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61. 发明专利

JP2007206050A Substrate inspection method, substrate inspection device, and electron beam unit 审中-公开
标题翻译：基板检查方法，基板检查装置和电子束单元
公开(公告)号：JP2007206050A
公开(公告)日：2007-08-16
申请号：JP2006071948
申请日：2006-03-16
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAKASUJI MAMORU , NOMICHI SHINJI , SATAKE TORU , HAMASHIMA MUNEKI , KANEUMA TOSHIFUMI , HATAKEYAMA MASAKI , WATANABE KENJI , SOFUGAWA TAKUJI , KARIMATA TSUTOMU , YOSHIKAWA SEIJI , OWADA SHIN , NISHIFUJI MUTSUMI
IPC分类号： G01N23/225 , G01R31/302 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a substrate inspection method, a substrate inspection device and an electron beam unit for inspection, capable of inspecting and evaluating highly reliably a sample with a high through-put. SOLUTION: The substrate inspection method/device of the present invention is provided with: a charged particle beam generating means 71 for generating a charged particle beam; a primary optical system 72 for irradiating a substrate with scan of the plurality of primary charged particle beams; a secondary optical system 74 introduced with a secondary charged particle beam emitted from the substrate by the irradiation of the charged electron beam; a detection system 76 having a detector for detecting the secondary charged particle beam introduced into the secondary optical system to be converted into electric signals; and a process control system 77 for evaluating the substrate, based on the electric signals. A coupling area in divided areas is selected to conduct evaluation, in the evaluation of a pattern forming face where the whole pattern is formed by dividing the pattern forming face into the plurality of areas and by forming a pattern for every area. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种基板检查方法，基板检查装置和用于检查的电子束单元，能够高可靠地检查和评估具有高通量的样品。解决方案：本发明的基板检查方法/装置设置有：用于产生带电粒子束的带电粒子束产生装置71; 用于对多个初级带电粒子束的扫描照射基板的主光学系统72; 二次光学系统74引入了通过照射带电电子束从衬底发射的二次带电粒子束; 检测系统76，具有检测器，用于检测引入二次光学系统的二次带电粒子束以转换成电信号; 以及用于基于电信号来评估衬底的过程控制系统77。选择分割区域中的耦合区域来评估通过将图案形成面分割成多个区域而形成整个图案的图案形成面，并且通过形成每个区域的图案。版权所有（C）2007，JPO＆INPIT

62. 发明专利

JP2007184283A Charged particle beam device and method 审中-公开
标题翻译：充电颗粒束装置和方法
公开(公告)号：JP2007184283A
公开(公告)日：2007-07-19
申请号：JP2007000925
申请日：2007-01-09
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAKASUJI MAMORU , SATAKE TORU , WATANABE KENJI , MURAKAMI TAKESHI , NOMICHI SHINJI , SOFUGAWA TAKUJI , KARIMATA TSUTOMU , YOSHIKAWA SEIJI , KANEUMA TOSHIFUMI , OWADA SHIN , NISHIFUJI MUTSUMI , HAMASHIMA MUNEKI , TAKAGI TORU , KIHARA NAOTO , NISHIMURA HIROSHI
IPC分类号： H01J37/147 , G01N23/225 , H01J37/28 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide an electron beam device which improves inspection throughput and detection accuracy. SOLUTION: The device irradiates primary charged particles to a region of a sample W to be measured and detects secondary charged particles emitted from the sample W. When the primary charged particles are irradiated to small unit areas of the divided measured region, it is controlled so that at least one or more adjacent areas R12 are skipped after one small area R11 is irradiated, and unirradiated areas R13 are irradiated. In this case, irradiation of each area is started from a side nearer to the area which is irradiated next and proceeded to a farther side. For example, in the case of the area R11, irradiation starts from the point P11 nearer to the area R13 which is irradiated next and when it reaches the farther point P12, irradiation of the area R13 is started from the point P13. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种提高检查吞吐量和检测精度的电子束装置。解决方案：该装置将一次带电粒子照射到要测量的样品W的区域，并检测从样品W发射的二次带电粒子。当初级带电粒子照射到被划分的测量区域的小单位面积时，被控制使得在照射一个小区域R11之后跳过至少一个或多个相邻区域R12，并且照射未照射区域R13。在这种情况下，每个区域的照射从更靠近下一个被照射的区域的一侧开始并进行到更远的一侧。例如，在区域R11的情况下，从接近照射区域R13的点P11开始照射，当到达更远点P12时，从点P13开始照射区域R13。版权所有（C）2007，JPO＆INPIT

63. 发明专利

JP2007019033A Inspection device and method by electron beam, and device manufacturing method using above inspection device 审中-公开
标题翻译：电子束检查装置和方法以及使用上述检查装置的装置制造方法
公开(公告)号：JP2007019033A
公开(公告)日：2007-01-25
申请号：JP2006245944
申请日：2006-09-11
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： YAMAZAKI YUICHIRO , WATANABE KENJI , SOFUGAWA TAKUJI , NOMICHI SHINJI , SATAKE TORU , YOSHIKAWA SEIJI , KARIMATA TSUTOMU , NAKASUJI MAMORU , HATAKEYAMA MASAKI , MURAKAMI TAKESHI , NAGAHAMA ICHIROTA , NAGAI TAKAMITSU , SUGIHARA KAZUYOSHI
IPC分类号： H01J37/20 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To process an inspection, exposure or the like of a wafer without polluting a sample, a lens or the like. SOLUTION: A differential pumping part 5004 is attached to surround a tip part of a mirror cylinder 5001. A sample 5002 is mounted on a stage 5003. Gas flowing towards a charged particle beam 5050 from an outer peripheral side of the differential pumping part 5004 is evacuated through annular grooves 5005, 5006, a charged particle beam region is sustained in a predetermined vacuum degree. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：处理晶片的检查，曝光等而不污染样品，透镜等。
解决方案：差分泵送部分5004被附接以围绕反射镜缸501的尖端部分。样品5002安装在台5003上。从差动泵送的外周侧朝向带电粒子束5050流动的气体部分5004通过环形槽5005,5006抽真空，带电粒子束区域被保持在预定的真空度。版权所有（C）2007，JPO＆INPIT

64. 发明专利

JP2006138848A Method and device for extracting particle beam 有权
标题翻译：提取粒子束的方法和装置
公开(公告)号：JP2006138848A
公开(公告)日：2006-06-01
申请号：JP2005315591
申请日：2005-10-31
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SOFUGAWA TAKUJI , NAKASUJI MAMORU , NOMICHI SHINJI , KARIMATA TSUTOMU
IPC分类号： G21K5/00 , B23K15/10 , G21K1/04
CPC分类号： G21K1/043
摘要： PROBLEM TO BE SOLVED: To extract a particle beam generated in a vacuum atmosphere into the atmosphere with the vacuum atmosphere sealed.
SOLUTION: The particle beam extracting device comprises a particle beam generator 1 placed in the vacuum atmosphere 3, a separation means 13 for separating the vacuum atmosphere from the atmosphere 15, a fixed hole 17 for passing the particle beam through, provided in the separation means 13, a rotating plate 19 having a moving hole 21 or a plurality of circumferential cutouts to be matched to the fixing hole of the separating means, a rotating drive unit 23 for rotating the rotating plate at high speed so that the fixed hole is matched to the moving hole or the cutouts at a predetermined speed, and a cooling means for removing heat generated in the rotating plate.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：将真空气氛中产生的粒子束以真空气氛密封的方式提取到大气中。解决方案：粒子束提取装置包括放置在真空气氛3中的粒子束发生器1，用于将真空气氛与大气15分离的分离装置13，用于使粒子束通过的固定孔17，设置在分离装置13，具有移动孔21的旋转板19或与分离装置的固定孔匹配的多个周向切口;旋转驱动单元23，用于高速旋转旋转板，使得固定孔以预定速度与移动孔或切口匹配，以及用于去除在旋转板中产生的热量的冷却装置。版权所有（C）2006，JPO＆NCIPI

65. 发明专利

JP2005209645A Electron beam device equipped with function of detailed observation and inspection as well as observation method of sample by the device 有权
标题翻译：具有详细观察和检查功能的电子束装置作为装置的样品观察方法
公开(公告)号：JP2005209645A
公开(公告)日：2005-08-04
申请号：JP2004376827
申请日：2004-12-27
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： WATANABE KENJI , SATAKE TORU , NOMICHI SHINJI , MURAKAMI TAKESHI , KARIMATA TSUTOMU , YAMAZAKI YUICHIRO , NAGAHAMA ICHIROTA , ONISHI ATSUSHI
IPC分类号： H01L21/66 , H01J37/28
摘要： PROBLEM TO BE SOLVED: To provide a sample observation method capable of a detailed observation of a sample with the use of an identical electron beam device. SOLUTION: The electron beam device 1 is used equipped with a primary optical system 10 irradiating electron beams on the surface of the sample, and a secondary optical system 30 forming images of the sample surface by detecting secondary electron beams emitted from the sample surface. The surface of the sample is inspected by irradiating the electron beams on the surface S of the sample, and after extracting defective sites of the sample according to the inspection, the electron beams are irradiated again on the extracted defective sites to carry out enlargement or detailed observation of the same. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供能够使用相同的电子束装置详细观察样品的样品观察方法。解决方案：电子束装置1配备有在样品表面上照射电子束的主要光学系统10和通过检测从样品发射的二次电子束形成样品表面的图像的二次光学系统30 表面。通过在样品的表面S上照射电子束来检查样品的表面，并且在根据检查提取样品的缺陷部位之后，再次将电子束照射在提取的缺陷部位上以进行放大或详细观察一样。版权所有（C）2005，JPO＆NCIPI

66. 发明专利

JP2005197121A Electron beam device 有权
标题翻译：电子束装置
公开(公告)号：JP2005197121A
公开(公告)日：2005-07-21
申请号：JP2004003202
申请日：2004-01-08
申请人： Ebara Corp , 株式会社荏原製作所
发明人： WATANABE KENJI , SATAKE TORU , NAKASUJI MAMORU , MURAKAMI TAKESHI , KARIMATA TSUTOMU , NOMICHI SHINJI , TOYAMA KEIICHI , HATAKEYAMA MASAKI
IPC分类号： H01L21/66 , H01J37/073 , H01J37/12 , H01J37/147 , H01J37/26 , H01J37/29
CPC分类号： H01J37/261 , H01J37/28 , H01J2237/06341 , H01J2237/2446 , H01J2237/24592 , H01J2237/2538
摘要： PROBLEM TO BE SOLVED: To enable to carry out evaluation of a sample with a high throughput and a high S/N ratio. SOLUTION: When electron beam irradiated from an electron gun is irradiated on a sample W placed on an X-Y-θ stage 9-1 through an electrostatic lens 4-1 and an objective lens 11-1 or the like, secondary electron or reflective electron is emitted from the sample W. An incident angle of the primary electron beam is set at 35° or more through adjustment of a deflector 8-1. Emitted electron from the sample is guided toward the vertical direction to be imaged at a detector. The detector is composed of an MCP 14-1, a phosphor plate 15-1, a relay lens 16-1 and a TDI (or a CCD) 17-1, and electric signals from the TDI 7-1 is supplied to a personal computer 18-1 for image processing to obtain a two-dimensional image of the sample. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了能够以高吞吐量和高S / N比进行样品的评价。解决方案：当从电子枪照射的电子束通过静电透镜4-1和物镜11-1等照射在放置在XY-θ平台9-1上的样品W上时，二次电子或反射电子从样品W发射。通过调节偏转器8-1将一次电子束的入射角设定在35°以上。来自样品的发射电子被引导到垂直方向以在检测器成像。检测器由MCP14-1，荧光板15-1，中继透镜16-1和TDI（或CCD）17-1组成，并且来自TDI 7-1的电信号被提供给个人计算机18-1，用于图像处理以获得样本的二维图像。版权所有（C）2005，JPO＆NCIPI

67. 发明专利

JP2004030952A Electron beam apparatus and device manufacturing method 审中-公开
公开(公告)号：JP2004030952A
公开(公告)日：2004-01-29
申请号：JP2002181190
申请日：2002-06-21
申请人： Ebara Corp , 株式会社荏原製作所
发明人： WATANABE KENJI , KARIMATA TSUTOMU , YOSHIKAWA SEIJI , SATAKE TORU
IPC分类号： H01L21/66 , H01J37/04 , H01J37/244 , H01J37/29
摘要： PROBLEM TO BE SOLVED: To provide an electron beam apparatus capable of making an observation of primary electron beams in real time, and measuring the current density of the primary electron beams at a high speed. SOLUTION: The electron beam apparatus includes a primary electron optic system irradiating primary electron beams to a sample 11, a secondary electron detection system forming an electronic image by detecting secondary electrons generated from the sample, and an evaluation means evaluating the sample according to data of the electronic image. The primary electron optic system includes not less than two pairs of quadrupole electrodes 6 for adjusting the irradiation area 8 of the primary electron beams, not less than one pair of polarizers 7 for scanning the primary electron beams, and a Faraday cup for measuring the current density of the primary electron beams. A current from the Faraday cup is converted by a current/voltage converter to generate a current density image of the primary electron beams. COPYRIGHT: (C)2004,JPO

68. 发明专利

JP2003172715A ELECTRON BEAM APPARATUS AND MANUFACTURING METHOD OF DEVICE 审中-公开
公开(公告)号：JP2003172715A
公开(公告)日：2003-06-20
申请号：JP2001372640
申请日：2001-12-06
申请人： EBARA CORP
发明人： NAKASUJI MAMORU , SATAKE TORU , KARIMATA TSUTOMU
IPC分类号： G01N23/225 , B65G49/07 , G01N1/00 , G03F7/20 , H01J37/20 , H01L21/027 , H01L21/66 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To attain a sample transporting operation performed properly at a high operation speed. SOLUTION: The electron beam apparatus is provided for performing sample evaluation or the like by irradiating an electron beam on the sample. The apparatus is equipped with push-up members 48 where sample loading means 20, 26 that are in at least either one of a sample chamber 14 for accepting an evaluation sample and a loading chamber 16 (for taking the sample into or out of the sample chamber), are made capable of pushing up the sample loaded on the loading surface with the upper ends extending to a position above the sample loading surface of the sample loading means, and an electrostatic chuck 48" with the push-up member fixed through a flexible member 48' such as a coil spring at the upper end. A sample transporting arm 52 for delivering the sample between the push-up members is allowed to be equipped with the electrostatic chuck for electrostatic-holding the sample. The sample is securely held by the electrostatic chuck and can be transported. COPYRIGHT: (C)2003,JPO

69. 发明专利

JP2002239342A REACTION DEVICE BY CORPUSCULAR RAY IRRADIATION 失效
公开(公告)号：JP2002239342A
公开(公告)日：2002-08-27
申请号：JP2001037198
申请日：2001-02-14
申请人： EBARA CORP
发明人： SOFUGAWA TAKUJI , NOMICHI SHINJI , NAKASUJI MAMORU , KARIMATA TSUTOMU
IPC分类号： G21K5/00 , B01D53/56 , B01D53/60 , B01D53/74 , B01J19/12 , G21K5/04
摘要： PROBLEM TO BE SOLVED: To solve problems generated by colliding a corpuscular ray with the thin sealing film stretched over an opening formed in the sidewall of a reaction vessel, in a reaction device by corpuscular ray irradiation for carrying out the required reaction of gas in the reaction vessel by irradiating through the opening the gas in the reaction vessel with the corpuscular ray such as an electron beam. SOLUTION: This reaction device by corpuscular ray irradiation has the reaction vessel 15 and a corpuscular ray irradiation device for irradiating the inside of reactor vessel with the corpuscular ray through an irradiation hole 11 installed on the outside of the reaction vessel and in the sidewall of the reaction vessel. The reaction device is characterized in that the irradiation device is provided with a corpuscular ray irradiation source and an optical system where the corpuscular ray generated in the corpuscular ray irradiation source is oriented to the irradiation hole with the diameter of the corpuscular ray stopped down at the irradiation hole and that the irradiation hole is slightly larger in diameter than the diameter of the stopped corpuscular ray.

70. 发明专利

JP2002129349A APPARATUS AND METHOD FOR PLATING 失效
公开(公告)号：JP2002129349A
公开(公告)日：2002-05-09
申请号：JP2000327801
申请日：2000-10-26
申请人： EBARA CORP
发明人： MISHIMA KOJI , INOUE HIROAKI , KARIMATA TSUTOMU , KUNISAWA JUNJI
IPC分类号： C23C18/31 , C25D7/12 , C25D21/02 , H01L21/288 , H01L21/3205
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for plating, which keeps the reacting surface of a semiconductor substrate constantly and accurately at a predetermined temperature during plating reaction, plates the substrate stably and surely, and improves throughput. SOLUTION: This apparatus for plating comprises a plating bath 10 as a thermostatic chamber which maintains the temperature to be higher in the inside space than the outside air. The plating bath 10 comprises a holding means 11 for holding a surface to be plated of the semiconductor substrate upward- facing, a sheathing member 15 for sealing perimeter of the plated surface of the semiconductor substrate W held by the holding means 11, and a showerhead 19 for supplying a plating solution on the plated surface of the semiconductor substrate W sealed with the sheathing member 15.

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