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    • 64. 发明授权
    • Non-volatile memory cells and methods for fabricating non-volatile memory cells
    • 非易失性存储单元和用于制造非易失性存储单元的方法
    • US07352018B2
    • 2008-04-01
    • US11187693
    • 2005-07-22
    • Michael SpechtFranz HofmannJohannes Luyken
    • Michael SpechtFranz HofmannJohannes Luyken
    • H01L27/10H01L29/73
    • H01L27/11568H01L21/84H01L27/115H01L27/1203H01L29/785
    • The invention relates to a method for fabricating stacked non-volatile memory cells. Further, the invention relates to stacked non-volatile memory cells. The invention particularly relates to the field of non-volatile NAND memories having non-volatile stacked memory cells. The stacked non-volatile memory cells are formed on a semiconductor wafer, having a bulk semi-conductive substrate and an SOI semi-conductive layer and are arranged as a bulk FinFET transistor and an SOI FinFet transistor being arranged on top of the bulk FinFET transistor. Both the FinFET transistor and the SOI FinFet transistor are attached to a common charge-trapping layer. A word line with sidewalls is arranged on top of said patterned charge-trapping layer and a spacer oxide layer is arranged on the sidewalls of said word line.
    • 本发明涉及一种用于制造堆叠的非易失性存储单元的方法。 此外,本发明涉及堆叠的非易失性存储单元。 本发明特别涉及具有非易失性堆叠存储单元的非易失性NAND存储器的领域。 层叠的非易失性存储单元形成在具有体半导体基板和SOI半导电层的半导体晶片上,并且被布置为体FinFET晶体管,并且SOI FinFet晶体管布置在体FinFET晶体管的顶部 。 FinFET晶体管和SOI FinFet晶体管都连接到公共的电荷俘获层。 具有侧壁的字线被布置在所述图案化的电荷捕获层的顶部上,并且间隔氧化物层被布置在所述字线的侧壁上。
    • 66. 发明授权
    • Semiconductor memory with vertical memory transistors and method for fabricating it
    • 具有垂直存储晶体管的半导体存储器及其制造方法
    • US07265413B2
    • 2007-09-04
    • US11073205
    • 2005-03-05
    • Franz HofmannErhard LandgrafRichard Johannes LuykenThomas SchulzMichael Specht
    • Franz HofmannErhard LandgrafRichard Johannes LuykenThomas SchulzMichael Specht
    • H01L29/792
    • H01L21/28282H01L29/66833H01L29/792H01L29/7923H01L29/7926
    • The invention relates to a semiconductor memory having a multiplicity of memory cells and a method for forming the memory cells. The semiconductor memory generally includes a semiconductor layer arranged on a substrate surface that includes a normally positioned step between a deeper region and a higher region. The semiconductor memory further includes doped contact regions, channel regions, a trapping layer arranged on a gate oxide layer, and at least one gate electrode. The method for forming the memory cells includes patterning a semiconductor layer to form a deeper semiconductor region and a higher semiconductor region having a step positioned between the regions. The method further includes forming a first oxide layer and a trapping layer, and then removing portions of the trapping layer and the first oxide layer and applying a second oxide layer at least regions of a doped region, the trapping layer, and the step area, and applying a gate electrode to the second oxide layer and doping, at least in regions, of the deeper semiconductor region and the higher semiconductor region to form a deeper contact region and a higher contact region.
    • 本发明涉及具有多个存储单元的半导体存储器和用于形成存储单元的方法。 半导体存储器通常包括布置在衬底表面上的半导体层,其包括较深区域和较高区域之间的正常定位的台阶。 半导体存储器还包括掺杂接触区域,沟道区域,布置在栅极氧化物层上的俘获层和至少一个栅电极。 形成存储单元的方法包括图案化半导体层以形成较深的半导体区域和具有位于该区域之间的台阶的较高半导体区域。 该方法还包括形成第一氧化物层和俘获层,然后去除俘获层和第一氧化物层的部分,并且至少在掺杂区域,俘获层和台阶区域的区域上施加第二氧化物层, 以及向所述第二氧化物层施加栅电极,并且至少在所述较深半导体区域和所述较高半导体区域的区域中掺杂以形成更深的接触区域和更高的接触区域。
    • 67. 发明申请
    • Production method for a FinFET transistor arrangement, and corresponding FinFET transistor arrangement
    • US20070158756A1
    • 2007-07-12
    • US11649470
    • 2007-01-04
    • Lars DreeskornfeldFranz HofmannJohannes LuykenMichael Specht
    • Lars DreeskornfeldFranz HofmannJohannes LuykenMichael Specht
    • H01L29/76
    • H01L21/823412H01L21/823437H01L29/66818H01L29/7851
    • The present invention provides a production method for a FinFET transistor arrangement, and a corresponding FinFET transistor arrangement. The method comprises the following steps: provision of a substrate (106, 108); formation of an active region (1) on the substrate, said active region having a source region (114), a drain region (116) and an intervening fin-like channel region (113b′; 113b″) for each individual FinFET transistor; formation of a gate dielectric (11) and a gate region (13, 14, 15) over the fin-like channel region (113b′; 113b″) for each individual FinFET transistor; the formation of the fin-like channel region (113b′; 113b″) having the following steps: formation of a hard mask (S1-S4) on the active region (1), said hard mask having a pad oxide layer (30), an overlying pad nitride layer (50) and nitride sidewall spacers (7); anisotropic etching of the active layer (1) using the hard mask (S1-S4) for the formation of STI trenches (G1-G5); filling of the STI trenches (G1-G5) with an STI oxide filling (9); polishing-back of the STI oxide filling (9) as far as the top side of the hard mask (S1-S4); etching-back of the polished-back STI oxide filling (9) as far as a residual height (h′) in the STI trenches (G1-G5); selective removal of the pad nitride layer (50) and the nitride sidewall spacers (7) with respect to the pad oxide layer (30), the etched-back STI oxide filling (9) and the active region (1) for the formation of a modified hard mask (S1′-S4′); anisotropic etching of the active layer (1) using the modified hard mask (S1′-S4′) for the formation of widened STI trenches (G1′-G5′), the fin-like channel regions (113b′; 113b″) of the active region (1) remaining for each individual FinFET transistor.
    • 70. 发明申请
    • Semiconductor memory device
    • 半导体存储器件
    • US20060267064A1
    • 2006-11-30
    • US11139977
    • 2005-05-31
    • Wolfgang RosnerFranz HofmannMichael SpechtMartin Stadele
    • Wolfgang RosnerFranz HofmannMichael SpechtMartin Stadele
    • H01L29/94
    • H01L27/10873H01L21/7624H01L27/10802H01L27/1087H01L29/66181H01L29/7841H01L29/945
    • The semiconductor memory device comprises a plurality of memory cells. Each memory cell comprises a respective transistor and a respective capacitor unit. The transistor comprises a transistor body of a first conductivity type, a drain area and a source area each having a second conductivity type, the drain area and source area are embedded in the transistor body on a first surface of the transistor body, and a gate structure having a gate dielectric layer and a gate electrode, the gate structure is arranged between the drain area and the source area. An isolation trench is arranged adjacent to said transistor body, having a dielectric layer and a conductive material, wherein the isolation trench is at least partially filled with the conductive material. The conductive material is isolated by said dielectric layer from the transistor body. The capacitor unit is formed by the transistor body representing a first electrode and the conductive material representing the second electrode.
    • 半导体存储器件包括多个存储单元。 每个存储单元包括相应的晶体管和相应的电容器单元。 晶体管包括第一导电类型的晶体管体,漏极区域和源极区域,每个具有第二导电类型,漏极区域和源极区域嵌入在晶体管本体的第一表面上,并且栅极 具有栅极介电层和栅电极的结构,栅极结构布置在漏极区域和源极区域之间。 绝缘沟槽被布置成与所述晶体管本体相邻,具有电介质层和导电材料,其中隔离沟槽至少部分地被导电材料填充。 导电材料通过所述介电层与晶体管本体隔离。 电容器单元由表示第一电极的晶体管体和表示第二电极的导电材料形成。