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61. 发明授权

US08754517B2 Double side cooling power semiconductor module and multi-stacked power semiconductor module package using the same 有权
标题翻译：双面冷却功率半导体模块和多堆叠功率半导体模块封装使用相同
公开(公告)号：US08754517B2
公开(公告)日：2014-06-17
申请号：US13532362
申请日：2012-06-25
申请人： Kwang Soo Kim , Young Ki Lee , Ji Hyun Park , Bum Seok Suh
发明人： Kwang Soo Kim , Young Ki Lee , Ji Hyun Park , Bum Seok Suh
IPC分类号： H01L23/48
CPC分类号： H01L23/3735 , H01L23/467 , H01L23/473 , H01L23/4985 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2924/1305 , H01L2924/13055 , H01L2924/19105 , H01L2924/00014 , H01L2924/00
摘要： Disclosed herein is a double side cooling power semiconductor module including: a first cooler having a concave part formed in one surface thereof in a thickness direction; a first semiconductor chip mounted on the concave part of the first cooler; a second cooler having one surface and the other surface and formed on one surface of the first cooler so that one surface thereof contacts the first semiconductor chip; a circuit board formed on the other surface of the second cooler; a second semiconductor chip mounted on the circuit board; and a flexible substrate having a circuit layer electrically connecting the first and second semiconductor chips to each other.
摘要翻译：本发明公开了一种双面冷却功率半导体模块，包括：第一冷却器，其厚度方向在其一个表面上形成有凹部; 安装在第一冷却器的凹部上的第一半导体芯片; 第二冷却器，其具有一个表面和另一个表面，并形成在第一冷却器的一个表面上，使得其一个表面接触第一半导体芯片; 形成在所述第二冷却器的另一个表面上的电路板; 安装在所述电路板上的第二半导体芯片; 以及具有将第一和第二半导体芯片彼此电连接的电路层的柔性基板。

62. 发明授权

US08664755B2 Power module package and method for manufacturing the same 失效
标题翻译：电源模块封装及其制造方法
公开(公告)号：US08664755B2
公开(公告)日：2014-03-04
申请号：US13247603
申请日：2011-09-28
申请人： Chang Hyun Lim , Young Ki Lee , Kwang Soo Kim , Seog Moon Choi
发明人： Chang Hyun Lim , Young Ki Lee , Kwang Soo Kim , Seog Moon Choi
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/4334 , H01L23/49531 , H01L23/49551 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/071 , H01L25/50 , H01L2224/291 , H01L2224/29187 , H01L2224/29188 , H01L2224/2919 , H01L2224/32245 , H01L2224/45139 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/4847 , H01L2224/73265 , H01L2924/00014 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15311 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other.
摘要翻译：本文公开了一种功率模块封装，包括：第一基板; 第二基板，其具有用于连接到其一个表面的一侧或两侧上的第一基板的焊盘，并且具有用于连接到形成在其另一个表面上的外部的外部连接端子; 以及引线框架，其一端接合到第一基板，另一端接合到第二基板的焊盘，从而将第一和第二基板彼此垂直连接。

63. 发明授权

US08629538B2 Power module package 失效
标题翻译：电源模块封装
公开(公告)号：US08629538B2
公开(公告)日：2014-01-14
申请号：US13316072
申请日：2011-12-09
申请人： Young Ki Lee , Young Ho Sohn , Kwang Soo Kim , Chang Hyun Lim
发明人： Young Ki Lee , Young Ho Sohn , Kwang Soo Kim , Chang Hyun Lim
IPC分类号： H01L23/495
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/3731 , H01L23/3735 , H01L23/3736 , H01L23/49531 , H01L23/49537 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/29187 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45139 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/4847 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one side of one surface of the first substrate; and a first lead frame contacting the other side of one surface of the first substrate. The power module package further includes: a first metal layer formed on one side of one surface of the first substrate; a first bonding layer formed on the first metal layer and contacting a lower surface of the second substrate; a second metal layer formed on the other side of one surface of the first substrate; and a second bonding layer formed on the second metal layer and contacting a lower surface of the first lead frame.
摘要翻译：本文公开了一种功率模块封装，包括：具有一个表面和另一个表面的第一基板; 第二基板，其接触所述第一基板的一个表面的一侧; 以及与第一基板的一个表面的另一侧接触的第一引线框架。功率模块封装还包括：形成在第一衬底的一个表面的一侧上的第一金属层; 第一接合层，形成在所述第一金属层上并与所述第二基板的下表面接触; 形成在所述第一基板的一个表面的另一侧上的第二金属层; 以及形成在所述第二金属层上并与所述第一引线框架的下表面接触的第二接合层。

64. 发明申请

US20130270687A1 DOUBLE SIDE COOLING POWER SEMICONDUCTOR MODULE AND MULTI-STACKED POWER SEMICONDUCTOR MODULE PACKAGE USING THE SAME 有权
标题翻译：双面冷却功率半导体模块和多层功率半导体模块封装
公开(公告)号：US20130270687A1
公开(公告)日：2013-10-17
申请号：US13532362
申请日：2012-06-25
申请人： Kwang Soo Kim , Young Ki Lee , Ji Hyun Park , Bum Seok Suh
发明人： Kwang Soo Kim , Young Ki Lee , Ji Hyun Park , Bum Seok Suh
IPC分类号： H01L23/34
CPC分类号： H01L23/3735 , H01L23/467 , H01L23/473 , H01L23/4985 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2924/1305 , H01L2924/13055 , H01L2924/19105 , H01L2924/00014 , H01L2924/00
摘要： Disclosed herein is a double side cooling power semiconductor module including: a first cooler having a concave part formed in one surface thereof in a thickness direction; a first semiconductor chip mounted on the concave part of the first cooler; a second cooler having one surface and the other surface and formed on one surface of the first cooler so that one surface thereof contacts the first semiconductor chip; a circuit board formed on the other surface of the second cooler; a second semiconductor chip mounted on the circuit board; and a flexible substrate having a circuit layer electrically connecting the first and second semiconductor chips to each other.
摘要翻译：本发明公开了一种双面冷却功率半导体模块，包括：第一冷却器，其厚度方向在其一个表面上形成有凹部; 安装在第一冷却器的凹部上的第一半导体芯片; 第二冷却器，具有一个表面和另一个表面，并形成在第一冷却器的一个表面上，使得其一个表面接触第一半导体芯片; 形成在所述第二冷却器的另一个表面上的电路板; 安装在所述电路板上的第二半导体芯片; 以及具有将第一和第二半导体芯片彼此电连接的电路层的柔性基板。

65. 发明授权

US08556461B2 Lighting device 有权
标题翻译：照明设备
公开(公告)号：US08556461B2
公开(公告)日：2013-10-15
申请号：US13365655
申请日：2012-02-03
申请人： Kwang Soo Kim , Young Ho Shin , Ki Man Park , Bu Kwan Je
发明人： Kwang Soo Kim , Young Ho Shin , Ki Man Park , Bu Kwan Je
IPC分类号： F21V21/00
CPC分类号： F21V15/01 , F21K9/00 , F21S2/005 , F21V29/74 , F21Y2105/10 , F21Y2115/10
摘要： A lighting device may be provided that includes a light emitting module including a substrate and a light emitting device disposed on the substrate; and a case receiving the light emitting module therewithin and including an upper case disposed on the substrate and a lower case in which the substrate is disposed. The lower case includes a seating portion which is coupled to a heat sink. The seating portion is either a projection projecting outward from the outer surface of the lower case or a recess which is formed by digging inward the outer surface of the lower case.
摘要翻译：可以提供一种照明装置，其包括：发光模块，包括基板和布置在基板上的发光器件; 以及在其中容纳发光模块并且包括设置在基板上的上壳体和设置有基板的下壳体的壳体。下壳体包括联接到散热器的安置部分。座部是从下壳体的外表面向外突出的突起或通过向下挖入下壳体的外表面而形成的凹部。

66. 发明申请

US20130154083A1 SEMICONDUCTOR PACKAGE 有权
标题翻译：半导体封装
公开(公告)号：US20130154083A1
公开(公告)日：2013-06-20
申请号：US13408829
申请日：2012-02-29
申请人： Young Hoon Kwak , Kwang Soo Kim , Young Ki Lee
发明人： Young Hoon Kwak , Kwang Soo Kim , Young Ki Lee
IPC分类号： H01L23/467
CPC分类号： H01L23/473 , H01L2924/0002 , H05K7/20927 , H01L2924/00
摘要： Disclosed herein is a semiconductor package. The semiconductor package includes a semiconductor module, a first heat dissipation unit, a second heat dissipation unit and a housing. The semiconductor module contains a semiconductor device. The first heat dissipation unit is provided under the semiconductor module. The first heat dissipation unit includes at least one first pipe through which first cooling water passes. A first rotator is rotatably disposed in the first pipe. The second heat dissipation unit is provided on the semiconductor module. The second heat dissipation unit includes at least one second pipe through which second cooling water passes. A second rotator is rotatably to disposed in the second pipe. The housing is provided on opposite sides of the semiconductor module, the first heat dissipation unit and the second heat dissipation unit and supports the semiconductor module, the first heat dissipation unit and the second heat dissipation unit.
摘要翻译：这里公开了半导体封装。半导体封装包括半导体模块，第一散热单元，第二散热单元和壳体。半导体模块包含半导体器件。第一散热单元设置在半导体模块的下方。第一散热单元包括至少一个第一冷却水通过的第一管道。第一旋转体可旋转地设置在第一管中。第二散热单元设置在半导体模块上。第二散热单元包括至少一个第二冷却水通过的第二管道。第二旋转体可旋转地设置在第二管中。壳体设置在半导体模块，第一散热单元和第二散热单元的相对侧上，并且支撑半导体模块，第一散热单元和第二散热单元。

67. 发明授权

US08403543B2 Lighting module and lighting apparatus comprising the same 有权
标题翻译：照明模块和包括该照明模块的照明装置
公开(公告)号：US08403543B2
公开(公告)日：2013-03-26
申请号：US13293440
申请日：2011-11-10
申请人： Kwang Soo Kim , Sung Ho Hong , Young Ho Shin , Ki Man Park , Young Seok Yu
发明人： Kwang Soo Kim , Sung Ho Hong , Young Ho Shin , Ki Man Park , Young Seok Yu
IPC分类号： H01L33/00 , H01L31/12
CPC分类号： F21K9/20 , F21S2/005 , F21V29/507 , F21V29/763 , F21V29/83 , F21V31/005 , F21W2131/10 , F21W2131/103 , F21Y2115/10
摘要： A lighting module may be provided that includes a light emitting device module including at least one light emitting diode; and a heat sink radiating heat generated from the light emitting device module and including at least one partition wall formed on a base.
摘要翻译：可以提供一种照明模块，其包括包括至少一个发光二极管的发光器件模块; 以及散热器，辐射从发光器件模块产生的热量，并且包括形成在基座上的至少一个分隔壁。

68. 发明申请

US20130062744A1 POWER MODULE PACKAGE 审中-公开
标题翻译：电源模块封装
公开(公告)号：US20130062744A1
公开(公告)日：2013-03-14
申请号：US13316121
申请日：2011-12-09
申请人： Kwang Soo Kim , Jung Eun Kang , Young Ki Lee
发明人： Kwang Soo Kim , Jung Eun Kang , Young Ki Lee
IPC分类号： H01L23/495
CPC分类号： H01L23/3677 , H01L23/36 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/19105 , H01L2924/00 , H01L2924/00012
摘要： Disclosed herein is a power module package, including: a first substrate having one surface and the other surface; first vias formed to penetrate from one surface of the first substrate to the other surface thereof; a metal layer formed on one surface of the first substrate; semiconductor devices formed on the metal layer; and a metal plate formed on the other surface of the first substrate.
摘要翻译：本文公开了一种功率模块封装，包括：具有一个表面和另一个表面的第一基板; 形成为从第一基板的一个表面穿透到其另一个表面的第一通孔; 形成在所述第一基板的一个表面上的金属层; 形成在金属层上的半导体器件; 以及形成在所述第一基板的另一个表面上的金属板。

69. 外观设计

USD675372S1 Head of street lamp 有权
标题翻译：路灯头
公开(公告)号：USD675372S1
公开(公告)日：2013-01-29
申请号：US29400173
申请日：2011-08-24
申请人： Kwang Soo Kim , Bu Kwan Je , Ki Man Park , Young Ho Shin , Ye Seul Yang , Ji Hoo Kim
设计人： Kwang Soo Kim , Bu Kwan Je , Ki Man Park , Young Ho Shin , Ye Seul Yang , Ji Hoo Kim

70. 发明申请

US20120319259A1 POWER MODULE PACKAGE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：电源模块包装及其制造方法
公开(公告)号：US20120319259A1
公开(公告)日：2012-12-20
申请号：US13235176
申请日：2011-09-16
申请人： Kwang Soo Kim , Ji Hyun Park , Young Ki Lee , Seog Moon Choi
发明人： Kwang Soo Kim , Ji Hyun Park , Young Ki Lee , Seog Moon Choi
IPC分类号： H01L23/495 , H01L21/50
CPC分类号： H01L24/43 , H01L23/3107 , H01L23/49537 , H01L23/49568 , H01L23/49575 , H01L23/49586 , H01L24/48 , H01L2224/32245 , H01L2224/43 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/15724 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.
摘要翻译：这里公开了功率模块封装及其制造方法。功率模块封装包括：布置成彼此面对的第一和第二引线框架，第一和第二框架中的任一个或第二框架由铝制成; 阳极氧化层形成在第一和第二引线框架中由铝制成的引线框架的部分上; 以及安装在第一和第二引线框架的第一表面上的半导体器件。

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