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61. 发明授权

US06176304B1 Heat sink 有权
标题翻译：散热器
公开(公告)号：US06176304B1
公开(公告)日：2001-01-23
申请号：US09330279
申请日：1999-06-11
申请人： Hsieh-Kun Lee
发明人： Hsieh-Kun Lee
IPC分类号： F28F700
CPC分类号： F28F3/025 , F28F3/06 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a base having a plurality of ribs formed thereon and defining a plurality of grooves therebetween, and a folded fin member having a plurality of side walls connected by alternately arranged top and bottom walls. The folded fin member is mounted to the base by inserting the bottom walls thereof into the grooves of the base to directly contact a top surface of the base. Thermal grease, wax, or tape is interposed between the bottom walls of the folded fin member and the top surface of the base for enhancing heat transfer therebetween. Each rib of the base has two corrugated inside faces and each side wall of the folded fin member has at least one inclined tab extending therefrom for engaging with the corresponding corrugated inside face of the ribs of the base thereby securing the folded fin member to the base.
摘要翻译：散热器包括：基座，其上形成有多个肋，并且在其间形成多个槽;折叠翅片，具有通过交替布置的顶壁和底壁连接的多个侧壁。折叠的翅片构件通过将其底壁插入基座的凹槽中直接接触基座的顶表面而安装到基座。导热油脂，蜡或带介于折叠翅片构件的底壁和底座的上表面之间，以增强它们之间的热传递。基座的每个肋具有两个波纹状的内表面，并且折叠翅片构件的每个侧壁具有从其延伸的至少一个倾斜翼片，用于与基座的肋的相应的波纹内表面接合，从而将折叠翅片构件固定到基座。

62. 发明授权

US07327576B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07327576B2
公开(公告)日：2008-02-05
申请号：US11166311
申请日：2005-06-24
申请人： Hsieh-Kun Lee , Xue-Wen Peng , Bing Chen , Rui-Hua Chen
发明人： Hsieh-Kun Lee , Xue-Wen Peng , Bing Chen , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , F28D15/0275
摘要： A heat dissipation device for being installed to and cooling an electronic card device (40) includes first and second heat dissipation units (10, 20) and at least one heat pipe (30). The heat dissipation units each include a base plate (12, 22) and a fin plate (14, 24) engaged with the base plate. The at least one heat pipe includes an evaporating segment (32) received between the base plate and the fin plate of the first heat dissipation unit, and a condensing segment (34) received between the base plate and the fin plate of the second heat dissipation unit, thereby connecting the first and second heat dissipation units together. The evaporating segment and the condensing segment of the at least one heat pipe are movably received in the first and second heat dissipation units respectively before the heat dissipation device is installed to the electronic card device and dissipating heat generated therefrom, and are firmly secured in the first and second heat dissipation units respectively after the heat dissipation device is installed to the electronic card device and dissipate heat generated therefrom.
摘要翻译：一种用于安装和冷却电子卡装置（40）的散热装置包括第一和第二散热单元（10,20）和至少一个热管（30）。散热单元各自包括基板（12,22）和与基板接合的翅片板（14,24）。所述至少一个热管包括容纳在所述基板和所述第一散热单元的翅片之间的蒸发段（32），以及容纳在所述基板和所述翅片板之间的第二散热的冷凝段（34）从而将第一和第二散热单元连接在一起。所述至少一个热管的蒸发段和冷凝段分别可移动地容纳在第一和第二散热单元中，然后将散热装置安装到电子卡装置上并散发由其产生的热量，并牢固地固定在第一和第二散热单元分别在散热装置安装到电子卡装置上并散发由其产生的热量之后。

63. 发明申请

US20060291169A1 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US20060291169A1
公开(公告)日：2006-12-28
申请号：US11166984
申请日：2005-06-24
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , Y10T24/44496 , H01L2924/00
摘要： A heat dissipation device includes a heat sink, a retention module and a clip having two clipping portions for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating electronic device. The base defines two flutes in two opposite sides thereof respectively. Each of the flutes is located at a middle of a corresponding one of the two opposite sides. The retention module is located around the electronic device and includes a bottom wall for supporting the heat sink. Each clipping portion is rotatablely connected to the retention module and includes a pressing portion which is rotatablely received in the flute of the base and presses the base to the bottom wall of the retention module when the clip is rotated to a position locked to the retention module.
摘要翻译：散热装置包括散热器，保持模块和夹具，其具有用于将散热器固定到保持模块的两个夹持部分。散热器包括用于与发热电子设备接触的基座。基座分别在两个相对侧限定两个槽纹。每个凹槽位于两个相对侧中相应的一个的中间。保持模块位于电子设备周围，并且包括用于支撑散热器的底壁。每个夹持部分可旋转地连接到保持模块，并且包括按压部分，该按压部分可旋转地容纳在基部的凹槽中，并且当夹子旋转到锁定到保持模块的位置时将基部按压到保持模块的底壁。

64. 发明授权

US07142430B2 Heat dissipating device assembly 失效
标题翻译：散热装置组件
公开(公告)号：US07142430B2
公开(公告)日：2006-11-28
申请号：US10953654
申请日：2004-09-29
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Bo-Yong Yang , Jin-Song Feng , Tao Li
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Bo-Yong Yang , Jin-Song Feng , Tao Li
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device assembly for an electronic components (70), includes a heat sink (10) for contacting the electronic component, and a locking device (20) and a back plate unit (40) for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module (28) located around the electronic component for supporting the heat sink thereon, and a clip (30) pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.
摘要翻译：一种用于电子部件（70）的散热装置组件，包括用于接触电子部件的散热器（10）和用于将散热器协同地安装到电子部件的锁定装置（20）和后板单元（40）零件。锁定装置包括位于电子部件周围的用于在其上支撑散热器的保持模块（28），以及可枢转地连接到保持模块的夹子（30）。夹子包括按压部分和推动部分。夹子可在其中夹子将散热器朝向电子部件按压的第一位置和夹子沿远离电子部件的方向推动散热器的第二位置之间枢转。

65. 发明申请

US20060144572A1 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US20060144572A1
公开(公告)日：2006-07-06
申请号：US11135628
申请日：2005-05-23
申请人： Guang Yu , Hsieh-Kun Lee , Cui-Jun Lu
发明人： Guang Yu , Hsieh-Kun Lee , Cui-Jun Lu
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device (1) includes a heat spreader (10), a radiator (2), at least one U-shaped heat pipe (12), a fan (3) mounted on the radiator and a pair of clips (4). The radiator includes a first heat sink (20) and a second heat sink (22). The first heat sink (20) includes a first base (200) and a plurality of fins (202) extending from a side of the first base. The second heat sink (22) includes a second base (220) and a plurality of fins (222) extending from a side of the second base. The heat pipe (12) includes an evaporating portion (120) attached to the heat spreader and a pair of condensing portions (122) extending upwardly from opposite ends of the evaporating portion. The two condensing portions are sandwiched between the first base and the second base. The heat pipe transfers heat from the heat spreader to both of the first base and second base.
摘要翻译：散热装置（1）包括散热器（10），散热器（2），至少一个U形热管（12），安装在散热器上的风扇（3）和一对夹子（4）。散热器包括第一散热器（20）和第二散热器（22）。第一散热器（20）包括从第一基座的一侧延伸的第一基座（200）和多个翅片（202）。第二散热器（22）包括从第二基座的一侧延伸的第二基座（220）和多个翅片（222）。热管（12）包括附接到散热器的蒸发部分（120）和从蒸发部分的相对端向上延伸的一对冷凝部分（122）。两个冷凝部分夹在第一基座和第二基座之间。热管将热量从散热器传送到第一基座和第二基座两者。

66. 发明申请

US20060098408A1 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US20060098408A1
公开(公告)日：2006-05-11
申请号：US11065387
申请日：2005-02-24
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device of the present invention includes a heat sink (20) and two locking devices (10) for securing the heat sink. The heat sink includes a base (22) for contacting an electronic component. Each locking device includes a spring member, a post (12) and a sleeve (18). The spring member elastically rests on the base. The post extends through the sleeve. The post has one end engaging with the spring member, and an opposite end thereof extending beyond the sleeve for locking the combination. The sleeve has one end tightly grasping the post, and an opposite end thereof preventing the locking device from departing from the heat sink.
摘要翻译：本发明的散热装置包括散热器（20）和用于固定散热器的两个锁定装置（10）。散热器包括用于接触电子部件的基座（22）。每个锁定装置包括弹簧构件，柱（12）和套筒（18）。弹簧构件弹性地靠在基座上。柱穿过套筒。该柱具有与弹簧构件接合的一端，并且其一端延伸超过套筒以锁定组合。套筒的一端紧紧地抓住柱子，其另一端阻止锁定装置离开散热器。

67. 发明授权

US07013960B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07013960B2
公开(公告)日：2006-03-21
申请号：US10955286
申请日：2004-09-30
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Tao Li , Bo-Yong Yang
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Tao Li , Bo-Yong Yang
IPC分类号： F28D15/00
CPC分类号： F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink (10), a second heat sink (20) and at least one heat pipe (30). The first heat sink includes a first base (12) and a plurality of fins (14). The second heat sink includes a second base (22) and a plurality of fins (24). The second heat sink is located above and faced to the first heat sink. At least one fin (15) of the first heat sink forms a bifurcated portion (152) at an upper section thereof. A corresponding fin (25) of the second heat sink is fixed to the bifurcated portion of the bifurcated fin via soldering process. The heat pipe interconnects the first base and the second base.
摘要翻译：散热装置包括第一散热器（10），第二散热器（20）和至少一个热管（30）。第一散热器包括第一基座（12）和多个翅片（14）。第二散热器包括第二基座（22）和多个翅片（24）。第二散热器位于第一散热器的上方并面向第一散热器。第一散热器的至少一个翅片（15）在其上部形成分叉部分（152）。第二散热器的相应的翅片（25）通过焊接工艺固定到分叉翅片的分叉部分。热管将第一基座和第二基座相互连接。

68. 发明申请

US20060056159A1 Locking device for heat sink 失效
标题翻译：散热器锁定装置
公开(公告)号：US20060056159A1
公开(公告)日：2006-03-16
申请号：US11216700
申请日：2005-08-31
申请人： Hsieh-Kun Lee , Cui-Jun Lu , Ling-Bo Cao
发明人： Hsieh-Kun Lee , Cui-Jun Lu , Ling-Bo Cao
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A locking device for securing a heat sink to a heat generating electronic device includes a retaining member attached to the heat sink and a plurality of fasteners positioned to the retaining member. The retaining member includes a frame and a plurality of fastening feet integrally formed with the frame by metal extrusion. The frame has an opening for receiving a bottom protrusion of the heat sink therein. Each fastening foot has a slot therein communicating with the opening of the frame and defines a fastening hole. The fasteners are respectively positioned in the fastening holes of the fastening feet of the retaining member.
摘要翻译：用于将散热器固定到发热电子设备的锁定装置包括附接到散热器的保持构件和定位在保持构件上的多个紧固件。保持构件包括框架和通过金属挤压与框架一体地形成的多个紧固脚。框架具有用于接收散热器的底部突起的开口。每个紧固脚具有与框架的开口连通并且限定紧固孔的槽。紧固件分别定位在保持构件的紧固脚的紧固孔中。

69. 发明申请

US20060012961A1 Heat-dissipating fin assembly for heat sink 失效
标题翻译：散热片散热片组件
公开(公告)号：US20060012961A1
公开(公告)日：2006-01-19
申请号：US11135171
申请日：2005-05-23
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (12) arranged side by side. Each fin plate includes a main body (14). First and second flanges (16, 18) extend perpendicularly from opposite edges of the main body of each fin plate. A pair of spaced first bridge-shaped tabs (20) extends perpendicularly from the first flange toward the second flange. A pair of spaced second bridge-shaped tabs (24) extends perpendicularly from the second flange toward the first flange. Projections (28) are stamped from the main body opposing to the first and second bridge-shaped tabs. The tabs of each fin plate are interlocked with the projections of an adjacent fin plate. In this manner, all the fin plates are assembled together. The heat-dissipating fin assembly is thus formed.
摘要翻译：散热翅片组件（1）包括并排布置的多个单独翅片板（12）。每个翅板包括主体（14）。第一和第二凸缘（16,18）从每个翅板的主体的相对边缘垂直延伸。一对隔开的第一桥形突片（20）从第一凸缘朝向第二凸缘垂直延伸。一对间隔开的第二桥形突片（24）从第二凸缘垂直地朝向第一凸缘延伸。突起（28）从与第一和第二桥形突片相对的主体冲压。每个翅板的突片与相邻翅片的突起互锁。以这种方式，将所有翅片组装在一起。由此形成散热翅片组件。

70. 发明申请

US20060012959A1 Heat dissipation device 失效
公开(公告)号：US20060012959A1
公开(公告)日：2006-01-19
申请号：US10892846
申请日：2004-07-16
申请人： Hsieh-Kun Lee , Xue-Wen Peng , Rui-Hua Chen
发明人： Hsieh-Kun Lee , Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50′) thermally connected to the first heat sink, a second heat pipe (60, 60′) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80′) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.

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