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61. 发明授权

US08221193B2 Closed loop control of pad profile based on metrology feedback 有权
标题翻译：基于计量反馈的焊盘轮廓闭环控制
公开(公告)号：US08221193B2
公开(公告)日：2012-07-17
申请号：US12187675
申请日：2008-08-07
申请人： Shou-Sung Chang , Hung Chih Chen , Stan D Tsai , Yuchun Wang
发明人： Shou-Sung Chang , Hung Chih Chen , Stan D Tsai , Yuchun Wang
IPC分类号： B24B49/12 , B24B49/18
CPC分类号： B24B37/042 , B24B49/02 , B24B53/017
摘要： A chemical mechanical polishing apparatus includes a metrology system that detects the thickness of the polishing pad as semiconductor wafers are processed and the thickness of the polishing pad is reduced. The chemical mechanical polishing apparatus includes a controller that adjusts the rate of material removal of a conditioning disk when areas of the polishing surface are detected that are higher or lower than the adjacent areas of the polishing pad.
摘要翻译：化学机械抛光装置包括测量系统，其在半导体晶片被处理时检测抛光垫的厚度，并且抛光垫的厚度减小。化学机械抛光装置包括控制器，当检测到比抛光垫的相邻区域更高或更低的区域时，调节调节盘的材料去除速率。

62. 发明授权

US08181302B2 Brush alignment control mechanism 有权
标题翻译：刷子对准控制机构
公开(公告)号：US08181302B2
公开(公告)日：2012-05-22
申请号：US12564254
申请日：2009-09-22
申请人： Hung Chih Chen , Hui Chen , Dan Zhang
发明人： Hung Chih Chen , Hui Chen , Dan Zhang
IPC分类号： A46B13/00
CPC分类号： A46B13/02 , A46B9/005 , A46B2200/3073 , A61C1/085
摘要： A method and apparatus for providing uniform pressure, friction and/or contact between a substrate and a cylindrical roller in a brush-type cleaning system is described. The apparatus includes an alignment member adapted to allow pivotal movement of the cylindrical roller based on the topography of a substrate and/or the outer surface of the cylindrical roller. The method includes positioning a substrate between two cylindrical rollers, moving each of the two cylindrical rollers to a position where at least a portion of an outer surface of each of the cylindrical rollers are in contact with the major surfaces of the substrate, and rotating one or both of the substrate and the two cylindrical rollers relative to each other while allowing a longitudinal axis of one or both of the two cylindrical rollers to pivot relative to a plane defined by one of the major surfaces of the substrate.
摘要翻译：描述了一种用于在刷式清洁系统中在衬底和圆柱形辊之间提供均匀的压力，摩擦和/或接触的方法和装置。该装置包括一个对准构件，该对准构件适于基于衬底的形状和/或圆柱形辊的外表面允许圆柱形辊的枢转运动。该方法包括将基板定位在两个圆柱形辊之间，将两个圆柱滚子中的每一个移动到每个圆柱滚子的外表面的至少一部分与基板的主表面接触的位置，并且旋转一个或两个圆柱形滚子中的两个相对于彼此同时允许两个圆柱滚子中的一个或两个的纵向轴线相对于由基板的主要表面之一限定的平面枢转。

63. 发明申请

US20120021673A1 SUBSTRATE HOLDER TO REDUCE SUBSTRATE EDGE STRESS DURING CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：在化学机械抛光期间减少基板边缘应力的基板支架
公开(公告)号：US20120021673A1
公开(公告)日：2012-01-26
申请号：US12840195
申请日：2010-07-20
申请人： Hung Chih Chen , Samuel Chu-Chiang Hsu , Gautam Shashank Dandavate , Denis M. Koosau
发明人： Hung Chih Chen , Samuel Chu-Chiang Hsu , Gautam Shashank Dandavate , Denis M. Koosau
IPC分类号： B24B7/20 , B24B1/00
CPC分类号： B24B37/32
摘要： Embodiments of the present invention generally relate to methods for chemical mechanical polishing a substrate. The methods generally include coupling a first substrate to be polished to a dummy substrate, and removing a portion of the backside of the first substrate to reduce the thickness of the first substrate. The first substrate and the dummy substrate are positioned in a carrier head assembly comprising an inflatable membrane and a support ring. The first substrate is placed in contact with a polishing pad to reduce the surface roughness of the backside of the first substrate. The support ring restricts lateral movement of the inflatable membrane to prevent the first substrate from contacting an interior surface of the carrier head assembly. The support ring is sized to allow vertical movement of the inflatable membrane within the carrier head assembly.
摘要翻译：本发明的实施方案通常涉及用于化学机械抛光衬底的方法。所述方法通常包括将要抛光的第一衬底耦合到虚设衬底，以及去除第一衬底的背面的一部分以减小第一衬底的厚度。第一基板和虚设基板被定位在包括可充气膜和支撑环的载体头组件中。将第一基板放置成与抛光垫接触以减小第一基板的背面的表面粗糙度。支撑环限制可膨胀膜的横向移动，以防止第一基底接触载体头部组件的内表面。支撑环的尺寸设置成允许可充气膜在承载头组件内的垂直运动。

64. 发明申请

US20100144255A1 RETAINING RING AND ARTICLES FOR CARRIER HEAD 失效
标题翻译：保留环和运输工具的文章
公开(公告)号：US20100144255A1
公开(公告)日：2010-06-10
申请号：US12703591
申请日：2010-02-10
申请人： Doyle E. Bennett , Andrew J. Nagengast , Hung Chih Chen
发明人： Doyle E. Bennett , Andrew J. Nagengast , Hung Chih Chen
IPC分类号： B24B41/06
CPC分类号： B24B37/32 , B24B37/30
摘要： A carrier head for chemical mechanical polishing that has a base, a mounting assembly connected to the base having a surface for contacting a substrate, and a retaining ring secured to the base. The retaining ring can include perfluoroalkoxy, polyetherketoneketone, polybenzimidazole, a semi-crystalline thermoplastic polyester, or a long molecular chain molecule produced from poly-paraphenylene terephthalamide.
摘要翻译：一种用于化学机械抛光的载体头，其具有基部，连接到基部的安装组件具有用于接触基底的表面和固定到基部的保持环。保持环可以包括全氟烷氧基，聚醚酮酮，聚苯并咪唑，半结晶热塑性聚酯或由聚对苯二甲酰对苯二胺生产的长分子链分子。

65. 发明申请

US20090278081A1 PAD PROPERTIES USING NANOPARTICLE ADDITIVES 审中-公开
标题翻译：使用纳米添加剂的贴片性能
公开(公告)号：US20090278081A1
公开(公告)日：2009-11-12
申请号：US12411261
申请日：2009-03-25
申请人： Hichem M'Saad , Lakshmanan Karuppiah , Hung Chih Chen , Jeonghoon Oh , Robert Lum , Stan D. Tsai , Cassio Conceicao , Ashish Bhatnagar , Michael Perry , Kadthala Narendrnath , Yosi Shacham-Diamand
发明人： Hichem M'Saad , Lakshmanan Karuppiah , Hung Chih Chen , Jeonghoon Oh , Robert Lum , Stan D. Tsai , Cassio Conceicao , Ashish Bhatnagar , Michael Perry , Kadthala Narendrnath , Yosi Shacham-Diamand
IPC分类号： C09K13/00
CPC分类号： B24B37/24
摘要： A method for forming a polishing media and an article of manufacture is described. The article of manufacture may be formed into a polishing article. The polishing article includes a polymer base material and a plurality of nano-scale structures disposed in or on the polymer base material.
摘要翻译：描述了用于形成抛光介质和制造物品的方法。制品可以形成为抛光制品。抛光制品包括聚合物基材和设置在聚合物基材中或其上的多个纳米级结构。

66. 发明申请

US20090036036A1 APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD 审中-公开
标题翻译：用于调节抛光垫的装置和方法
公开(公告)号：US20090036036A1
公开(公告)日：2009-02-05
申请号：US12245759
申请日：2008-10-05
申请人： Roy C. Nangoy , Shou-Sung Chang , Donald J.K. Olgado , Hung Chih Chen , Gerald John Alonzo
发明人： Roy C. Nangoy , Shou-Sung Chang , Donald J.K. Olgado , Hung Chih Chen , Gerald John Alonzo
IPC分类号： B24B53/02
CPC分类号： B24B53/017 , B24B53/005 , B24B53/12
摘要： Apparatus and methods for conditioning a polishing pad are provided. An apparatus includes a base, an arm adapted to support a conditioning disk; and a drive mechanism coupled between the arm and the conditioning disk, wherein the drive mechanism is adapted to directly rotate the conditioning disk relative to the arm. Numerous other aspects are disclosed.
摘要翻译：提供了用于调节抛光垫的装置和方法。一种装置包括底座，适于支撑调节盘的臂; 以及联接在所述臂和所述调节盘之间的驱动机构，其中所述驱动机构适于相对于所述臂直接旋转所述调节盘。公开了许多其他方面。

67. 发明申请

US20070295610A1 Electrolyte retaining on a rotating platen by directional air flow 审中-公开
标题翻译：电解液通过定向气流保持在转盘上
公开(公告)号：US20070295610A1
公开(公告)日：2007-12-27
申请号：US11475637
申请日：2006-06-27
申请人： Hung Chih Chen , Rashid A. Mavliev
发明人： Hung Chih Chen , Rashid A. Mavliev
IPC分类号： B23H5/08
CPC分类号： B23H5/08 , B24B37/04 , B24B57/02
摘要： A method and apparatus for retaining electrolyte on a rotating platen using directional air flow is provided. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a processing pad and disposed on a stationary base so that the platen assembly may rotate relative to the base; and an air knife coupled to the base and extended over a portion of the surface, the air knife operable to deliver a stream of air toward the pad to divert at least a portion of a fluid disposed on the pad toward a center of the pad.
摘要翻译：提供了一种使用定向气流将电解质保持在旋转台板上的方法和装置。在一个实施例中，提供了一种用于处理衬底的设备。该装置包括压板组件，该压板组件具有用于支撑处理衬垫并设置在固定底座上的表面，使得压板组件可相对于底座旋转; 以及气刀，其联接到所述基座并且延伸到所述表面的一部分上，所述气刀可操作以将空气流输送到所述垫，以将设置在所述垫上的流体的至少一部分转向所述垫的中心。

68. 发明授权

US06764387B1 Control of a multi-chamber carrier head 失效
标题翻译：多室承载头的控制
公开(公告)号：US06764387B1
公开(公告)日：2004-07-20
申请号：US10384249
申请日：2003-03-07
申请人： Hung Chih Chen
发明人： Hung Chih Chen
IPC分类号： A24B100
CPC分类号： B24B37/30 , B24B49/16
摘要： An apparatus and method for chemical mechanical polishing in which a substrate is pressed against a polishing pad by a carrier head having a plurality of chambers. A common pressure is applied by the plurality of chambers in the carrier head using a common regulator, but a duration of application of the first pressure to each chamber from the plurality of chambers is controlled independently from other chambers.
摘要翻译：一种用于化学机械抛光的装置和方法，其中通过具有多个室的载体头将基板压在抛光垫上。共同的压力通过使用公共调节器的载体头中的多个腔室施加，但是从多个室施加第一压力到每个室的持续时间独立于其它室被控制。

69. 发明授权

US09050700B2 Methods and apparatus for an improved polishing head retaining ring 有权
标题翻译：用于改进的抛光头保持环的方法和装置
公开(公告)号：US09050700B2
公开(公告)日：2015-06-09
申请号：US13360221
申请日：2012-01-27
申请人： Hung Chih Chen , Jay Gurusamy , Gautam S. Dandavate , Samuel Chu-Chiang Hsu
发明人： Hung Chih Chen , Jay Gurusamy , Gautam S. Dandavate , Samuel Chu-Chiang Hsu
IPC分类号： B24B1/00 , B24B37/32 , B24B37/34
CPC分类号： B24B37/32 , B24B37/34
摘要： Methods, apparatus, and systems are provided for retaining a substrate in a polishing head of a CMP system. The invention includes a flexible inner retaining ring adapted to contour to an edge of a substrate and an inner ring support coupled to the polishing head. The inner support ring is adapted to contact the flexible inner retaining ring in response to a side force load applied to the flexible inner retaining ring by a substrate being polished. Numerous additional aspects are disclosed.
摘要翻译：提供了用于将基板保持在CMP系统的抛光头中的方法，装置和系统。本发明包括适于轮廓到基底的边缘的柔性内保持环和联接到抛光头的内环支撑。内支撑环适于通过被抛光的衬底施加到柔性内保持环的侧向力负载而接触柔性内保持环。公开了许多附加方面。

70. 发明授权

US08597084B2 Textured platen 有权
标题翻译：纹理压板
公开(公告)号：US08597084B2
公开(公告)日：2013-12-03
申请号：US12577351
申请日：2009-10-12
申请人： Hung Chih Chen
发明人： Hung Chih Chen
IPC分类号： B24B7/22
CPC分类号： B24B37/16
摘要： Embodiments described herein generally relate to the planarization of substrates. In one embodiment, an apparatus for polishing a substrate is provided. The apparatus comprises a rotatable platen having a textured upper surface, at least one groove formed in the upper surface, and a pad disposed on the textured upper surface and bridging the at least one groove.
摘要翻译：本文描述的实施例通常涉及衬底的平面化。在一个实施例中，提供了一种用于抛光衬底的装置。该装置包括具有纹理的上表面的可旋转压板，在上表面中形成的至少一个凹槽，以及设置在纹理化上表面上并桥接至少一个凹槽的垫。

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