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61. 发明授权

US4861595A Cellular encapsulation of biologicals for animal and human use 失效
标题翻译：用于动物和人类使用的生物物质的细胞包封
公开(公告)号：US4861595A
公开(公告)日：1989-08-29
申请号：US95749
申请日：1987-09-11
申请人： Andrew C. Barnes , David L. Edwards
发明人： Andrew C. Barnes , David L. Edwards
IPC分类号： A01N63/00 , C07K14/195 , C07K14/325 , C12N1/00 , C12P1/04
CPC分类号： C12N1/005 , A01N63/00 , C07K14/195 , C07K14/325 , C12P1/04 , Y10S424/08
摘要： A biological delivery system particularly suited for delivery of protein compounds to animals and humans is disclosed. The system uses a producing microbe itself after suitable treatment by chemical and/or physical means. The product being delivered is contained within the treated microbial cell; it is produced intracellularly by a homologous (native) gene.
摘要翻译：公开了特别适用于将动物和人类递送蛋白质化合物的生物递送系统。该系统在通过化学和/或物理手段进行适当处理后，本身就使用生产微生物。递送的产品包含在处理过的微生物细胞内; 它是通过同源（天然）基因在细胞内产生的。

62. 发明授权

US09021782B1 Aerospace laser ignition/ablation variable high precision thruster 有权
标题翻译：航空激光点火/消融变量高精度推进器
公开(公告)号：US09021782B1
公开(公告)日：2015-05-05
申请号：US12862510
申请日：2010-08-24
申请人： Jonathan W. Campbell , David L. Edwards , Jason J. Campbell
发明人： Jonathan W. Campbell , David L. Edwards , Jason J. Campbell
IPC分类号： F03H1/00 , B64G1/40 , G21D5/02
CPC分类号： B64G1/406 , B64G1/402 , F03H1/00 , G21D5/02
摘要： A laser ignition/ablation propulsion system that captures the advantages of both liquid and solid propulsion. A reel system is used to move a propellant tape containing a plurality of propellant material targets through an ignition chamber. When a propellant target is in the ignition chamber, a laser beam from a laser positioned above the ignition chamber strikes the propellant target, igniting the propellant material and resulting in a thrust impulse. The propellant tape is advanced, carrying another propellant target into the ignition chamber. The propellant tape and ignition chamber are designed to ensure that each ignition event is isolated from the remaining propellant targets. Thrust and specific impulse may by precisely controlled by varying the synchronized propellant tape/laser speed. The laser ignition/ablation propulsion system may be scaled for use in small and large applications.
摘要翻译：激光点火/消融推进系统，捕捉液体和固体推进的优点。卷轴系统用于将包含多个推进剂材料靶的推进剂带移动通过点火室。当推进剂靶位于点火室中时，来自位于点火室上方的激光器的激光束撞击推进剂靶，点燃推进剂材料并产生推力冲击。推进剂胶带前进，将另一个推进剂目标载入点火室。推进剂胶带和点火室旨在确保每个点火事件与剩余的推进剂目标隔离。可以通过改变同步的推进剂带/激光器速度来精确地控制推力和比冲量。激光点火/消融推进系统可以缩放以用于小型和大型应用中。

63. 发明授权

US07724527B2 Method and structure to improve thermal dissipation from semiconductor devices 失效
标题翻译：改善半导体器件散热的方法和结构
公开(公告)号：US07724527B2
公开(公告)日：2010-05-25
申请号：US12197481
申请日：2008-08-25
申请人： Patrick A. Coico , David L. Edwards , Richard F. Indyk , David C. Long
发明人： Patrick A. Coico , David L. Edwards , Richard F. Indyk , David C. Long
IPC分类号： H05K7/20 , H01L21/56 , H01H23/10 , H01H21/48
CPC分类号： H01L21/4871 , H01L21/50 , H01L23/3675 , H01L24/16 , H01L24/31 , H01L25/16 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/09701 , H01L2924/10158 , H01L2924/10253 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.
摘要翻译：改进模块组件散热的方法和结构包括将至少一个芯片的第一侧附接到单个芯片载体上，所述至少一个芯片具有与第一侧相对的第二侧; 将所述至少一个芯片的第二侧研磨成所需的表面轮廓; 在散热片和所述至少一个芯片的第二面中的至少一个上施加传热介质; 以及将所述散热器布置在所述至少一个芯片的第二侧上，其中所述传热介质在所述散热器和所述至少一个芯片的所述第二侧之间限定间隙。控制间隙以改善从至少一个芯片的第二侧到散热器的热传递。

64. 发明申请

US20100099584A1 MUTUAL SOLVENT SYSTEM AND METHOD FOR IMPROVED OIL AND GAS PERMEABILITY IN HIGH TEMPERATURE FORMATIONS 有权
标题翻译：在高温下改进油和气体渗透性的相互溶剂系统和方法
公开(公告)号：US20100099584A1
公开(公告)日：2010-04-22
申请号：US12253143
申请日：2008-10-16
申请人： Shaun T. Mesher , David L. Edwards
发明人： Shaun T. Mesher , David L. Edwards
IPC分类号： C09K8/52
CPC分类号： C09K8/74 , C09K8/52 , C09K8/54 , C09K8/72
摘要： A method of acidizing and cleaning up a formation is disclosed, the formation being above 150 degrees C. The formation is treated with a mutual solvent system comprising a mutual solvent of oil and water, an aqueous acid, a corrosion inhibitor, and an iron control agent. In some embodiments, the iron control agent is present in an amount of less than 1% by weight of the mutual solvent system. In some embodiments, the corrosion inhibitor may be present in an amount of less than 10% by weight of the mutual solvent system. In some embodiments, the mutual solvent system further comprises an intensifier.
摘要翻译：公开了一种酸化和清理地层的方法，其形成高于150℃。该地层用包括油和水的互溶剂，酸水溶液，腐蚀抑制剂和铁控制剂的互溶剂体系代理商在一些实施方案中，铁控制剂的存在量小于互溶体系的1重量％。在一些实施方案中，腐蚀抑制剂可以以相互溶剂体系重量的小于10％的量存在。在一些实施例中，互溶体系还包括增压器。

65. 发明授权

US07700615B2 Cell migration inhibiting compositions and methods and compositions for treating cancer 失效
标题翻译：细胞迁移抑制组合物和治疗癌症的方法和组合物
公开(公告)号：US07700615B2
公开(公告)日：2010-04-20
申请号：US11345132
申请日：2006-02-01
申请人： David L. Edwards , Michael E. Berens , Christian Beaudry
发明人： David L. Edwards , Michael E. Berens , Christian Beaudry
IPC分类号： A61K31/47 , A61K31/45
CPC分类号： G01N33/5011 , A61K31/00 , A61K31/192 , A61K31/215 , A61K31/381 , A61K31/4745 , A61K31/549 , A61K38/193 , A61K39/00 , A61K45/06 , G01N2500/10 , A61K2300/00
摘要： Methods for treating an individual having cancer are provided. The method may include administering a cell migration inhibitor and a chemotherapeutic agent to the individual to inhibit migration of cancer cell. Inhibiting cell migration may increase cell division. In this manner, the cell migration inhibitor and the chemotherapeutic agent in combination may have increased efficacy compared to the chemotherapeutic agent alone due to the increased cell division. The cell migration inhibitor may include any of the inhibitors described herein. For example, the cell migration inhibitor may be an organic molecule having a molecular weight of less than about 700, a monoclonal antibody, or a natural product.
摘要翻译：提供了治疗患有癌症的个体的方法。该方法可以包括向个体施用细胞迁移抑制剂和化学治疗剂以抑制癌细胞的迁移。抑制细胞迁移可能增加细胞分裂。以这种方式，由于细胞分裂增加，细胞迁移抑制剂和化学治疗剂的组合可能与单独的化学治疗剂相比具有增加的功效。细胞迁移抑制剂可以包括本文所述的任何抑制剂。例如，细胞迁移抑制剂可以是分子量小于约700的有机分子，单克隆抗体或天然产物。

66. 发明申请

US20080310117A1 METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUCTOR DEVICES 失效
标题翻译：从半导体器件中改进热释放的方法和结构
公开(公告)号：US20080310117A1
公开(公告)日：2008-12-18
申请号：US12197481
申请日：2008-08-25
申请人： Patrick A. Coico , David L. Edwards , Richard F. Indyk , David C. Long
发明人： Patrick A. Coico , David L. Edwards , Richard F. Indyk , David C. Long
IPC分类号： H05K7/20
CPC分类号： H01L21/4871 , H01L21/50 , H01L23/3675 , H01L24/16 , H01L24/31 , H01L25/16 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/09701 , H01L2924/10158 , H01L2924/10253 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.
摘要翻译：改进模块组件散热的方法和结构包括将至少一个芯片的第一侧附接到单个芯片载体上，所述至少一个芯片具有与第一侧相对的第二侧; 将所述至少一个芯片的第二侧研磨成所需的表面轮廓; 在散热片和所述至少一个芯片的第二面中的至少一个上施加传热介质; 以及将所述散热器布置在所述至少一个芯片的第二侧上，其中所述传热介质在所述散热器和所述至少一个芯片的所述第二侧之间限定间隙。控制间隙以改善从至少一个芯片的第二侧到散热器的热传递。

67. 发明授权

US07394666B2 Circuit board cam-action standoff connector 有权
标题翻译：电路板凸轮动作支座连接器
公开(公告)号：US07394666B2
公开(公告)日：2008-07-01
申请号：US10904276
申请日：2004-11-02
申请人： David L. Edwards , Ronald L. Hering , David C. Long , Jason S. Miller , Carl R. Peterson
发明人： David L. Edwards , Ronald L. Hering , David C. Long , Jason S. Miller , Carl R. Peterson
IPC分类号： H05K1/11
CPC分类号： H05K7/142
摘要： A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained.
摘要翻译：公开了一种用于安装电路板的凸轮动作扩展型支座连接器及相关方法。支座连接器包括主体和多个安装构件，其具有用于由凸轮接合的内部纵向延伸的凸轮部分。凸轮构造成在安装构件内定位在第一位置，在第一位置，安装构件不会抵靠安装开口的内部膨胀，并且在第二位置中凸轮接合凸轮部分以使多个安装构件抵靠安装开口的内部。由于凸轮作用仅仅是水平的（纯径向的），实际上没有垂直力施加到电路板上，并且可以建立和维持电路板和散热器之间的最佳配合。

68. 发明授权

US07328508B2 Anisotropic heat spreading apparatus and method for semiconductor devices 有权
标题翻译：各向异性热扩散装置及半导体装置的方法
公开(公告)号：US07328508B2
公开(公告)日：2008-02-12
申请号：US11160665
申请日：2005-07-05
申请人： David L. Edwards , Thomas Fleischman , Paul A. Zucco
发明人： David L. Edwards , Thomas Fleischman , Paul A. Zucco
IPC分类号： B21D51/16 , B28B1/00
CPC分类号： H01L23/3733 , H01L21/4871 , H01L23/3732 , H01L23/3736 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , Y10T29/49808 , Y10T428/13 , Y10T428/234 , Y10T428/236 , H01L2924/00
摘要： A heat spreading apparatus for use in cooling of semiconductor devices includes a frame having a plurality of individual cells formed therein, each of the cells configured for filling with a material of selected thermal conductivity therein. The selected thermal conductivity of material within a given one of the cells corresponds to a thermal profile of the semiconductor device to be cooled.
摘要翻译：用于冷却半导体器件的散热装置包括具有形成在其中的多个单个电池的框架，每个电池单元被配置为在其中填充选择的热导率的材料。给定的一个单元内的材料的选择的热导率对应于待冷却的半导体器件的热分布。

69. 发明授权

US07250576B2 Chip package having chip extension and method 失效
标题翻译：芯片封装具有芯片扩展和方法
公开(公告)号：US07250576B2
公开(公告)日：2007-07-31
申请号：US10908615
申请日：2005-05-19
申请人： Evan G. Colgan , David L. Edwards , Benjamin V. Fasano , Kamal K. Sikka , Jeffrey A. Zitz , Wei Zou
发明人： Evan G. Colgan , David L. Edwards , Benjamin V. Fasano , Kamal K. Sikka , Jeffrey A. Zitz , Wei Zou
IPC分类号： H05K1/16
CPC分类号： H01L23/04 , H01L23/3675 , H01L23/433 , H01L24/31 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83051 , H01L2224/83102 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A chip package including a chip extension for containing thermal interface material (TIM) and improves chip cooling, and a related method, are disclosed. In particular, the chip package includes a chip, a cooling structure coupled to the chip via a TIM, and a chip extension may be thermally coupled to an outer edge of the chip. A TIM placed between the chip and the cooling structure is contained during thermal cycling by the chip extension such that void formation at the edge of the chip, which can move between the chip and cooling structure, is suppressed. The chip extension also improves lateral heat dissipation by providing a greater thermal contact area between the cooling structure and the chip and, if needed, the substrate at a much lower cost than using larger die with lower production unit output from a wafer.
摘要翻译：公开了一种包括用于包含热界面材料（TIM）并提高芯片冷却的芯片延伸的芯片封装以及相关方法。特别地，芯片封装包括芯片，经由TIM耦合到芯片的冷却结构，并且芯片延伸部可热耦合到芯片的外边缘。放置在芯片和冷却结构之间的TIM被芯片延伸部的热循环期间包含，从而可以抑制可在芯片和冷却结构之间移动的芯片边缘处的空隙形成。芯片延伸还通过在冷却结构和芯片之间提供更大的热接触面积，并且如果需要，以比使用具有较低的晶片生产单位输出的较大模具的成本低得多的成本来改善侧向散热。

70. 发明授权

US07012100B1 Cell migration inhibiting compositions and methods and compositions for treating cancer 失效
公开(公告)号：US07012100B1
公开(公告)日：2006-03-14
申请号：US10161843
申请日：2002-06-04
申请人： David L. Edwards , Michael E. Berens , Christian Beaudry
发明人： David L. Edwards , Michael E. Berens , Christian Beaudry
IPC分类号： A01N33/22 , A01N33/20 , A01N33/18 , A01N33/16 , A01N33/00
CPC分类号： G01N33/5011 , A61K31/00 , A61K31/192 , A61K31/215 , A61K31/381 , A61K31/4745 , A61K31/549 , A61K38/193 , A61K39/00 , A61K45/06 , G01N2500/10 , A61K2300/00
摘要： Methods for treating an individual having cancer are provided. The method may include administering a cell migration inhibitor and a chemotherapeutic agent to the individual to inhibit migration of cancer cell. Inhibiting cell migration may increase cell division. In this manner, the cell migration inhibitor and the chemotherapeutic agent in combination may have increased efficacy compared to the chemotherapeutic agent alone due to the increased cell division. The cell migration inhibitor may include any of the inhibitors described herein. For example, the cell migration inhibitor may be an organic molecule having a molecular weight of less than about 700, a monoclonal antibody, or a natural product.

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