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61. 发明专利

JPH0823169A MANUFACTURE OF MULTILAYER CERAMIC WIRING BOARD 失效
公开(公告)号：JPH0823169A
公开(公告)日：1996-01-23
申请号：JP15443494
申请日：1994-07-06
申请人： HITACHI LTD
发明人： YAMAGUCHI AKIRA , KATO MASAYO , SEKIHASHI MASAO
IPC分类号： H05K1/03 , H05K3/46
摘要： PURPOSE:To reduce short circuits or openings of thin film patterns formed on a substrate by making small a void diameter in the outermost layer or in the surface layer of a multilayer ceramic wiring board. CONSTITUTION:Green sheets, whose manufacturing differs for the outermost layer or a surface layer 1 and an internal layer 2, are used. Each green sheet is treated with a through hole 3, and the like. After a prescribed number of laminates are bonded and sintered to make a void 4 in the outermost layer or the surface layer 1 smaller than the void 4 in the inner layer 2. For decreasing the void 4 in the outermost layer or the surface layer 1, there are methods such as dry mixing and adding of powder materials or reduction of the blending rate of flux and a combination of both. Consequently, by making smaller the void diameter in the outermost layer or the surface layer 1 of the multilayer ceramic wiring board, short-circuits and inferior openings of a thin film pattern formed on the multilayer ceramic wiring board can be prevented.

62. 发明专利

JPH0779081A MANUFACTURE OF CERAMIC BOARD 失效
公开(公告)号：JPH0779081A
公开(公告)日：1995-03-20
申请号：JP22311093
申请日：1993-09-08
申请人： HITACHI LTD
发明人： HORIKOSHI MUTSUMI , SEKIHASHI MASAO
IPC分类号： C04B35/64 , H05K3/46
摘要： PURPOSE:To improve hole position accuracy in a hole formation process and remove conductive paste excessively supplied during a hole filling process in the manufacture of a ceramic board by a green sheet lamination method. CONSTITUTION:Each ceramic green sheet 1 has a resin coating 2 and a thin film formed thereon. After hole filling process the thin films 3 are removed, but the resin coatings 2 are laminated together with the green sheets 1. Thus the thin film and the resin coating ensure high accuracy of hole position till the laminating process, and allow the removal of conductive paste excessively supplied during the hole filling process.

63. 发明专利

JPH06316463A POWDERY RAW MATERIAL FOR CERAMIC MULTILAYERED CIRCUIT BOARD AND CRYSTALLITE CERAMIC MULTILAYERED CIRCUIT BOARD 失效
公开(公告)号：JPH06316463A
公开(公告)日：1994-11-15
申请号：JP6454294
申请日：1994-03-07
申请人： HITACHI LTD , CHICHIBU CEMENT KK
发明人： USHIFUSA NOBUYUKI , ISHIHARA SHOSAKU , AMI NORIHIRO , FUNAKOSHI RIE , OGIWARA SATORU , OHASHI MASABUMI , NAGAYAMA KOUSEI , KOBAYASHI FUMIYUKI , SEKIHASHI MASAO , FUJITA TAKESHI , TAGAMI BUNICHI , SENGOKU NORIO , YASUNAGA TAKUMI , EMU JII EMU YUU ISUMAIRU , NAKAI ZENJIRO
IPC分类号： C04B35/18 , H05K1/03 , H05K3/46
摘要： PURPOSE:To make shrinkage in firing isotropic and improve dimensional accuracy by incorporating an aluminum component, a silicon component and an alkaline earth metal component. CONSTITUTION:The powdery ceramic raw material containing 50-60wt.% aluminum component, 50-40wt.% silicon component (expressed in terms of silica) and 0.3-1.5wt.% mullite crystal (expressed in terms of alkaline earth metal oxide) is obtained by mixing a mullite sol mixture obtained by mixing at least an alumina sol with a silica sol with the alkaline earth metal, spraying them into an atmosphere of 1300-1500 deg.C and drying them, A green sheet is obtained by molding a slurry obtained by mixing the powdery raw material with the ceramic powder containing alumina and an additive containing a binder. After a conductive wiring is formed on the green sheet, a ceramic sintered compact is obtained by sintering the green sheet at 1500-1700 deg.C.

64. 发明专利

JPH0553066B2 失效
公开(公告)号：JPH0553066B2
公开(公告)日：1993-08-09
申请号：JP21232585
申请日：1985-09-27
申请人： HITACHI LTD
发明人： WATANABE YUTAKA , KOBAYASHI FUMYUKI , SEKIHASHI MASAO , KURODA SHIGEO , YASUKAWA AKIO , SEKINE SHIGEJIRO
IPC分类号： H01L23/50 , H01L23/495 , H01L23/498 , H05K1/02 , H05K1/18 , H05K3/34

65. 发明专利

JPH057198B2 失效
公开(公告)号：JPH057198B2
公开(公告)日：1993-01-28
申请号：JP15346784
申请日：1984-07-24
申请人： HITACHI LTD
发明人： SANADA SAKAE , SEKIHASHI MASAO
IPC分类号： B41N1/24 , H01L21/52 , H05K3/12

66. 发明专利

JPH053758B2 失效
公开(公告)号：JPH053758B2
公开(公告)日：1993-01-18
申请号：JP2190686
申请日：1986-02-05
申请人： HITACHI LTD
发明人： WATANABE TETSUYA , HARA TOORU , SEKIHASHI MASAO , OOTA TOSHIHIKO
IPC分类号： H01L23/12 , C23C18/18 , H05K3/18 , H05K3/24

67. 发明专利

JPH0234180B2 失效
公开(公告)号：JPH0234180B2
公开(公告)日：1990-08-01
申请号：JP29200587
申请日：1987-11-20
申请人： HITACHI LTD
发明人： OOTSUKA KANJI , SEKIHASHI MASAO , USAMI TAMOTSU , FURUKAWA MICHIAKI , KOBAYASHI FUMYUKI , ISHIDA MASAKATSU
IPC分类号： H01L23/34 , H01L23/04 , H01L23/08 , H01L23/12 , H01L23/36

68. 发明专利

JPH01292850A POSITIONING OF NAIL HEAD TYPE PIN 失效
公开(公告)号：JPH01292850A
公开(公告)日：1989-11-27
申请号：JP12170288
申请日：1988-05-20
申请人： HITACHI LTD
发明人： AMEYA TOSHINORI , SEKIHASHI MASAO
IPC分类号： H01L23/50 , H01R43/02
摘要： PURPOSE:To compensate positional deviation of a pad and to realize accurate soldering of a nail head type pin by locating the nail head type pin whose axis in eccentric to an opposite direction of pad deviation due to contraction of a ceramic substrate, to the pad. CONSTITUTION:Several kinds of eccentric nail head pins 5 are provided corresponding to deviation on a ceramic substrate. Even if the position of a pad 3 on a ceramic substrate is subjected to variability in contraction of the substrate, pin attachment strength can be kept through combination of the pin and an eccentric jig 6 following the deviation of the pad by selecting an eccentricity amount (d) of the eccentric nail head pin 5 and by soldering it. The axis of the eccentric nail head pin 5 used here is eccentric to an opposite direction of the deviation of the pad.

69. 发明专利

JPH0138396B2 失效
公开(公告)号：JPH0138396B2
公开(公告)日：1989-08-14
申请号：JP3922983
申请日：1983-03-11
申请人： HITACHI LTD
发明人： TAGAMI BUNICHI , WATANABE YUTAKA , SEKIHASHI MASAO
IPC分类号： H05K3/24 , H05K1/11 , H05K3/00 , H05K3/46

70. 发明专利

JPS6256665B2 失效
公开(公告)号：JPS6256665B2
公开(公告)日：1987-11-26
申请号：JP1451583
申请日：1983-02-02
申请人： HITACHI LTD
发明人： MYOSHI TETSUO , SEKIHASHI MASAO , OOSAWA YOSHUKI , ISHIDA MASAKATSU
IPC分类号： H01L23/50 , H01L21/48 , H05K3/34

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