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    • 63. 发明申请
    • INTEGRATED EMITTER FORMATION AND PASSIVATION
    • 集成发射体形成和钝化
    • US20100323503A1
    • 2010-12-23
    • US12872272
    • 2010-08-31
    • Virendra V. RanaRobert Z. Bachrach
    • Virendra V. RanaRobert Z. Bachrach
    • H01L21/22
    • H01L21/02532H01L21/02667H01L31/02167H01L31/1804H01L31/1864Y02E10/547Y02P70/521
    • Embodiments of the present invention provide a method for forming an emitter region in a crystalline silicon substrate and passivating the surface thereof by depositing a doped amorphous silicon layer onto the crystalline silicon substrate and thermally annealing the crystalline silicon substrate while oxidizing the surface thereof. In one embodiment, the deposited film is completely converted to oxide. In another embodiment, the doped amorphous silicon layer deposited onto the crystalline silicon substrate is converted into crystalline silicon having the same grain structure and crystal orientation as the underlying crystalline silicon substrate upon which the amorphous silicon was initially deposited during emitter formation. In one embodiment, at least a portion of the converted crystalline silicon is further converted into silicon dioxide during the emitter surface passivation.
    • 本发明的实施方式提供了一种在晶体硅衬底中形成发射极区域并通过在晶体硅衬底上沉积掺杂的非晶硅层并使晶体硅衬底氧化其表面进行热退火而钝化其表面的方法。 在一个实施方案中,沉积的膜完全转化为氧化物。 在另一个实施例中,沉积到晶体硅衬底上的掺杂非晶硅层被转换成具有与在发射极形成期间最初沉积非晶硅的下面的晶体硅衬底相同的晶粒结构和晶体取向的晶体硅。 在一个实施例中,在发射极表面钝化期间,转化的晶体硅的至少一部分进一步转化成二氧化硅。
    • 69. 发明授权
    • Directional crystallization of silicon sheets using rapid thermal processing
    • 使用快速热处理的硅片的定向结晶
    • US07569462B2
    • 2009-08-04
    • US11610049
    • 2006-12-13
    • Virendra V. RanaRobert Z. Bachrach
    • Virendra V. RanaRobert Z. Bachrach
    • H01L21/36
    • H01L31/1804Y02E10/547Y02P70/521
    • The present invention provides a method of recrystallizing a silicon sheet, and in particular recrystallizing a small grained silicon sheet to improve material properties such as grain size and orientation. According to one aspect, the method includes using rapid thermal processing (RTP) to melt and recrystallize one or more entire silicon sheet(s) in one heating sequence. According to another aspect, the method includes directionally controlling a temperature drop across the thickness of the sheet so as to facilitate the production of a small number of nuclei in the melted material and their growth into large grains. According to a further aspect, the invention includes a re-crystallization chamber in an overall process flow that enables high-throughput processing of silicon sheets having desired properties for applications such as photovoltaic modules.
    • 本发明提供了一种使硅片再结晶的方法,特别是重结晶小晶粒硅片以改善诸如晶粒尺寸和取向的材料性能。 根据一个方面,该方法包括使用快速热处理(RTP)在一个加热顺序中熔融和重结晶一个或多个整个硅片。 根据另一方面,该方法包括定向地控制跨越板的厚度的温度降,以便于在熔融材料中产生少量的核并且其生长成大的晶粒。 根据另一方面,本发明包括在整个工艺流程中的再结晶室,其能够对具有用于诸如光伏模块的应用的所需性能的硅片进行高通量处理。
    • 70. 发明授权
    • Fabrication system with extensible equipment sets
    • 具有可扩展设备的制造系统
    • US06698991B1
    • 2004-03-02
    • US09517227
    • 2000-03-02
    • Robert Z. BachrachJohn C. Moran
    • Robert Z. BachrachJohn C. Moran
    • B65G4907
    • H01L21/67271H01L21/67196H01L21/67727H01L21/67775Y10S414/139Y10S414/14
    • A fabrication system is provided which includes a storage apparatus coupled perpendicularly to a branch transport aisle, and one or more environmentally controlled fabrication tools coupled parallel to the branch transport aisle. The fabrication tools can encompass single chamber units or larger cluster tools with sub mainframes. The storage apparatus has one or more load ports which allow transfer of wafer carriers to or from a factory transport agent. A tool loading platform is positioned to receive a wafer carrier from the storage apparatus and to enable the fabrication tool to access a wafer carrier positioned thereon. A plurality of fabrication tools may be coupled beside each other within the equipment set. Each of the plurality of fabrication tools is coupled to the storage apparatus so that a wafer or wafer carrier may be received from or transferred to a factory transport agent and may travel along the storage apparatus to any of the plurality of fabrication tools coupled thereto. A computer program allows input of the number of tools coupled to a storage apparatus, and adjusts wafer carrier delivery based thereon. A method of reducing initial capital investment is also provided.
    • 提供了一种制造系统,其包括垂直于分支运输通道耦合的存储装置,以及一个或多个环境受控的制造工具,其与分支运输通道并联耦合。 制造工具可以包括单室单元或具有子大型机的更大的集群工具。 存储装置具有一个或多个负载端口,其允许将晶片载体传送到工厂运输代理或从工厂运输代理传送。 工具装载平台被定位成从存储装置接收晶片载体并且使得制造工具能够访问位于其上的晶片载体。 多个制造工具可以在设备组内相互耦合。 多个制造工具中的每一个耦合到存储装置,使得晶片或晶片载体可以从工厂运输代理接收或转移到工厂运输代理,并且可以沿着存储设备行进到与其耦合的多个制造工具中的任何一个。 计算机程序允许输入耦合到存储装置的工具的数量,并且基于此来调整晶片载体传送。 还提供了减少初始资本投资的方法。