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    • 61. 发明授权
    • Mobile computing and communication system
    • 移动计算和通信系统
    • US06206480B1
    • 2001-03-27
    • US09048830
    • 1998-03-25
    • Eric Thompson
    • Eric Thompson
    • H05K500
    • G06F1/1628
    • A dual, or single, case mobile computing and communication system with rapid mobility for usage in the field, consisting of a component mounting mechanism, a mobile computer and peripheral data switching micronetwork, an enclosed modular peripheral power system, and a plug-in modular component card system. The universal mounting mechanism holds multiple peripherals in such a way that they can be easily and quickly installed and removed from the case configuration. It locks the peripherals so they do not move during transportation. It is also low in profile so it does not obstruct the use of the items being held. The system offers rapid reaction mobility, by isolating and securing the many data and power cables necessary to connect up to 8 peripherals. The data part of this micronetwork includes data switching to connect the single computer's parallel and serial interface to these peripherals. The power system is modular and supports unique power outputs to multiple devices from either a single AC or DC input. The invention combines multiple modular component cards that snap together allowing ease of use and quick field exchange of panels for the system.
    • 一种具有快速移动性的双或单一案例移动计算和通信系统,用于现场使用,包括组件安装机构,移动计算机和外围数据交换微网络,封闭的模块化外围电源系统和插件模块 组件卡系统。 通用安装机构可以以多种外围设备的方式轻松快速地安装和拆除外壳配置。 它锁定外围设备,使其在运输过程中不会移动。 它的外形也很低,因此不妨碍使用被保持的物品。 该系统通过隔离和固定连接多达8个外围设备所需的许多数据和电源电缆,提供快速的反应移动性。 该微网的数据部分包括将单个计算机的并行和串行接口连接到这些外设的数据切换。 电力系统是模块化的,并且可以通过单个AC或DC输入向多个设备提供独特的电源输出。 本发明将多个组合卡组合在一起,使得易于使用和快速的系统面板交换。
    • 65. 发明授权
    • Structures and methods for RF de-embedding
    • RF去嵌入的结构和方法
    • US08917083B2
    • 2014-12-23
    • US12953810
    • 2010-11-24
    • Robert A. GrovesNing LuChristopher S. PutnamEric Thompson
    • Robert A. GrovesNing LuChristopher S. PutnamEric Thompson
    • G01R5/14G01R27/28H01L21/66G01R35/00
    • G01R27/28G01R23/20G01R35/00H01L22/34H01L2924/0002H01L2924/00
    • Electrical structures, methods, and computer program products for radio frequency (RF) de-embedding are provided. A structure includes a first test device, a first through structure corresponding to the first test device, and a first open structure corresponding to the first test device. The structure also includes a second test device having at least one different physical dimension than the first test device but otherwise identical to the first test device, a second through structure corresponding to the second test device, and a second open structure corresponding to the second test device. A method includes determining a first electrical parameter of the first test device in a first DUT structure and a second electrical parameter of the second test device in a second DUT structure based on measured electrical parameters of the first and the second DUT structures, through structures, and open structures.
    • 提供射频(RF)去嵌入的电气结构,方法和计算机程序产品。 一种结构包括第一测试装置,对应于第一测试装置的第一穿透结构以及对应于第一测试装置的第一开放结构。 该结构还包括具有与第一测试装置至少一个不同的物理尺寸但与第一测试装置相同的第二测试装置,对应于第二测试装置的第二穿透结构以及对应于第二测试的第二开放结构 设备。 一种方法包括:基于第一和第二DUT结构的测量电参数,通过结构,确定第二DUT结构中的第一测试设备的第一测试设备的第一电参数和第二DUT结构中的第二电参数, 和开放结构。