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61. 发明申请

US20070286252A1 Submount of a multi-beam laser diode module 有权
标题翻译：多光束激光二极管模块的底座
公开(公告)号：US20070286252A1
公开(公告)日：2007-12-13
申请号：US11808174
申请日：2007-06-07
申请人： Kyoung-ho Ha , Tae-hoon Jang , Hyung-kun Kim
发明人： Kyoung-ho Ha , Tae-hoon Jang , Hyung-kun Kim
IPC分类号： H01S5/00
CPC分类号： H01S5/4031 , H01S5/0224 , H01S5/02272 , H01S5/02276 , H01S5/22
摘要： Example embodiments may provide a submount in to which a multi-beam laser diode may be flip-chip bonded and a multi-beam laser diode module including the submount. The submount may include a first submount and a second submount. The first submount may include a first substrate, a plurality of first solder layers formed on the first substrate corresponding to electrodes of the multi-beam laser diode, and a plurality of via holes that may penetrate the first substrate and may be filled with conductive materials to electrically connect to the first solder layers. The electrodes may be bonded to the first solder layers. The second submount may include a second substrate under the first substrate and a plurality of bonding pads corresponding to the number of electrodes formed on the second substrate to electrically connect to the conductive materials filled in the via holes.
摘要翻译：示例性实施例可以提供一个子基座，多子束激光二极管可以被倒装接合到其上，并且包括该子基座的多光束激光二极管模块。子安装板可以包括第一子安装座和第二子安装座。第一基座可以包括第一基板，形成在对应于多光束激光二极管的电极的第一基板上的多个第一焊料层和可以穿透第一基板的多个通孔，并且可以填充导电材料以电连接到第一焊料层。电极可以结合到第一焊料层。第二基座可以包括在第一基板下面的第二基板和对应于形成在第二基板上的电极的数量的多个接合焊盘，以电连接到填充在通孔中的导电材料。

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