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61. 发明授权

US08203160B2 LED semiconductor body and use of an LED semiconductor body 有权
公开(公告)号：US08203160B2
公开(公告)日：2012-06-19
申请号：US12443155
申请日：2007-09-19
申请人： Reiner Windisch , Ralph Wirth , Stefan Groetsch , Georg Bogner , Guenter Kirchberger , Klaus Streubel
发明人： Reiner Windisch , Ralph Wirth , Stefan Groetsch , Georg Bogner , Guenter Kirchberger , Klaus Streubel
IPC分类号： H01L33/00
摘要： An LED semiconductor body includes a number of at least two radiation-generating active layers. Each active layer has a forward voltage, wherein the number of active layers is adapted to an operating voltage in such a way that the voltage dropped across a series resistor connected in series with the active layers is at most of the same magnitude as a voltage dropped across the LED semiconductor body. The invention furthermore describes various uses of the LED semiconductor body.

62. 发明申请

US20120056235A1 OPTOELECTRONIC MODULE AND METHOD OF PRODUCING AN OPTOELECTRONIC MODULE 有权
标题翻译：光电模块和生产光电模块的方法
公开(公告)号：US20120056235A1
公开(公告)日：2012-03-08
申请号：US13318504
申请日：2010-04-28
申请人： Georg Bogner , Stefan Gruber
发明人： Georg Bogner , Stefan Gruber
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： H05K1/183 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H05K1/181 , H05K2201/10106 , H05K2201/10515 , H05K2201/10674 , H05K2201/10977 , H05K2203/049 , Y02P70/611 , H01L2924/00014
摘要： An optoelectronic module includes a radiation-emitting semiconductor component, an electrical component and a carrier substrate. The carrier substrate includes a top and a bottom, wherein first electrical connections are arranged on the bottom and second electrical connections are arranged on the top. The electrical component is arranged on the top of the carrier substrate and is electrically conductively connected with the first electrical connections. The radiation-emitting semiconductor component is arranged on the side of the electrical component remote from the carrier substrate. The radiation-emitting semiconductor component furthermore includes conductive structures electrically conductively connected with the second electrical connections.
摘要翻译：光电子模块包括辐射发射半导体部件，电子部件和载体基板。载体基板包括顶部和底部，其中第一电连接布置在底部上，而第二电连接布置在顶部。电气部件布置在载体基板的顶部上并与第一电连接导电连接。辐射发射半导体部件布置在远离载体基板的电子部件侧。辐射发射半导体部件还包括与第二电连接导电连接的导电结构。

63. 发明申请

US20110240955A1 LED Semiconductor Body and Use of an LED Semiconductor Body 有权
标题翻译： LED半导体器件和LED半导体器件的使用
公开(公告)号：US20110240955A1
公开(公告)日：2011-10-06
申请号：US12443155
申请日：2007-09-19
申请人： Reiner Windisch , Ralph Wirth , Stefan Groetsch , Georg Bogner , Guenter Kirchberger , Klaus Streubel
发明人： Reiner Windisch , Ralph Wirth , Stefan Groetsch , Georg Bogner , Guenter Kirchberger , Klaus Streubel
IPC分类号： H01L27/15
CPC分类号： H01L27/15 , H01L24/24 , H01L25/0756 , H01L25/167 , H01L33/08 , H01L2224/32145 , H01L2924/0002 , H01L2924/12036 , H01L2924/12041 , H01L2924/00
摘要： An LED semiconductor body includes a number of at least two radiation-generating active layers. Each active layer has a forward voltage, wherein the number of active layers is adapted to an operating voltage in such a way that the voltage dropped across a series resistor connected in series with the active layers is at most of the same magnitude as a voltage dropped across the LED semiconductor body. The invention furthermore describes various uses of the LED semiconductor body.
摘要翻译： LED半导体体包括多个至少两个辐射生成有源层。每个有源层具有正向电压，其中有源层的数量适应于工作电压，使得跨过与有源层串联连接的串联电阻器上的电压与电压下降最多相同的大小跨越LED半导体体。本发明还描述了LED半导体本体的各种用途。

64. 发明申请

US20110121336A1 Arrangement Comprising at Least one Optoelectronics Semiconductor Component 有权
标题翻译：最少一个光电子半导体组件的安排
公开(公告)号：US20110121336A1
公开(公告)日：2011-05-26
申请号：US12808165
申请日：2008-11-19
申请人： Georg Bogner , Stefan Gruber , Michael Zitzlsperger
发明人： Georg Bogner , Stefan Gruber , Michael Zitzlsperger
IPC分类号： H01L33/58
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/44 , H01L2224/48091 , H01L2224/48464 , H01L2924/00014
摘要： The invention relates to an arrangement comprising at least one optoelectronic semiconductor component (101), said arrangement comprising a carrier element arrangement (108) suitable for carrying the at least one optoelectronic semiconductor component. The arrangement comprises a housing body (103) consisting of a light-absorbent plastic material, which is arranged on the carrier element arrangement. The housing body comprises a raised area (104) and a set-back area (105) between which an inclined flank (115) is formed. The set-back area extends up to the optoelectronic semiconductor component, in order to reduce reflections.
摘要翻译：本发明涉及一种包括至少一个光电子半导体部件（101）的装置，所述装置包括适于承载至少一个光电子半导体部件的载体元件装置（108）。该装置包括由吸收塑料材料组成的壳体（103），该吸收塑料材料布置在载体元件装置上。壳体包括形成有倾斜侧面（115）的凸起区域（104）和回填区域（105）。后置区延伸到光电子半导体元件，以减少反射。

65. 发明授权

US07837371B2 Light source 有权
标题翻译：光源
公开(公告)号：US07837371B2
公开(公告)日：2010-11-23
申请号：US12343433
申请日：2008-12-23
申请人： Stefan Grötsch , Georg Bogner
发明人： Stefan Grötsch , Georg Bogner
IPC分类号： F21V7/04
CPC分类号： H01L33/58 , G03B21/2033 , G03B21/208 , H04N9/3152 , H04N9/3164
摘要： A light source, such as for a projection system, having a plurality of semiconductor chips and at least two different, electromagnetic-radiation-emitting chip types with different emission spectra, each semiconductor chip having a chip coupling-out area through which radiation is coupled out. Furthermore, the light source has a plurality of primary optical elements, each semiconductor chip being assigned a primary optical element, which in each case has a light input and a light output and reduces the divergence of at least part of the radiation emitted by the semiconductor chip during the operation thereof. The semiconductor chips with the primary optical elements are arranged in at least two groups that are spatially separate from one another, with the result that the groups emit separate light cones during operation of the semiconductor chips. The separate light cones of the groups are superposed by means of a secondary optical arrangement to form a common light cone.
摘要翻译：诸如用于投影系统的光源，具有多个半导体芯片和具有不同发射光谱的至少两种不同的电磁辐射发射芯片类型，每个半导体芯片具有芯片耦合输出区域，辐射被耦合到该区域出来此外，光源具有多个主要光学元件，每个半导体芯片被分配一个主要光学元件，其在每种情况下具有光输入和光输出，并且减少半导体发射的辐射的至少一部分的发散度芯片。具有主要光学元件的半导体芯片被布置成在空间上彼此分离的至少两组，结果是在半导体芯片的操作期间这些组发射单独的光锥。通过次级光学装置将组的分开的光锥叠加以形成公共的光锥。

66. 发明授权

US07601550B2 Methods for producing a light emitting semiconductor body with a luminescence converter element 有权
标题翻译：具有发光转换元件的发光半导体体的制造方法
公开(公告)号：US07601550B2
公开(公告)日：2009-10-13
申请号：US10204576
申请日：2001-03-02
申请人： Georg Bogner , Günter Waitl , Alexandra Debray
发明人： Georg Bogner , Günter Waitl , Alexandra Debray
IPC分类号： H01L21/00
CPC分类号： H01L33/501 , H01L2933/0041
摘要： The invention describes two methods of fabricating semiconductor components in which a luminescence conversion element is applied directly to the semiconductor body (1). In the first method, a suspension (4) containing a bonding agent and at least one luminescent material (5) is applied to the semiconductor body (1) in layers. In the next step the solvent escapes, leaving only the luminescent material (5) with the bonding agent on the semiconductor body.In the second method, the semiconductor body (1) is provided with a layer (6) of bonding agent to which the luminescent material (5) is applied directly.
摘要翻译：本发明描述了制造半导体元件的两种方法，其中将发光转换元件直接应用于半导体本体（1）。在第一种方法中，将含有粘合剂和至少一种发光材料（5）的悬浮液（4）分层地施加到半导体本体（1）上。在下一步骤中，溶剂逸出，仅在半导体本体上仅留下具有粘合剂的发光材料（5）。在第二种方法中，半导体本体（1）设置有直接施加发光材料（5）的粘合剂层（6）。

67. 发明申请

US20090230420A1 Housing Body and Method for Production Thereof 有权
标题翻译：住房及其生产方法
公开(公告)号：US20090230420A1
公开(公告)日：2009-09-17
申请号：US11921368
申请日：2006-05-05
申请人： Georg Bogner , Karlheinz Arndt
发明人： Georg Bogner , Karlheinz Arndt
IPC分类号： H01L33/00 , H01L23/48 , H01L21/50
CPC分类号： H01L33/62 , H01L23/49805 , H01L24/48 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2924/00014 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/12044 , H01L2924/181 , H01L2924/3025 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A package body (1) with an upper side (2), with an underside (22), opposite from the upper side (2), and with a side surface, which connects the upper side (2) and the underside (22) and is provided as a mounting surface (19), the package body (1) having a plurality of layers (8) which contain a ceramic material, and a main direction of extent of the layers (23, 24, 25) running obliquely in relation to the mounting surface (19). Furthermore, a method for producing a package body (1) is provided.
摘要翻译：具有上侧（2）的包装体（1），具有与上侧（2）相对的下侧（22），以及连接上侧（2）和下侧（22）的侧表面，并且被设置为安装表面（19），所述封装主体（1）具有多个层（8），所述多个层（8）包含陶瓷材料，并且所述层（23,24,25）的倾斜方向与安装表面（19）的关系。此外，提供了一种用于生产包装体（1）的方法。

68. 发明授权

US07581860B2 Headlight and headlight element 有权
标题翻译：头灯和头灯元件
公开(公告)号：US07581860B2
公开(公告)日：2009-09-01
申请号：US10551412
申请日：2004-03-24
申请人： Georg Bogner , Stefan Grötsch , Joachim Reill
发明人： Georg Bogner , Stefan Grötsch , Joachim Reill
IPC分类号： F21V1/00
CPC分类号： B60Q1/04 , F21S41/143 , F21S41/24 , F21S41/28 , F21S41/663 , F21Y2115/10 , H01L33/58 , H01L33/60 , Y10S362/80
摘要： A headlight having a multitude of headlight elements, which each have at least one semiconductor chip which emits electromagnetic radiation; a primary optics element, which reduces the divergence of the light which is incident through the light input; and at least one headlight element output, which emits a part of the headlight light from the headlight element. At least some of the headlight element outputs are arranged in at least two groups in such a way that the arrangement of at least one of the groups and/or at least overall arrangement of headlight element outputs of multiple groups corresponds essentially to a desired emission characteristic of the headlight, in that, in particular, it has a shape which corresponds essentially to the cross-sectional shape of a desired headlight beam, wherein the semiconductor chips which belong to the headlight element outputs of one group can each be operated independently of other semiconductor chips. A headlight element is disclosed which is suitable for a headlight such as this.
摘要翻译：具有多个头灯元件的头灯，每个头灯元件具有发射电磁辐射的至少一个半导体芯片; 主要光学元件，其减少通过光输入入射的光的发散; 以及至少一个头灯元件输出，其从头灯元件发射一部分前照灯光。至少一些前灯元件输出以至少两组布置成使得多个组中的组中的至少一个组和/或至少总体布置的大灯组件输出的布置基本上对应于期望的发射特性特别地，其具有基本上对应于期望的前灯光束的横截面形状的形状，其中属于一组的前灯元件输出的半导体芯片可以分别独立于其它部件操作半导体芯片。公开了适合于诸如此类的头灯的头灯元件。

69. 发明申请

US20090201698A1 Illumination device 有权
标题翻译：照明装置
公开(公告)号：US20090201698A1
公开(公告)日：2009-08-13
申请号：US11915780
申请日：2006-05-19
申请人： Gunnar Klick , Hulbert Ott , Franz Schellhorn , Mario Wanninger , Georg Bogner
发明人： Gunnar Klick , Hulbert Ott , Franz Schellhorn , Mario Wanninger , Georg Bogner
IPC分类号： H01L33/00 , G09F13/04 , G02F1/295
CPC分类号： G02B6/0018 , G02B6/002 , G02B6/0028 , G02B6/0068
摘要： An illumination device is specified which has a light source (1) suitable for coupling divergent electromagnetic radiation (6) into an optical waveguide (2), the electromagnetic radiation (6) being guided in the optical waveguide (2) on the basis of total reflection the optical waveguide (2) being suitable for changing a main radiating direction (17) of the electromagnetic radiation (6), and the optical waveguide (2) being formed in one piece. Light-emitting diodes are preferably used as the light source (1). The illumination device is particularly well suited to the backlighting of displays.
摘要翻译：一种照明装置，其具有适于将发散电磁辐射（6）耦合到光波导（2）中的光源（1），所述电磁辐射（6）基于总共在光波导（2）中被引导反射，光波导（2）适于改变电磁辐射（6）的主辐射方向（17），光波导（2）形成为一体。优选使用发光二极管作为光源（1）。照明装置特别适合于显示器的背光。

70. 发明授权

US07550827B2 Conductor frame for an electronic component and method for the production thereof 有权
标题翻译：电子部件用导体框架及其制造方法
公开(公告)号：US07550827B2
公开(公告)日：2009-06-23
申请号：US11576054
申请日：2005-08-08
申请人： Karlheinz Arndt , Huey Ling Rena Lim , Georg Bogner , Stefan Gruber , Markus Schneider
发明人： Karlheinz Arndt , Huey Ling Rena Lim , Georg Bogner , Stefan Gruber , Markus Schneider
IPC分类号： H01L23/495 , H01L33/00
CPC分类号： H01L23/49541 , H01L23/495 , H01L23/49562 , H01L2924/0002 , Y10T29/49174 , H01L2924/00
摘要： Disclosed is a leadframe lot at least one electronic component, composing at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining parallel offset between the retention tab and the adjacent region of the lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.
摘要翻译：公开了一种用于至少一个电子部件的引线框架，包括至少两个电引线元件，每个电引线元件包括至少一个电引线接线片和至少一个保持接线片。在所述至少一个保持突片和所述引线元件之间设置有限定所述保持突片和所述引线元件的相邻区域之间的平行偏移的刻痕。在引线元件和电引线接线片之间限定了额外的平行偏移，使得保持接线片和电引线接头位于共同的平面内。该分数使得能够容易地移除保持片，而不需要在引线元件和保持片之间存在不利的冲压间隙。

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