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61. 发明授权

US4883778A Products formed of a ceramic-glass-metal composite 失效
标题翻译：产品由陶瓷 - 玻璃 - 金属复合材料组成
公开(公告)号：US4883778A
公开(公告)日：1989-11-28
申请号：US924959
申请日：1986-10-30
申请人： Narendra N. SinghDeo , Deepak Mahulikar , Sheldon H. Butt
发明人： Narendra N. SinghDeo , Deepak Mahulikar , Sheldon H. Butt
IPC分类号： A61F2/00 , A61F2/30 , A61F2/36 , C03C14/00 , H05K1/03
CPC分类号： A61F2/30965 , C03C14/004 , A61F2/367 , A61F2002/3631 , A61F2002/368 , A61F2002/3682 , A61F2310/00203 , C03C2214/04 , C03C2214/08 , H01L2924/01078 , H01L2924/09701 , H05K1/0306
摘要： The present invention is directed to an engineering ceramic product formed of a ceramic-glass-metal composite being strong, durable, formable into complex shapes and having good improved thermal conductivity.
摘要翻译：本发明涉及由陶瓷 - 玻璃 - 金属复合材料形成的工程陶瓷产品，该陶瓷玻璃 - 金属复合材料坚固耐用，可形成复杂形状并具有良好的改善的导热性。

62. 发明授权

US4882212A Electronic packaging of components incorporating a ceramic-glass-metal composite 失效
标题翻译：包含陶瓷 - 玻璃 - 金属复合材料的组件的电子封装
公开(公告)号：US4882212A
公开(公告)日：1989-11-21
申请号：US924970
申请日：1986-10-30
申请人： Narendra N. SinghDeo , Deepak Mahulikar , Sheldon H. Butt
发明人： Narendra N. SinghDeo , Deepak Mahulikar , Sheldon H. Butt
IPC分类号： A61F2/00 , A61F2/30 , A61F2/36 , C03C14/00 , H01L23/10 , H01L23/15 , H01L23/367 , H01L23/498 , H05K1/03
CPC分类号： H01L23/15 , A61F2/30965 , C03C14/004 , H01L23/10 , H01L23/3677 , H01L23/49805 , H01L23/49861 , A61F2/367 , A61F2002/3631 , A61F2002/368 , A61F2002/3682 , A61F2310/00203 , C03C2214/04 , C03C2214/08 , H01L2224/32188 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15153 , H01L2924/15165 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/3025 , H05K1/0306 , Y10S428/901 , Y10T428/239 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/25 , Y10T428/252 , Y10T428/256 , Y10T428/257 , Y10T428/258 , Y10T428/259
摘要： The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.
摘要翻译：本发明涉及形成用于容纳半导体器件的部件的部件和工艺。这些部件由独特的陶瓷 - 玻璃 - 金属复合材料制成，陶瓷颗粒，金属颗粒和玻璃基体，所述陶瓷和金属颗粒遍布整个分散。金属元件可以嵌入到材料中，以简化诸如半导体封装的器件的制造。

63. 发明授权

US4748136A Ceramic-glass-metal composite 失效
标题翻译：陶瓷玻璃 - 金属复合材料
公开(公告)号：US4748136A
公开(公告)日：1988-05-31
申请号：US924968
申请日：1986-10-30
申请人： Deepak Mahulikar , Narendra N. SinghDeo
发明人： Deepak Mahulikar , Narendra N. SinghDeo
IPC分类号： A61F2/00 , A61F2/30 , A61F2/36 , C03C14/00 , H05K1/03
CPC分类号： C03C14/004 , A61F2/30965 , A61F2/367 , A61F2002/3631 , A61F2002/368 , A61F2002/3682 , A61F2310/00203 , C03C2214/04 , C03C2214/08 , H01L2924/01078 , H01L2924/09701 , H05K1/0306
摘要： The present invention is directed to a composite and process of forming the composite comprising metallic particles for enhancing the flow characteristics of said composite, a glass for adhering the composite together and the balance essentially ceramic particles. The composite has a matrix comprising the glass with the ceramic and metallic particles dispersed therein. The metallic particles are preferably present in the composite at a volume percentage so as to be discontinuously dispersed throughout.
摘要翻译：本发明涉及一种形成复合材料的复合材料和方法，所述复合材料包括用于增强所述复合材料的流动特性的金属颗粒，用于将复合材料粘合在一起的玻璃和其余的基本上为陶瓷颗粒。该复合材料具有包含分散有陶瓷和金属颗粒的玻璃的基体。金属颗粒优选以体积百分比存在于复合材料中，以便不连续地分散在整个组合物中。

64. 发明授权

US4715892A Cermet substrate with glass adhesion component 失效
标题翻译：金属陶瓷基材与玻璃粘合成分
公开(公告)号：US4715892A
公开(公告)日：1987-12-29
申请号：US922271
申请日：1986-10-30
申请人： Deepak Mahulikar
发明人： Deepak Mahulikar
IPC分类号： C22C1/05 , C22C32/00 , H01L21/48 , H01L23/15 , C22C29/12
CPC分类号： H01L23/15 , C22C1/05 , C22C32/0089 , H01L21/4807 , H01L2224/48091 , H01L2224/48247 , H01L2924/09701 , H01L2924/10253 , H01L2924/3025 , Y10T428/12056 , Y10T428/12097 , Y10T428/12139 , Y10T428/12181
摘要： The present invention is directed to a cermet material comprising a matrix of metal or alloy with ceramic particles distributed therein. The cermet includes a glass binder for bonding between the metal or alloy and the ceramic particles.
摘要翻译：本发明涉及一种金属陶瓷材料，其包含金属或合金的基体，其中分布有陶瓷颗粒。金属陶瓷包括用于在金属或合金与陶瓷颗粒之间接合的玻璃粘合剂。

65. 发明申请

US20130067998A1 Homogeneous Blending 有权
标题翻译：均匀混合
公开(公告)号：US20130067998A1
公开(公告)日：2013-03-21
申请号：US13618088
申请日：2012-09-14
申请人： Saeed H. Mohseni , Elizabeth K. Gramm , Deepak Mahulikar
发明人： Saeed H. Mohseni , Elizabeth K. Gramm , Deepak Mahulikar
IPC分类号： C09K13/00 , G01N1/44 , G01N1/10 , C09K13/02 , C09G1/02
CPC分类号： C09K3/1463 , C09G1/02
摘要： A method of forming a colloidal dispersion includes providing a first continuous material flow, providing a second continuous material flow, combining the first and second continuous material flows, and moving a continuous flow of a colloidal dispersion in a direction downstream of the first and second continuous flows. The first continuous material flow includes one or more of a diluent (e.g., deionized water), a base, and an acid, and the second continuous material flow includes an abrasive particle solution. The first and second material flows are combined with a Reynolds number greater than about 4400 and less than about 25000 (e.g., about 7400 to about 25000). The colloidal dispersion includes the diluent, the base, the acid, and abrasive particles from the abrasive particle solution.
摘要翻译：形成胶态分散体的方法包括提供第一连续材料流，提供第二连续材料流，组合第一和第二连续材料流，以及在第一和第二连续材料的下游方向上移动胶体分散体的连续流动流动。第一连续材料流包括稀释剂（例如去离子水），碱和酸中的一种或多种，并且第二连续材料流包括研磨颗粒溶液。第一和第二材料流与大于约4400且小于约25000（例如约7400至约25000）的雷诺数组合。胶体分散体包括来自磨料颗粒溶液的稀释剂，碱，酸和磨料颗粒。

66. 发明申请

US20120145950A1 ULTRAPURE COLLOIDAL SILICA FOR USE IN CHEMICAL MECHANICAL POLISHING APPLICATIONS 有权
标题翻译：用于化学机械抛光应用的超细胶体硅胶
公开(公告)号：US20120145950A1
公开(公告)日：2012-06-14
申请号：US13405027
申请日：2012-02-24
申请人： Deepak Mahulikar , Yuhu Wang , Ken A. Delbridge , Gert R.M. Moyaerts , Saeed H. Mohseni , Nichole R. Koontz , Bin Hu , Liqing Wen
发明人： Deepak Mahulikar , Yuhu Wang , Ken A. Delbridge , Gert R.M. Moyaerts , Saeed H. Mohseni , Nichole R. Koontz , Bin Hu , Liqing Wen
IPC分类号： C09K13/00 , B82Y30/00
CPC分类号： C23F3/04 , C01B33/1435 , C01B33/1485 , C01P2004/62 , C01P2004/64 , C01P2006/80 , C09G1/02 , C09K3/1463 , C09K3/1472 , H01L21/31053 , H01L21/3212
摘要： An ultrapure colloidal silica dispersion comprising colloidal silica particles having a mean or aggregate particle size from about 10 to about 200 nm, wherein the colloidal silica dispersion has less than 200 ppb, of each trace metal impurity disposed therein, excluding potassium and sodium, and have less than 2 ppm residual alcohol. A method for producing and using the same is also disclosed.
摘要翻译：一种超纯胶态二氧化硅分散体，其包含平均或聚集体粒径为约10至约200nm的胶体二氧化硅颗粒，其中胶态二氧化硅分散体中除了钾和钠之外的每种痕量金属杂质少于200ppb，并且具有小于2ppm的残余酒精。还公开了其制造和使用方法。

67. 发明申请

US20090053896A1 Copper polishing slurry 审中-公开
标题翻译：铜抛光浆
公开(公告)号：US20090053896A1
公开(公告)日：2009-02-26
申请号：US12221864
申请日：2008-08-07
申请人： Bin Hu , Richard Wen , Deepak Mahulikar
发明人： Bin Hu , Richard Wen , Deepak Mahulikar
IPC分类号： H01L21/304 , C09K13/00
CPC分类号： C09G1/02 , C09G1/16 , H01L21/3212
摘要： A water-soluble polymer is effective as a removal rate enhancer in a chemical mechanical polishing slurry to polish copper on semiconductor wafers or other copper laid structures, while keeping the etching rate low. The slurry may also include soft particles and certain metal chelating agents, or combinations thereof. The slurry can also comprise an abrasive particle, an organic acid, and an oxidizer.
摘要翻译：水溶性聚合物在化学机械抛光浆料中作为去除速率增强剂是有效的，以在半导体晶片或其它铜敷设结构上抛光铜，同时保持蚀刻速率较低。浆料还可以包括软颗粒和某些金属螯合剂，或其组合。浆料还可以包含磨料颗粒，有机酸和氧化剂。

68. 发明授权

US06776696B2 Continuous chemical mechanical polishing process for polishing multiple conductive and non-conductive layers on semiconductor wafers 有权
公开(公告)号：US06776696B2
公开(公告)日：2004-08-17
申请号：US10281905
申请日：2002-10-28
申请人： Deepak Mahulikar , Richard J. Jenkins
发明人： Deepak Mahulikar , Richard J. Jenkins
IPC分类号： B24B100
CPC分类号： C09G1/02 , B24B37/044 , H01L21/3212
摘要： A continuous CMP process for polishing multiple conductive and non-conductive layers on a semiconductor substrate. The continuous process comprises the steps of: (a) disposing a substrate on a platen; (b) polishing a first layer using both a mechanical means and a chemical means; and (c) polishing a second layer upon adjusting at least one parameter in either the mechanical means, chemical means, or both.

69. 发明授权

US6158351A Ferromagnetic bullet 失效
标题翻译：铁磁弹
公开(公告)号：US6158351A
公开(公告)日：2000-12-12
申请号：US681138
申请日：1996-07-22
申请人： Brian Mravic , Henry J. Halverson , Deepak Mahulikar
发明人： Brian Mravic , Henry J. Halverson , Deepak Mahulikar
IPC分类号： B22F1/00 , F42B12/74 , F42B1/00 , F42B8/14
CPC分类号： F42B12/745 , B22F1/0003 , F42B12/74
摘要： A lead free ferromagnetic article is disclosed. The article is a compacted composite having a heavy more dense constituent that is preferably ferrotungsten and a less dense second constituent that is either a metal alloy or a polymer. The ferromagnetic constituent is present in an amount sufficient to impart the article with ferromagnetism. The ferromagnetic property allows fragments of the article, such as a projectile, bullet or shaped charge liner to be separated from dirt or other environments.
摘要翻译：公开了一种无铅铁磁制品。该制品是具有重的更致密的组分的压实复合材料，其优选是铁钨和不太致密的第二组分，其是金属合金或聚合物。铁磁组分以足以赋予制品铁磁性的量存在。铁磁性能允许制品的碎片，例如抛射物，子弹或成形的电荷衬垫与污垢或其它环境分离。

70. 发明授权

US5741544A Articles using specialized vapor deposition processes 失效
标题翻译：使用专门的气相沉积工艺的制品
公开(公告)号：US5741544A
公开(公告)日：1998-04-21
申请号：US521858
申请日：1995-08-31
申请人： Deepak Mahulikar
发明人： Deepak Mahulikar
IPC分类号： C23C16/04 , C23C16/44 , C23C16/455 , F28F19/06 , B05D7/22
CPC分类号： C23C16/4551 , C23C16/045 , C23C16/45589 , F28F19/06
摘要： Various types of articles having various deposition coatings applied using a gas vapor deposition process are provided. A system evacuates gases from the article or a deposition chamber prior to depositing a coating. The coating may be applied throughout the inside of an article or may be selectively applied to a portion of the article. The article may be moved relative to the gas jet or the gas may be moved jet relative to the article. Stencils may be used to pattern the coating on the surface of the article. The articles are coated in a pressure of approximately 5 millitorr. Articles may be cylindrically shaped, leadframes on a reel, substrates, or printed circuit boards.
摘要翻译：提供了使用气相沉积工艺应用各种沉积涂层的各种类型的制品。在沉积涂层之前，系统从制品或沉积室排出气体。涂层可以施用在制品的整个内部，或者可以选择性地施加到制品的一部分。物品可以相对于气体射流移动，或者气体可以相对于物品移动。模板可用于对制品表面上的涂层进行图案化。制品以约5毫托的压力涂覆。制品可以是圆柱形的，卷轴上的引线框架，基板或印刷电路板。

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