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    • 61. 发明授权
    • Doped structure for FinFET devices
    • FinFET器件的掺杂结构
    • US07196374B1
    • 2007-03-27
    • US10653274
    • 2003-09-03
    • Ming-Ren LinBin Yu
    • Ming-Ren LinBin Yu
    • H01L29/76
    • H01L29/785H01L29/42384H01L29/4908H01L29/66795H01L29/78687
    • A semiconductor device includes a substrate and an insulating layer on the substrate. The semiconductor device also includes a fin structure formed on the insulating layer, where the fin structure includes first and second side surfaces, a dielectric layer formed on the first and second side surfaces of the fin structure, a first gate electrode formed adjacent the dielectric layer on the first side surface of the fin structure, a second gate electrode formed adjacent the dielectric layer on the second side surface of the fin structure, and a doped structure formed on an upper surface of the fin structure in the channel region of the semiconductor device.
    • 半导体器件包括衬底和衬底上的绝缘层。 半导体器件还包括形成在绝缘层上的翅片结构,其中鳍结构包括第一和第二侧表面,形成在鳍结构的第一和第二侧表面上的电介质层,形成在电介质层附近的第一栅电极 在翅片结构的第一侧表面上形成与鳍结构的第二侧表面上的电介质层相邻的第二栅电极,以及在半导体器件的沟道区中形成在鳍结构的上表面上的掺杂结构 。
    • 69. 发明授权
    • Method for improving MOS mobility
    • 提高MOS迁移率的方法
    • US06921704B1
    • 2005-07-26
    • US10700557
    • 2003-11-05
    • David WuAkif SultanBin Yu
    • David WuAkif SultanBin Yu
    • H01L21/762H01L21/764H01L21/8234H01L21/8238H01L21/76
    • H01L21/764H01L21/76224H01L21/823481H01L21/823878
    • A method of forming a silicon-on-insulator semiconductor device including providing a substrate and forming a trench in the substrate, wherein the trench includes opposing side walls extending upwardly from a base of the trench. The method also includes depositing at least two insulating layers into the trench to form a shallow trench isolation structure, wherein an innermost of the insulating layers substantially conforms to the base and the two side walls of the trench and an outermost of the insulating layers spans the side walls of the trench so that a gap is formed between the insulating layers in the trench. The gap creates compressive forces within the shallow trench isolation structure, which in turn creates tensile stress within the surrounding substrate to enhance mobility of the device.
    • 一种形成绝缘体上半导体器件的方法,包括提供衬底并在衬底中形成沟槽,其中沟槽包括从沟槽的基底向上延伸的相对的侧壁。 该方法还包括将至少两个绝缘层沉积到沟槽中以形成浅沟槽隔离结构,其中绝缘层的最内层基本上与基底一致并且沟槽的两个侧壁和绝缘层的最外层横跨 沟槽的侧壁,使得在沟槽中的绝缘层之间形成间隙。 间隙在浅沟槽隔离结构内产生压缩力,这反过来在周围的衬底内产生拉伸应力,以增强器件的移动性。