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    • 61. 发明授权
    • Method of fabricating a Si3N4/polycide structure using a dielectric sacrificial layer as a mask
    • 使用介电牺牲层作为掩模制造Si 3 N 4 /多晶硅结构的方法
    • US06342452B1
    • 2002-01-29
    • US09573352
    • 2000-05-18
    • Philippe CoronelPascal CostagannaLars Heineck
    • Philippe CoronelPascal CostagannaLars Heineck
    • H01L213065
    • H01L21/76897H01L21/32137H01L21/32139
    • According to the disclosed method, there is provided a structure consisting of a silicon substrate coated with a bottom thin SiO2 layer, a doped polysilicon layer, a refractory metal layer and a top Si3N4 capping layer. Said refractory metal and doped polysilicon layers will form a polycide layer under subsequent thermal treatments. First, a sacrificial layer of a dielectric material such as oxynitride is deposited onto the structure. Oxynitride is impervious to UV radiation and has excellent conformal properties. Then, a layer of a photoresist material is deposited onto the structure and patterned to form a mask. Now the dielectric and top Si3N4 layers are anisotropically etched using the photoresist mask. The mask is stripped and the refractory metal and doped polysilicon layers are anisotropically dry etched down to the SiO2 layer using the patterned dielectric layer as an in-situ hard mask. A conformal layer of Si3N4 is deposited onto the structure, then anisotropically dry etched until the thin SiO2 layer is exposed to form the Si3N4 spacers. Diffusion regions are formed in the substrate by ion implantation. A layer of BPSG is deposited onto the structure and planarized. Contact holes are formed to expose said diffusion regions and filled with a metal to create borderless metal contacts therewith.
    • 根据所公开的方法,提供了由涂覆有底部薄SiO 2层,掺杂多晶硅层,难熔金属层和顶部Si 3 N 4覆盖层的硅衬底组成的结构。 所述难熔金属和掺杂多晶硅层将在随后的热处理下形成多晶硅化物层。 首先,将诸如氮氧化合物的介电材料的牺牲层沉积到该结构上。 氮氧化物不受UV辐射的影响,具有优异的保形特性。 然后,将光致抗蚀剂材料层沉积到结构上并图案化以形成掩模。 现在使用光致抗蚀剂掩模对电介质和顶部Si 3 N 4层进行各向异性蚀刻。 将掩模剥离,并使用图案化的介电层作为原位硬掩模将难熔金属和掺杂多晶硅层各向异性地干蚀刻到SiO 2层。 将Si3N4的保形层沉积在该结构上,然后各向异性干蚀刻直到薄的SiO 2层暴露以形成Si 3 N 4间隔物。 通过离子注入在衬底中形成扩散区。 一层BPSG沉积在结构上并平坦化。 形成接触孔以暴露所述扩散区域并填充金属以与其形成无边界金属接触。
    • 62. 发明授权
    • Method of forming buried straps in DRAMs
    • 在DRAM中形成埋地带的方法
    • US06297089B1
    • 2001-10-02
    • US09447630
    • 1999-11-23
    • Philippe CoronelEdith LattardRenzo Maccagnan
    • Philippe CoronelEdith LattardRenzo Maccagnan
    • H01L218242
    • H01L27/10867
    • A conventional initial deep trench structure consists of a patterned Si3N4 pad layer coated silicon substrate with deep trenches formed therein. The trenches are partially filled with doped polysilicon (POLY1). A dielectric film is interposed between said polysilicon fill and the substrate to create the storage capacitor. A TEOS SiO2 collar layer conformally coats the upper portion of the structure. Now, the TEOS SiO2 is dry etched in a two-step process performed in the same RIE reactor. In the first step, the TEOS SiO2 is etched at least 6 times faster than the Si3N4 (stopping on the Si3N4 pad layer). In the second step, the operating conditions ensure a partially isotropic dry etch, preferably with twice the power and 1.25 times the pressure, thus providing a vertical etch rate 6× the horizontal rate. As a result of this step, the upper part of the silicon substrate in the trench is exposed without damages. Next, N-type dopant is implanted in the upper portion of the silicon substrate to create a doped region. The trench is filled with a layer of doped polysilicon (POLY2) which is planarized by chemical-mechanical polishing down to approximately the Si3N4 pad layer surface and finally recessed down to a depth level substantially coplanar with the silicon surface substrate to create a POLY2 stud. The buried strap is formed by the doped region and POLY2 stud. The above method presents significant advantages in terms of product reliability, throughput improvements and process flow simplification.
    • 常规的初始深沟槽结构由其中形成有深沟槽的经图案化的Si 3 N 4衬垫层包覆的硅衬底组成。 沟槽部分地被掺杂多晶硅(POLY1)填充。 在所述多晶硅填充物和衬底之间插入电介质膜以形成存储电容器。 TEOS SiO2轴环层共形地涂覆结构的上部。 现在,在相同的RIE反应器中进行的两步法中TEOS SiO2被干蚀刻。 在第一步中,TEOS SiO2被蚀刻至少比Si3N4快6倍(停止在Si3N4焊盘层上)。 在第二步中,操作条件确保部分各向同性的干法蚀刻,优选具有两倍的功率和1.25倍的压力,从而提供6倍的水平速率的垂直蚀刻速率。 作为该步骤的结果,沟槽中的硅衬底的上部暴露而不损坏。 接下来,将N型掺杂剂注入到硅衬底的上部以产生掺杂区域。 沟槽填充有一层掺杂的多晶硅(POLY2),其通过化学机械抛光平坦化到大约Si3N4焊盘层表面,最后凹陷到与硅表面衬底基本上共面的深度级以产生POLY2螺柱。 掩埋带由掺杂区域和POLY2螺柱形成。 上述方法在产品可靠性,吞吐量改进和工艺流程简化方面具有显着的优势。
    • 63. 发明授权
    • Apparatus for monitoring the dry etching of a dielectric film to a given
thickness in an integrated circuit
    • 用于在集成电路中监测电介质膜到给定厚度的干蚀刻的装置
    • US5658418A
    • 1997-08-19
    • US536900
    • 1995-09-29
    • Philippe CoronelJean Canteloup
    • Philippe CoronelJean Canteloup
    • G01B11/06C23F4/00H01J37/32H01L21/302H01L21/3065H01L21/66
    • H01J37/32935H01J37/32972
    • Detecting the desired etch end point in the dry etching of a structure that includes a dielectric film formed onto a substrate down to a given thickness Ef. The structure is placed in the chamber of an etching equipment provided with a view-port. A light source illuminates a portion of the structure at a normal angle of incidence through the view-port. The light contains at least two specified wavelengths (L1, L2) whose value is greater than a minimum value equal to 4*N*e (wherein N is the index of refraction and e the thickness error of the dielectric). The reflected light is applied to spectrometers tuned to each specified wavelength, for converting the reflected light into interference signals that are processed and analyzed in a dedicated unit to generate primary signals (S1, S2). An analysis of the primary signals is performed after a predetermined delay. For each wavelength, a pre-selected extremum of the primary signal is detected and a predetermined number of extrema is counted. The counting stops when the last extremum just before Ef is reached. As a result, the distance D between the last extremum and the given thickness is now determined. The etch rate ER is also measured in-situ before the last extremum.
    • 在包括形成在基底上的电介质膜的结构的干蚀刻中检测所需的蚀刻终点,直到给定的厚度Ef。 该结构被放置在设置有视口的蚀刻设备的腔室中。 光源以通常的入射角通过视口来照射结构的一部分。 光包含至少两个指定波长(L1,L2),其值大于等于4 * N * e的最小值(其中N是折射率,e是电介质的厚度误差)。 将反射光应用于调谐到每个指定波长的光谱仪,用于将反射光转换成在专用单元中处理和分析以产生主信号(S1,S2)的干扰信号。 在预定延迟之后执行主信号的分析。 对于每个波长,检测到主信号的预选极值,并计数预定数量的极值。 当到达Ef之前的最后一个极值时,计数停止。 结果,现在确定最后极值与给定厚度之间的距离D. 蚀刻速率ER也是在最后极值之前的原位测量的。