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61. 发明申请

US20100075372A1 METHOD FOR DEPARAFFINIZATION OF PARAFFIN-EMBEDDED SPECIMEN AND METHOD FOR ANALYSIS OF PARAFFIN-EMBEDDED SPECIMEN 审中-公开
标题翻译： PARAFFIN嵌入样本的分离方法和PARAFFIN嵌入样本分析方法
公开(公告)号：US20100075372A1
公开(公告)日：2010-03-25
申请号：US12443437
申请日：2007-09-21
申请人： Taka-aki Sato , Yutaka Aoki , Takashi Shimada , Atsuhiko Toyama
发明人： Taka-aki Sato , Yutaka Aoki , Takashi Shimada , Atsuhiko Toyama
IPC分类号： G01N1/28
CPC分类号： G01N1/30 , G01N1/36 , H01J49/0004
摘要： The present invention provides a method for deparaffinization useful for mass spectrometric imaging from a paraffin-embedded specimen. A method for deparaffinization of paraffin-embedded specimen comprising the steps of: exposing a biological sample by subjecting a specimen in which the biological sample is embedded in paraffin, to an organic solvent that is compatible with the paraffin under heating condition, to make the paraffin be melted and dissolved in the organic solvent; and removing the paraffin from the specimen by separating the organic solvent dissolving the paraffin, from the exposed biological sample.
摘要翻译：本发明提供了可用于石蜡包埋样品的质谱成像的脱蜡方法。一种石蜡包埋试样的脱蜡方法，其特征在于，包括以下步骤：使生物样品在石蜡中包埋的样品在加热条件下与石蜡相容的有机溶剂进行曝光，使石蜡熔化并溶解在有机溶剂中; 通过从暴露的生物样品中分离溶解石蜡的有机溶剂，从样品中除去石蜡。

62. 发明申请

US20100038529A1 METHOD OF PREPARING SAMPLE FOR MATRIX-ASSISTED LASER DESORPTION IONIZATION MASS SPECTROMETRY AND MATRIX-ASSISTED LASER DESORPTION IONIZATION MASS SPECTROMETRY 有权
标题翻译：制备基质辅助激光解吸浓度大分子光谱和基质辅助激光解吸浓度质谱的方法
公开(公告)号：US20100038529A1
公开(公告)日：2010-02-18
申请号：US12443461
申请日：2007-09-21
申请人： Taka-aki Sato , Yutaka Aoki , Takashi Shimada , Atsuhiko Toyama
发明人： Taka-aki Sato , Yutaka Aoki , Takashi Shimada , Atsuhiko Toyama
IPC分类号： H01J49/02 , B01D59/44
CPC分类号： H01J49/164 , G01N1/2806 , G01N1/2813 , H01J49/0004 , H01J49/0418
摘要： It is intended to provide a method of preparing sample for matrix-assisted laser desorption/ionization mass spectrometry using a matrix capable of generating preferred crystals that cause effective ionization of a molecule to be measured. A method of preparing a sample for matrix-assisted laser desorption/ionization mass spectrometry comprising the steps of: preparing a solution of 2,5-dihydroxybenzoic acid of 40 mg/mL to saturated concentration as a matrix solution; and dispensing the matrix solution to a sample to be analyzed by using an inkjet mechanism, to crystallize the 2,5-dihydroxybenzoic acid.
摘要翻译：旨在提供一种使用能够产生优选的晶体的基质辅助激光解吸/电离质谱法的样品的制备方法，所述晶体能够引起待测分子的有效电离。一种制备用于基体辅助激光解吸/电离质谱的样品的方法，包括以下步骤：以饱和浓度制备40mg / mL的2,5-二羟基苯甲酸溶液作为基质溶液; 并通过使用喷墨机构将基质溶液分配到要分析的样品上，使2,5-二羟基苯甲酸结晶。

63. 发明申请

US20090140911A1 Radar apparatus and mounting structure for radar apparatus 有权
标题翻译：雷达装置的雷达装置和安装结构
公开(公告)号：US20090140911A1
公开(公告)日：2009-06-04
申请号：US12289011
申请日：2008-10-17
申请人： Yusuke Kato , Akihisa Fujita , Yutaka Aoki
发明人： Yusuke Kato , Akihisa Fujita , Yutaka Aoki
IPC分类号： G01S7/03 , G01S13/93
CPC分类号： G01S13/931 , G01S7/034 , G01S2013/9375 , G01S2013/9389 , H01Q1/3233 , H01Q3/40
摘要： The radar apparatus includes an antenna device including a transmitting antenna and a receiving antenna, a main body which generates a radar wave, transmits the radar wave from the transmitting antenna, and receives the radar wave reflected from an obstacle to be detected by the receiving antenna, and a cover member covering the main body and the antenna device on a side of a transmission direction of the radar wave and located out of contact with the main body and the antenna device. The cover member has a transmission portion allowing the radar wave to pass therethrough, a surface of the transmission portion facing the antenna device being inclined by an angle greater than 3 degrees with respect to an antenna surface of the receiving antenna.
摘要翻译：该雷达装置包括天线装置，包括发射天线和接收天线，产生雷达波的主体，发射天线的雷达波，并接收由接收天线要检测的障碍物反射的雷达波以及覆盖所述主体和所述天线装置的覆盖部件，所述盖体在所述雷达波的传输方向的一侧并且与所述主体和所述天线装置不接触。盖构件具有允许雷达波通过的传输部分，面向天线装置的传输部分的表面相对于接收天线的天线表面倾斜大于3度的角度。

64. 发明申请

US20080115962A1 Suspension board with circuit and producing method thereof 有权
标题翻译：具有电路的悬挂板及其制造方法
公开(公告)号：US20080115962A1
公开(公告)日：2008-05-22
申请号：US11984733
申请日：2007-11-21
申请人： Noriyuki Juni , Kazunori Mune , Sazzadur Rahman Khan , Toshiki Naito , Yutaka Aoki
发明人： Noriyuki Juni , Kazunori Mune , Sazzadur Rahman Khan , Toshiki Naito , Yutaka Aoki
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： G11B5/4826 , G02B6/1221 , G02B6/43 , G11B5/4833 , G11B5/4853 , G11B5/486 , G11B2005/0021 , H05K1/0274 , H05K1/056 , Y10T29/49124
摘要： A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an optical waveguide.
摘要翻译：具有电路的悬挂板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在绝缘基底层上以覆盖导电图案的绝缘覆盖层，和光波导。

65. 发明授权

US07312684B2 Semiconductor device 有权
公开(公告)号：US07312684B2
公开(公告)日：2007-12-25
申请号：US11639747
申请日：2006-12-15
申请人： Yutaka Aoki
发明人： Yutaka Aoki
IPC分类号： H01F5/00
CPC分类号： H01F17/0006 , H01F2017/0046 , H01F2017/0073 , H01L23/5227 , H01L27/016 , H01L28/10 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device includes a semiconductor substrate, an insulating film formed on the semiconductor substrate, and a thin-film inductor element which is formed on the insulating film, and which includes first and second terminals and a conductive layer formed into a spiral shape between the first and second terminals so as to have a plurality of turns and at least one intersection. The conductive layer includes (i) a first conductor layer formed on the semiconductor substrate, and (ii) a second conductor layer which is formed on the insulating film, intersects the first conductor layer via the insulating film at the intersection. The thin-film inductor element has an arrangement in which the first and second conductor layers are symmetrically arranged in directions from an intermediate point between the first and second terminals along the longitudinal direction of the conductive layer to the first and second terminals.

66. 发明申请

US20070139154A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20070139154A1
公开(公告)日：2007-06-21
申请号：US11639747
申请日：2006-12-15
申请人： Yutaka Aoki
发明人： Yutaka Aoki
IPC分类号： H01F27/28
CPC分类号： H01F17/0006 , H01F2017/0046 , H01F2017/0073 , H01L23/5227 , H01L27/016 , H01L28/10 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device includes a semiconductor substrate, an insulating film formed on the semiconductor substrate, and a thin-film inductor element which is formed on the insulating film, and which includes first and second terminals and a conductive layer formed into a spiral shape between the first and second terminals so as to have a plurality of turns and at least one intersection. The conductive layer includes (i) a first conductor layer formed on the semiconductor substrate, and (ii) a second conductor layer which is formed on the insulating film, intersects the first conductor layer via the insulating film at the intersection. The thin-film inductor element has an arrangement in which the first and second conductor layers are symmetrically arranged in directions from an intermediate point between the first and second terminals along the longitudinal direction of the conductive layer to the first and second terminals.
摘要翻译：半导体器件包括半导体衬底，形成在半导体衬底上的绝缘膜和形成在绝缘膜上的薄膜电感器元件，并且包括第一和第二端子以及形成在螺旋形状之间的导电层第一和第二端子，以便具有多个匝和至少一个交点。导电层包括（i）形成在半导体衬底上的第一导体层，和（ii）形成在绝缘膜上的第二导体层在交叉点处经由绝缘膜与第一导体层相交。薄膜电感器元件具有这样的布置，其中第一和第二导体层沿着从导电层的纵向方向到第一和第二端子的第一和第二端子之间的中间点对称地布置。

67. 发明申请

US20060276152A1 Radio wave receiving system, imaging system and radio wave receiving method 失效
标题翻译：无线电波接收系统，成像系统和无线电波接收方法
公开(公告)号：US20060276152A1
公开(公告)日：2006-12-07
申请号：US11417350
申请日：2006-05-03
申请人： Yutaka Aoki
发明人： Yutaka Aoki
IPC分类号： H04B17/00 , H04B1/06
CPC分类号： G01S13/89
摘要： The present disclosure relates to a radio wave receiving system. The system includes an antenna that is operable for receiving a received signal. The received signal contains information. The radio wave receiving system also includes a reference signal generator that is operable for generating a reference signal. In addition, a selective output device is included that is operable for selectively outputting the received signal and the reference signal to a transmission path. The system also includes an information acquiring device that is operable for generating a signal component indicating a signal level difference between the received signal and the reference signal. The information acquiring device is further operable for acquiring the information from the signal component.
摘要翻译：本公开涉及无线电波接收系统。该系统包括可操作用于接收接收信号的天线。接收到的信号包含信息。无线电波接收系统还包括可用于产生参考信号的参考信号发生器。此外，包括可选择地输出设备以选择性地将接收的信号和参考信号输出到传输路径。该系统还包括信息获取装置，用于产生指示接收信号和参考信号之间的信号电平差的信号分量。信息获取装置还可用于从信号分量获取信息。

68. 发明申请

US20060220974A1 High frequency module and array of the same 有权
标题翻译：高频模块和阵列相同
公开(公告)号：US20060220974A1
公开(公告)日：2006-10-05
申请号：US11393035
申请日：2006-03-30
申请人： Kunio Sakakibara , Yutaka Aoki
发明人： Kunio Sakakibara , Yutaka Aoki
IPC分类号： H01Q13/00
CPC分类号： H01Q13/0225 , H01Q21/064
摘要： A high frequency module for converting a high frequency wave in a free space to a high frequency wave in a planar waveguide includes two metal plates, a dielectric substrate and a planar waveguide disposed on the dielectric substrate. The dielectric substrate between the two metal plates has the planar waveguide disposed thereon, and the planar waveguide protrudes either in a through hole bored in one of the two metal plates, or in a hollow space defined by the other of the two metal plates on the dielectric substrate.
摘要翻译：用于将平面波导中的自由空间中的高频波转换为高频波的高频模块包括设置在电介质基板上的两个金属板，电介质基板和平面波导。两个金属板之间的电介质基板具有设置在其上的平面波导，并且平面波导在两个金属板之一中钻孔的通孔中或者在两个金属板中的另一个中限定的中空空间中突出电介质基片。

69. 发明申请

US20060093799A1 Wired circuit board 审中-公开
标题翻译：有线电路板
公开(公告)号：US20060093799A1
公开(公告)日：2006-05-04
申请号：US11259028
申请日：2005-10-27
申请人： Yasufumi Miyake , Kyouyuu Jo , Toshiki Naito , Yutaka Aoki
发明人： Yasufumi Miyake , Kyouyuu Jo , Toshiki Naito , Yutaka Aoki
IPC分类号： B32B3/00 , B32B18/00
CPC分类号： H05K1/0346 , B32B15/08 , B32B27/281 , B32B2250/44 , B32B2255/06 , B32B2255/10 , B32B2255/26 , B32B2307/202 , B32B2307/206 , B32B2307/714 , B32B2457/08 , C08G61/122 , H05K1/0333 , H05K1/0393 , Y10T428/24917 , Y10T428/24926
摘要： A wired circuit board having good alkali resistance as well as good flexibility. The wired circuit board comprising an insulating base layer 21, a conductor layer 22 laminated on the insulating layer 21, and an insulating cover layer 23 formed on the insulating base layer 21 to cover the conductor layer 22, wherein at least the insulating base layer 21 is formed from a resin having a repeated unit expressed by at least either the following general formula (1) or (2), and a weight-average molecular weight in the range of 0.1×105 to 1.5×105: Chemical Formula (1) (n represents a degree of polymerization) Chemical Formula (2) (m represents a degree of polymerization)
摘要翻译：具有良好耐碱性和良好柔性的有线电路板。布线电路板包括绝缘基底层21，层叠在绝缘层21上的导体层22和形成在绝缘基底层21上以覆盖导体层22的绝缘覆盖层23，其中至少绝缘基底层21 由具有由至少以下通式（1）或（2）表示的重复单元的树脂形成，并且重均分子量在0.1×10 5至1.5×10 5范围内化学式（1）（n表示聚合度）化学式（2）（m表示聚合度）

70. 发明授权

US07030494B2 Semiconductor package having built-in micro electric mechanical system and manufacturing method thereof 失效
标题翻译：具有内置微电机械系统的半导体封装及其制造方法
公开(公告)号：US07030494B2
公开(公告)日：2006-04-18
申请号：US10874913
申请日：2004-06-22
申请人： Yutaka Aoki
发明人： Yutaka Aoki
IPC分类号： H01L29/40 , H01L21/00
CPC分类号： H01L24/83 , B81C1/0023 , H01L23/5389 , H01L24/19 , H01L24/27 , H01L24/29 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/2919 , H01L2224/73267 , H01L2224/83191 , H01L2224/838 , H01L2224/92 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： A semiconductor package includes a semiconductor structure having a plurality of electrodes for external connection which are provided on a semiconductor substrate, an insulation layer provided on the semiconductor structure, an upper wiring having connection pad portions and provided on the insulation layer such that at least parts of the upper wiring are connected to the electrodes for external connection of the semiconductor structure, a micro electric mechanical system electrically connected to parts of the connection pad portions of the upper wiring, pole electrodes provided so as to be electrically connected to other connection pad portions of the upper wiring, and an upper insulation film covering the vicinities of the pole electrodes and at least the vicinity of the micro electric mechanical system.
摘要翻译：半导体封装包括具有设置在半导体衬底上的多个用于外部连接的电极的半导体结构，设置在半导体结构上的绝缘层，具有连接焊盘部分并设置在绝缘层上的上部布线，使得至少部分上部布线连接到用于半导体结构的外部连接的电极，电连接到上部布线的连接焊盘部分的微电气机械系统，极电极设置成电连接到其它连接焊盘部分以及覆盖极电极附近的至少微机电系统附近的上绝缘膜。

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