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    • 61. 发明授权
    • Thin film transistor array substrate for liquid crystal display and method of fabricating the same
    • 用于液晶显示器的薄膜晶体管阵列基板及其制造方法
    • US07005670B2
    • 2006-02-28
    • US11167155
    • 2005-06-28
    • Sang-Gab KimMun-Pyo Hong
    • Sang-Gab KimMun-Pyo Hong
    • H01L29/06H01L27/01
    • H01L29/66765G02F2001/13629H01L27/124H01L29/456H01L29/4908
    • In a method of fabricating a thin film transistor array substrate, an aluminum-based conductive layer is deposited onto an insulating substrate, and patterned to form a gate line assembly. The gate line assembly includes gate lines, gate electrodes, and gate pads. A gate insulating layer is formed on the substrate with the gate line assembly. A semiconductor layer, and an ohmic contact layer are sequentially formed on the gate insulating layer. A double-layered conductive film with a chrome-based under-layer and an aluminum-based over-layer is deposited onto the substrate, and patterned to form a data line assembly. The data line assembly includes data lines crossing over the gate lines, source electrodes, drain electrodes, and data pads. The chrome-based under-layer of the conductive film is patterned through dry etching while using Cl2 or HCl as the dry etching gas. A protective layer is deposited onto the substrate, and patterned to thereby form contact holes exposing the drain electrodes, the gate pads, and the data pads. Indium zinc oxide is deposited onto the substrate, and patterned to thereby form pixel electrodes connected to the drain electrodes through the corresponding contact holes, and subsidiary gate and data pads connected to the gate and data pads through the corresponding contact holes.
    • 在制造薄膜晶体管阵列基板的方法中,将铝基导电层沉积到绝缘基板上,并被图案化以形成栅极线组件。 栅极线组件包括栅极线,栅电极和栅极焊盘。 在栅极线组件的基板上形成栅极绝缘层。 半导体层和欧姆接触层依次形成在栅绝缘层上。 将具有铬基底层和铝基超层的双层导电膜沉积到衬底上,并被图案化以形成数据线组件。 数据线组件包括跨越栅极线,源电极,漏电极和数据焊盘的数据线。 通过干蚀刻将导电膜的铬基底层图案化,同时使用Cl 2/2或HCl作为干蚀刻气体。 保护层沉积到衬底上,并被图案化,从而形成露出漏电极,栅极焊盘和数据焊盘的接触孔。 将铟锌氧化物沉积在衬底上,并被图案化,从而通过相应的接触孔形成连接到漏电极的像素电极,以及通过对应的接触孔连接到栅极和数据焊盘的辅助栅极和数据焊盘。
    • 63. 发明授权
    • Thin film transistor array panel
    • 薄膜晶体管阵列面板
    • US06943367B2
    • 2005-09-13
    • US10395233
    • 2003-03-25
    • Sang-Gab KimMun-Pyo Hong
    • Sang-Gab KimMun-Pyo Hong
    • G02F1/1368G02F1/136H01L21/3205H01L21/3213H01L21/336H01L21/768H01L21/77H01L21/84H01L23/52H01L27/12H01L29/45H01L29/49H01L29/786H01L29/06H01L27/01
    • H01L29/66765G02F2001/13629H01L27/124H01L29/456H01L29/4908
    • In a method of fabricating a thin film transistor array substrate, an aluminum-based conductive layer is deposited onto an insulating substrate, and patterned to form a gate line assembly. The gate line assembly includes gate lines, gate electrodes, and gate pads. A gate insulating layer is formed on the substrate with the gate line assembly. A semiconductor layer, and an ohmic contact layer are sequentially formed on the gate insulating layer. A double-layered conductive film with a chrome-based under-layer and an aluminum-based over-layer is deposited onto the substrate, and patterned to form a data line assembly. The data line assembly includes data lines crossing over the gate lines, source electrodes, drain electrodes, and data pads. The chrome-based under-layer of the conductive film is patterned through dry etching while using Cl2 or HCl as the dry etching gas. A protective layer is deposited onto the substrate, and patterned to thereby form contact holes exposing the drain electrodes, the gate pads, and the data pads. Indium zinc oxide is deposited onto the substrate, and patterned to thereby form pixel electrodes connected to the drain electrodes through the corresponding contact holes, and subsidiary gate and data pads connected to the gate and data pads through the corresponding contact holes.
    • 在制造薄膜晶体管阵列基板的方法中,将铝基导电层沉积到绝缘基板上,并被图案化以形成栅极线组件。 栅极线组件包括栅极线,栅电极和栅极焊盘。 在栅极线组件的基板上形成栅极绝缘层。 半导体层和欧姆接触层依次形成在栅绝缘层上。 将具有铬基底层和铝基超层的双层导电膜沉积到衬底上,并被图案化以形成数据线组件。 数据线组件包括跨越栅极线,源电极,漏电极和数据焊盘的数据线。 通过干蚀刻将导电膜的铬基底层图案化,同时使用Cl 2/2或HCl作为干蚀刻气体。 保护层沉积到衬底上,并被图案化,从而形成露出漏电极,栅极焊盘和数据焊盘的接触孔。 将铟锌氧化物沉积在衬底上,并被图案化,从而通过相应的接触孔形成连接到漏电极的像素电极,以及通过对应的接触孔连接到栅极和数据焊盘的辅助栅极和数据焊盘。
    • 64. 发明授权
    • Liquid crystal display
    • 液晶显示器
    • US06850294B2
    • 2005-02-01
    • US10469848
    • 2002-02-25
    • Nam-Seok RohMun-Pyo HongChong-Chul ChaiSoo-Guy Rho
    • Nam-Seok RohMun-Pyo HongChong-Chul ChaiSoo-Guy Rho
    • G02F1/13357G02F1/133G02F1/1335G02F1/1343G02F1/1345G02F1/1368
    • G02F1/133514G02F2201/52G09G3/3614
    • Pixels of red, blue and green are sequentially arranged in the row. The red and green pixels are alternately arranged in the column while the blue pixels being repeatedly arranged in the column. The four red and green pixels surrounding the two blue pixels at the two neighboring pixel rows face each other around the blue pixels. Gate lines are arranged at the respective rows to transmit scanning signals. Data lines cross over the gate lines in an insulating manner, and are arranged at the respective columns to transmit picture signals. Pixel electrodes and thin film transistor are formed at respective pixels. The blue pixel has the same area as or an area smaller than the red and green pixels. The pixel electrodes are overlapped with the gate or the data lines via a passivation layer of low dielectric organic material or an insulating material such as SiOC, SiOF.
    • 红色,蓝色和绿色的像素依次排列在行中。 红色和绿色像素交替排列在列中,而蓝色像素被重复排列在列中。 围绕两个相邻像素行的两个蓝色像素的四个红色和绿色像素围绕蓝色像素彼此面对。 栅极线被布置在相应的行以发射扫描信号。 数据线以绝缘方式跨越栅极线,并且布置在各列处以传输图像信号。 像素电极和薄膜晶体管形成在各个像素处。 蓝色像素具有与红色和绿色像素相同的面积或更小的面积。 像素电极经由低介电有机材料的钝化层或绝缘材料如SiOC,SiOF与栅极或数据线重叠。
    • 66. 发明授权
    • Electrophoretic display device
    • 电泳显示装置
    • US08749476B2
    • 2014-06-10
    • US11140850
    • 2005-05-31
    • Nam-Seok RohMun-Pyo Hong
    • Nam-Seok RohMun-Pyo Hong
    • G09G3/34G06F3/042
    • G02F1/167G09G3/344G09G2300/0809G09G2360/14
    • A electrophoretic display device is provided, which includes: a thin film transistor array panel including a substrate, gate and data lines formed on the substrate and crossing each other, switching thin film transistors electrically connected to the gate and data lines, a photo sensor formed on the substrate, and pixel electrodes electrically connected to the switching thin film transistors; a common electrode panel facing the thin film transistor array panel and having a common electrode; and a display layer disposed between the thin film transistor array panel and the common electrode panel. The display layer includes micro capsules containing negative and positive pigment particles.
    • 提供了一种电泳显示装置,其包括:薄膜晶体管阵列面板,包括形成在基板上并彼此交叉的基板,栅极和数据线,开关电连接到栅极和数据线的薄膜晶体管,形成的光电传感器 和与开关薄膜晶体管电连接的像素电极; 面对薄膜晶体管阵列面板并具有公共电极的公共电极面板; 以及设置在薄膜晶体管阵列面板和公共电极面板之间的显示层。 显示层包括含有负性和正性颜料颗粒的微胶囊。
    • 68. 发明授权
    • Contact structure of a wiring and a thin film transistor array panel including the same
    • 布线的接触结构和包括该布线的薄膜晶体管阵列面板
    • US07507996B2
    • 2009-03-24
    • US10754572
    • 2004-01-12
    • Mun-Pyo HongSang-Gab Kim
    • Mun-Pyo HongSang-Gab Kim
    • H01L27/12
    • G02F1/1362G02F1/136286H01L27/124H01L27/1288H01L29/458
    • First, a conductive material made of aluminum-based material is deposited and patterned to form a gate wire including a gate line, a gate pad, and a gate electrode. A gate insulating layer is formed, and a semiconductor layer and an ohmic contact layer are sequentially formed. Next, a conductor layer including a lower layer of Cr and an upper layer of aluminum-based material is deposited and patterned to form a data wire include a data line intersecting the gate line, a source electrode, a drain electrode and a data pad. Then, a passivation layer is deposited and patterned to form contact holes exposing the drain electrode, the gate pad and the data pad, respectively. Next, an amorphous silicon layer is deposited, an annealing process is executed to form inter-layer reaction layers on the drain electrode, the gate pa and the data pad, which are exposed through the contact holes. Then, the amorphous silicon layer is removed. Next, IZO is deposited and patterned to form a pixel electrode, a redundant gate pad and a redundant data pad respectively and electrically connected to the drain electrode, the gate pad and the data pad via the inter-layer reaction layers.
    • 首先,将由铝基材料制成的导电材料沉积并图案化以形成包括栅极线,栅极焊盘和栅电极的栅极线。 形成栅绝缘层,依次形成半导体层和欧姆接触层。 接下来,沉积包括下层Cr的导体层和铝基材料的上层,并构图以形成包括与栅极线相交的数据线,源电极,漏电极和数据焊盘的数据线。 然后,沉积并图案化钝化层以形成分别暴露漏电极,栅极焊盘和数据焊盘的接触孔。 接下来,沉积非晶硅层,执行退火处理,以在漏电极,栅极pa和数据焊盘上形成通过接触孔露出的层间反应层。 然后,去除非晶硅层。 接下来,IZO被沉积和图案化以分别形成像素电极,冗余栅极焊盘和冗余数据焊盘,并经由层间反应层电连接到漏电极,栅极焊盘和数据焊盘。