埋图案基板及其制造方法。一种制造埋设图形衬底的方法，其中电路图案形成在电路图形通过柱形凸块电连接的表面上，包括：（a）通过在晶种层层叠在载体膜的表面上的载体膜的种子层，（b）在绝缘层上层叠压制载体膜，使得电路图案和柱状凸块面向绝缘层，和 c）去除载体膜和种子层，允许使用铜（Cu）柱状凸块实现电路互连，使得不需要用于互连的钻孔工艺，提高了电路设计的自由度，通孔焊盘不必要，并且通孔的尺寸小，以允许电路中的较高密度。

62. 发明申请

US20070133590A1 Channel resource assignment method for fair channel resource reservation and QoS in mesh WPAN 失效
标题翻译：用于公平信道资源预留的信道资源分配方法和网络WPAN中的QoS
公开(公告)号：US20070133590A1
公开(公告)日：2007-06-14
申请号：US11511051
申请日：2006-08-28
申请人： Young-Ae Chun , Ji-Eun Kim , Sang-Jae Lee , Sang-Sung Choi , Kwang-Roh Park , Byung-Joo Lee , Seung-Hyong Rhee
发明人： Young-Ae Chun , Ji-Eun Kim , Sang-Jae Lee , Sang-Sung Choi , Kwang-Roh Park , Byung-Joo Lee , Seung-Hyong Rhee
IPC分类号： H04Q7/00 , H04Q7/24 , H04Q7/20 , H04B7/212
CPC分类号： H04W72/04 , H04W28/26 , H04W48/12 , H04W74/08 , H04W84/10
摘要： Provided is a channel resource assignment method for fair channel resource reservation in a mesh WPAN, in which the amount of channel resources is fairly reserved when devices share the channel resources. The channel resource assignment method in a mesh Wireless Personal Area Network (WPAN) includes the steps of: (a) transmitting beacons of all devices and adding an amount of channel resource to be reserved to the beacons so as to assign the channel resource for fair channel resource reservation between corresponding devices and adjacent devices when a mesh network is configured; (b) accumulating the amount of the channel resources reserved by all the adjacent devices except the corresponding device; and (c) determining the amount of the channel resources to be reserved.
摘要翻译：提供了一种用于网格WPAN中的公平信道资源预留的信道资源分配方法，其中当设备共享信道资源时，信道资源量被相当保留。网状无线个人区域网络（WPAN）中的信道资源分配方法包括以下步骤：（a）发送所有设备的信标，并向信标添加一定量的信道资源以便为信标分配信道资源当配置网状网络时，相应设备和相邻设备之间的信道资源预留; （b）累积除相应设备之外的所有相邻设备预留的信道资源量; 和（c）确定要保留的信道资源的数量。

63. 发明申请

US20070081490A1 Channel time allocating method using ECAP in wireless personal area network 审中-公开
标题翻译：在无线个域网中使用ECAP的信道时间分配方法
公开(公告)号：US20070081490A1
公开(公告)日：2007-04-12
申请号：US11455409
申请日：2006-06-19
申请人： Ji-Eun Kim , Young-Ae Chun , Sang-Jae Lee , Sang-Sung Choi
发明人： Ji-Eun Kim , Young-Ae Chun , Sang-Jae Lee , Sang-Sung Choi
IPC分类号： H04Q7/00
CPC分类号： H04W74/02 , H04W72/0413 , H04W72/0446 , H04W74/08 , H04W84/10 , H04W84/18
摘要： Provided is a channel time allocating method using Extended Contention Access Period (ECAP) in a wireless personal area network (WPAN). The method includes the steps of: a) receiving channel time allocation requests for data transmission from the Devices; and b) allocating channel time upon the channel time allocation request of the Devices and allocating a rest time period which are left behind after channel time allocation to the Devices as the ECAPs for competitive use of the Devices. The method can be used to allocate the channel time in the WPAN.
摘要翻译：提供了一种在无线个域网（WPAN）中使用扩展争用接入周期（ECAP）的信道时间分配方法。该方法包括以下步骤：a）从设备接收数据传输的信道时间分配请求; 以及b）根据设备的信道时间分配请求分配信道时间，并且在通道时间分配之后分配剩余的休息时间段作为设备的竞争性使用的ECAP。该方法可用于在WPAN中分配通道时间。

64. 发明授权

US09082634B2 Stack package and method for manufacturing the same 有权
标题翻译：堆栈包装及其制造方法
公开(公告)号：US09082634B2
公开(公告)日：2015-07-14
申请号：US12981386
申请日：2010-12-29
申请人： Hee-Min Shin , Cheol-Ho Joh , Eun-Hye Do , Ji-Eun Kim , Kyu-Won Lee
发明人： Hee-Min Shin , Cheol-Ho Joh , Eun-Hye Do , Ji-Eun Kim , Kyu-Won Lee
IPC分类号： H01L25/065 , H01L25/00 , H01L23/31 , H01L23/00 , H01L23/538
CPC分类号： H01L25/50 , H01L21/78 , H01L23/3121 , H01L23/5389 , H01L24/18 , H01L24/19 , H01L24/97 , H01L25/0657 , H01L25/117 , H01L2224/04105 , H01L2224/12105 , H01L2224/73267 , H01L2224/97 , H01L2225/0652 , H01L2225/06524 , H01L2225/06548 , H01L2924/01029 , H01L2924/12042 , H01L2224/82 , H01L2224/83 , H01L2924/00
摘要： A stack package includes a cover film, a first package having a first semiconductor chip which is attached to the cover film, a first adhesive member which is formed to seal the first semiconductor chip and a surface of the cover film, and a first circuit pattern which is disposed over the first adhesive member and electrically connected with the first semiconductor chip; a second package disposed over the first package, having a second semiconductor chip which is electrically connected with the first circuit pattern, a second adhesive member which is formed to seal the second semiconductor chip, and a second circuit pattern which is formed over the second adhesive member, and a via formed to pass through the second circuit pattern and the second adhesive member and to be electrically connected with the first circuit pattern and the second circuit pattern.
摘要翻译：叠层封装包括覆盖膜，具有附接到覆盖膜的第一半导体芯片的第一封装，形成为密封第一半导体芯片的第一粘合构件和覆盖膜的表面，以及第一电路图案其设置在第一粘合构件上并与第一半导体芯片电连接; 第二封装，设置在所述第一封装上，具有与所述第一电路图案电连接的第二半导体芯片，形成为密封所述第二半导体芯片的第二粘合构件，以及形成在所述第二粘合剂上的第二电路图案以及形成为穿过第二电路图案和第二粘合构件并且与第一电路图案和第二电路图案电连接的通孔。

65. 发明授权

US08986555B2 Method of manufacturing printed circuit board having bump 有权
标题翻译：制造具有凹凸的印刷电路板的方法
公开(公告)号：US08986555B2
公开(公告)日：2015-03-24
申请号：US12892047
申请日：2010-09-28
申请人： Ji-Eun Kim , Nam-Keun Oh , Jung-Hyun Park , Young-Ji Kim , Jong-Gyu Choi , Sang-Duck Kim
发明人： Ji-Eun Kim , Nam-Keun Oh , Jung-Hyun Park , Young-Ji Kim , Jong-Gyu Choi , Sang-Duck Kim
IPC分类号： H01B13/00 , H05K3/40 , H05K3/06 , H05K3/20
CPC分类号： H05K3/4007 , H05K3/061 , H05K3/205 , H05K2201/0367 , H05K2203/0152 , H05K2203/0376
摘要： A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to one surface of an insulation layer such that the first circuit is buried, stacking an etching resist on the first carrier in accordance with where the bump is to be formed and forming the bump by etching the first carrier. In accordance with an embodiment of the present invention, the difference in height between a bump and its adjacent bump in a printed circuit board can be reduced, and thus electrical connection between an electronic component and the printed circuit board can be better implemented.
摘要翻译：公开了一种制造具有凸块的印刷电路板的方法。该方法包括制备其上形成有第一电路的第一载体，将第一载体压缩到绝缘层的一个表面，使得第一电路被掩埋，根据凸点将在第一载体上堆叠抗蚀剂通过蚀刻第一载体形成和形成凸块。根据本发明的实施例，可以减小印刷电路板中的凸块与其相邻凸块之间的高度差，从而可以更好地实现电子部件和印刷电路板之间的电连接。

66. 发明授权

US08947213B2 Method and system for confirming location of product within shelf using RFID 有权
标题翻译：使用RFID确认产品在货架内的位置的方法和系统
公开(公告)号：US08947213B2
公开(公告)日：2015-02-03
申请号：US13576058
申请日：2011-01-24
申请人： Yong-Ho Woo , Ju-Ho Lee , Ji-Eun Kim
发明人： Yong-Ho Woo , Ju-Ho Lee , Ji-Eun Kim
IPC分类号： H04Q5/22 , G06Q10/08
CPC分类号： G06Q10/087
摘要： Present invention relates to method for confirming location of product using RFID. Method for confirming location of product on a shelf in a product location confirmation system including: a plurality of shelf areas; a location tag which is provided at each shelf and transmits an RFID signal; a reader which is provided at each shelf and reads the RFID signal; and a server for analyzing the information collected through the reader comprises the steps of: the reader confirming whether a location tag signal is received; the server determining the absence of the product on the corresponding shelf when the location tag signal is received; the reader confirming whether a product tag signal as the RFID signal transmitted from the product is received when the location tag signal is not received; and the server determining the presence of the product within the corresponding shelf when the product tag signal is received.
摘要翻译：本发明涉及使用RFID确认产品位置的方法。一种确定产品位置确认系统的货架上产品位置的方法，包括：多个货架区域; 位置标签，其设置在每个货架处，并发送RFID信号; 读取器，其设置在每个机架上并读取RFID信号; 以及用于分析通过读取器收集的信息的服务器，包括以下步骤：读取器确认是否接收到位置标签信号; 所述服务器在接收到所述位置标签信号时确定所述对应搁板上的产品不存在; 当没有接收到位置标签信号时，读取器确认是否接收到从产品发送的RFID信号的产品标签信号; 并且当接收到产品标签信号时，服务器确定在相应搁板内产品的存在。

67. 发明授权

US08633392B2 Circuit board with high-density circuit patterns 有权
标题翻译：电路板采用高密度电路图案
公开(公告)号：US08633392B2
公开(公告)日：2014-01-21
申请号：US13354438
申请日：2012-01-20
申请人： Shuhichi Okabe , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Jeong-Woo Park , Ji-Eun Kim
发明人： Shuhichi Okabe , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Jeong-Woo Park , Ji-Eun Kim
IPC分类号： H05K1/02
CPC分类号： H05K1/0265 , H05K1/116 , H05K3/107 , H05K3/108 , H05K3/205 , H05K3/421 , H05K2201/0379 , H05K2201/0394 , H05K2201/09509 , H05K2201/09736 , H05K2203/0361
摘要： A circuit board including: an insulator having a trench; a first circuit pattern formed to bury a portion of the trench; and a second circuit pattern formed on a surface of the insulator having the trench formed therein.
摘要翻译：一种电路板，包括：具有沟槽的绝缘体; 形成为埋入沟槽的一部分的第一电路图案; 以及形成在其中形成有沟槽的绝缘体的表面上的第二电路图案。

68. 发明申请

US20110259627A1 Circuit board with buried circuit pattern 审中-公开
标题翻译：电路板埋设电路图案
公开(公告)号：US20110259627A1
公开(公告)日：2011-10-27
申请号：US13067883
申请日：2011-07-01
申请人： Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
发明人： Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
IPC分类号： H05K1/09 , H05K1/11
CPC分类号： H05K3/205 , H01L21/4846 , H01L23/49816 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/15311 , H05K3/4007 , H05K2201/09745 , H05K2201/10674 , H05K2203/0338 , H05K2203/0435 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165
摘要： A circuit board includes: an insulator having a groove; a circuit layer filling a portion of the groove; a solder pad on the circuit layer filling the remainder of the groove; and a circuit pattern electrically connected with the circuit layer, the circuit pattern buried in the insulator such that a portion of the circuit pattern is exposed at a surface of the insulator.
摘要翻译：电路板包括：具有凹槽的绝缘体; 填充所述凹槽的一部分的电路层; 电路层上的填充凹槽其余部分的焊盘; 以及与电路层电连接的电路图案，电路图案埋在绝缘体中，使得电路图案的一部分在绝缘体的表面露出。

69. 发明申请

US20100132876A1 MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD 有权
标题翻译：印刷电路板的制造方法
公开(公告)号：US20100132876A1
公开(公告)日：2010-06-03
申请号：US12508224
申请日：2009-07-23
申请人： Myung-Sam Kang , Jung-Hyun Park , Ji-Eun Kim
发明人： Myung-Sam Kang , Jung-Hyun Park , Ji-Eun Kim
IPC分类号： C25D5/02 , B32B37/00 , B32B38/00
CPC分类号： B32B37/02 , B32B2457/08 , C25D5/022 , H05K3/205 , H05K3/428 , H05K3/4658 , H05K2201/0376 , H05K2203/0384
摘要： Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for interlayer connection can include forming a circuit pattern on one side of a carrier, pressing one side of the carrier into one side of the insulator, removing the carrier, forming a hole penetrating through the insulator by processing one end of the circuit pattern, and forming a conductive material inside the hole to have the conductive material correspond to the via.
摘要翻译：公开了印刷电路板的制造方法。制造具有用于层间连接的通孔的印刷电路板的方法可以包括在载体的一侧上形成电路图案，将载体的一侧压在绝缘体的一侧，去除载体，形成贯穿该载体的孔通过处理电路图案的一端，并且在孔内形成导电材料以使导电材料对应于通孔。

70. 外观设计

USD608369S1 Transitional image for a mobile phone 有权
标题翻译：移动电话的过渡图像
公开(公告)号：USD608369S1
公开(公告)日：2010-01-19
申请号：US29325469
申请日：2008-10-01
申请人： Hee-Kyung Jeon , Joong-Hun Kwon , Dae-Won Kim , Kyoung-Sik Yoon , Ji-Eun Kim , Jee-Yeun Wang , Myoung-Hwan Han , Min-Hwa Jung , Bong-Won Lee
设计人： Hee-Kyung Jeon , Joong-Hun Kwon , Dae-Won Kim , Kyoung-Sik Yoon , Ji-Eun Kim , Jee-Yeun Wang , Myoung-Hwan Han , Min-Hwa Jung , Bong-Won Lee

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