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61. 发明申请

US20070139061A1 PROBING APPARATUS WITH GUARDED SIGNAL TRACES 失效
标题翻译：具有保护信号跟踪的探测设备
公开(公告)号：US20070139061A1
公开(公告)日：2007-06-21
申请号：US11566194
申请日：2006-12-01
申请人： Benjamin Eldridge , Carl Reynolds , Takao Saeki , Yoichi Urakawa
发明人： Benjamin Eldridge , Carl Reynolds , Takao Saeki , Yoichi Urakawa
IPC分类号： G01R31/02
CPC分类号： G01R1/18 , G01R1/07307 , G01R31/2889
摘要： A probing apparatus can comprise a substrate, conductive signal traces, probes, and electromagnetic shielding. The substrate can have a first surface and a second surface opposite the first surface, and the electrically conductive first signal traces can be disposed on the first surface of the first substrate. The probes can be attached to the first signal traces, and the electromagnetic shielding structures can be disposed about the signal traces.
摘要翻译：探测装置可以包括衬底，导电信号迹线，探针和电磁屏蔽。衬底可以具有与第一表面相对的第一表面和第二表面，并且导电的第一信号迹线可以设置在第一衬底的第一表面上。探针可以附着到第一信号迹线上，并且电磁屏蔽结构可以围绕信号迹线设置。

62. 发明申请

US20070139060A1 METHOD AND SYSTEM FOR COMPENSATING THERMALLY INDUCED MOTION OF PROBE CARDS 有权
标题翻译：用于补偿探针卡的热诱导运动的方法和系统
公开(公告)号：US20070139060A1
公开(公告)日：2007-06-21
申请号：US11548183
申请日：2006-10-10
申请人： Rod Martens , Benjamin Eldridge , Gary Grube , Ken Matsubayashi , Richard Larder , Makarand Shinde , Gaetan Mathieu
发明人： Rod Martens , Benjamin Eldridge , Gary Grube , Ken Matsubayashi , Richard Larder , Makarand Shinde , Gaetan Mathieu
IPC分类号： G01R31/02
CPC分类号： G01R31/2891 , G01R1/07342 , G01R31/2886
摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.
摘要翻译：本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

63. 发明申请

US20070132478A1 Semiconductor Fuse Covering 审中-公开
标题翻译：半导体保险丝覆盖
公开(公告)号：US20070132478A1
公开(公告)日：2007-06-14
申请号：US11676930
申请日：2007-02-20
申请人： Benjamin Eldridge
发明人： Benjamin Eldridge
IPC分类号： G01R31/26
CPC分类号： H01L22/22 , H01L23/5256 , H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： A method and system for sealing or covering exposed fuses on a semiconductor device are disclosed. A semiconductor device prober incorporating a spray device for applying a sealing compound to individual fuses on a semiconductor device subsequent to testing the semiconductor device is disclosed. A method and system for sealing exposed fuses on a semiconductor device is disclosed which allows the sealing step to be performed either prior to or following singulation of the semiconductor device into individual dice.
摘要翻译：公开了一种用于密封或覆盖半导体器件上暴露的熔丝的方法和系统。公开了一种半导体器件探测器，其包括用于在测试半导体器件之后在半导体器件上的单个熔丝施加密封化合物的喷射装置。公开了一种用于密封半导体器件上的暴露的熔丝的方法和系统，其允许在将半导体器件分割成单个裸片之前或之后执行密封步骤。

64. 发明申请

US20070062913A1 Probe Array and Method of Its Manufacture 有权
标题翻译：探针阵列及其制造方法
公开(公告)号：US20070062913A1
公开(公告)日：2007-03-22
申请号：US11550340
申请日：2006-10-17
申请人： Gaetan Mathieu , Benjamin Eldridge , Gary Grube
发明人： Gaetan Mathieu , Benjamin Eldridge , Gary Grube
IPC分类号： B23H9/00 , B23H5/00
CPC分类号： B23H9/00 , G01R1/07314
摘要： A method of forming a probe array includes forming a layer of tip material over a block of probe material. A first electron discharge machine (EDM) electrode is positioned over the layer of tip material, the EDM electrode having a plurality of openings corresponding to a plurality of probes to be formed. Excess material from the layer of tip material and the block of probe material is removed to form the plurality of probes. A substrate having a plurality of through holes corresponding to the plurality of probes is positioned so that the probes penetrate the plurality of through holes. The substrate is bonded to the plurality of probes. Excess probe material is removed so as to planarize the substrate.
摘要翻译：形成探针阵列的方法包括在探针材料块上形成尖端材料层。第一电子放电机（EDM）电极位于尖端材料层上方，EDM电极具有与要形成的多个探针对应的多个开口。去除从尖端材料层和探针材料块的多余材料以形成多个探针。具有对应于多个探针的多个通孔的基板被定位成使得探针穿透多个通孔。衬底被结合到多个探针。去除过量的探针材料以使基底平坦化。

65. 发明申请

US20070007977A1 Probe Card Assembly With An Interchangeable Probe Insert 有权
标题翻译：探头卡组件与可互换探头插入
公开(公告)号：US20070007977A1
公开(公告)日：2007-01-11
申请号：US11306270
申请日：2005-12-21
申请人： Benjamin Eldridge , Carl Reynolds , Nobuhiro Kawamata , Takao Saeki
发明人： Benjamin Eldridge , Carl Reynolds , Nobuhiro Kawamata , Takao Saeki
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R31/31905
摘要： A probe card assembly can include an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly can provide an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly that are part of the interface to the tester. The insert holder can be detached from the probe card assembly. The probe insert of the probe card assembly can be replaced by detaching the insert holder, replacing the probe insert with a new probe insert, and then reattaching the insert holder to the probe card assembly. The probe insert and holder can be integrally formed and comprise a single structure that can be detached from a probe card assembly and replaced with a different probe insert and holder.
摘要翻译：探针卡组件可以包括构造成保持探针插入件的插入物保持器，其可以包括设置在特定构造中的探针，用于探测要测试的装置。探针卡组件可以向测试器提供电接口，该接口可以控制设备的测试，并且在附接到探针卡组件时，插入物保持器可以保持探针插入件，使得探针插件电连接到内部的电路径探针卡组件是测试仪接口的一部分。插入架可以从探针卡组件拆下。探针卡组件的探针插入可以通过拆卸插入物夹持器，用新的探针插入物代替探针插入物，然后将插入物夹持器重新连接到探针卡组件来代替。探针插入物和保持器可以一体地形成并且包括可以从探针卡组件分离并且用不同的探针插入物和保持器代替的单个结构。

66. 发明申请

US20060244470A1 Probe card configuration for low mechanical flexural strength electrical routing substrates 失效
公开(公告)号：US20060244470A1
公开(公告)日：2006-11-02
申请号：US11479068
申请日：2006-06-30
申请人： Makarand Shinde , Richard Larder , Timothy Cooper , Ravindra Shenoy , Benjamin Eldridge
发明人： Makarand Shinde , Richard Larder , Timothy Cooper , Ravindra Shenoy , Benjamin Eldridge
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R1/07378
摘要： A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.

67. 发明申请

US20060211234A1 RE-ASSEMBLY PROCESS FOR MEMS STRUCTURES 失效
标题翻译： MEMS结构的组装方法
公开(公告)号：US20060211234A1
公开(公告)日：2006-09-21
申请号：US11420403
申请日：2006-05-25
申请人： Benjamin Eldridge , Gaetan Mathieu
发明人： Benjamin Eldridge , Gaetan Mathieu
IPC分类号： H01L21/44
CPC分类号： B81C1/00214 , B81B7/04 , B81C3/002 , B81C2203/051 , G01R1/06711 , G01R1/06744 , G01R1/07314 , G01R1/07342 , G01R3/00 , H01L23/49827 , H01L2924/0002 , H01L2924/15174 , Y10T29/49004 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49151 , Y10T29/49204 , H01L2924/00
摘要： Methods of fabricating an array of aligned microstructures on a substrate are disclosed. The microstructures may be spring contacts or other microelements. The methods disclosed include construction of an alignment substrate, alignment of die elements with the alignment substrate, and fixation of the aligned die elements to a backing substrate.
摘要翻译：公开了在衬底上制造排列的微结构阵列的方法。微结构可以是弹簧触点或其他微量元件。所公开的方法包括对准基板的构造，模具元件与对准基板的对准以及将对准的模具元件固定到背衬基板上。

68. 发明申请

US20060057875A1 Probe card covering system and method 失效
公开(公告)号：US20060057875A1
公开(公告)日：2006-03-16
申请号：US11264948
申请日：2005-11-01
申请人： Benjamin Eldridge , Carl Reynolds
发明人： Benjamin Eldridge , Carl Reynolds
IPC分类号： H01R13/44
CPC分类号： G01R31/2851 , G01R31/2886
摘要： The present invention discloses a cover over electrical contacts of a probe card used in testing die on a wafer. A testing machine is disclosed as having the covered probe card therein. Various mechanisms for uncovering the electrical contacts while it is located in the tester machine are disclosed.

69. 发明申请

US20050189956A1 Electronic components with plurality of contoured microelectronic spring contacts 失效
标题翻译：具有多个成型微电子弹簧触头的电子部件
公开(公告)号：US20050189956A1
公开(公告)日：2005-09-01
申请号：US11119715
申请日：2005-05-02
申请人： Benjamin Eldridge , Stuart Wenzel
发明人： Benjamin Eldridge , Stuart Wenzel
IPC分类号： H01R12/61 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , H01L23/48 , H01R13/24 , H05K3/40 , H05K7/10 , G01R31/02
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06711 , G01R1/06727 , G01R1/06733 , G01R1/06744 , G01R1/06761 , G01R1/07342 , G01R3/00 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H01R12/52 , H01R12/714 , H01R13/2407 , H01R13/2442 , H01R2201/20 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： An electronic component is disclosed, having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resilient material deposited over a contoured sacrificial substrate, and comprises a base mounted to the planar face of the component, a beam connected to the base at a first end of the beam, and a tip positioned at a free end of the beam opposite to the base. The beam has an unsupported span between its free end and its base. The microelectronic spring contacts are advantageously formed by depositing a resilient material over a molded, sacrificial substrate. The spring contacts may be provided with various innovative contoured shapes. In various embodiments of the invention, the electronic component comprises a semiconductor die, a semiconductor wafer, a LGA socket, an interposer, or a test head assembly.
摘要翻译：公开了一种电子部件，其具有安装到部件的平面上的多个微电子弹簧触头。微电子弹簧触点中的每一个都具有波纹形梁，其可以由沉积在轮廓牺牲基板上的弹性材料的整体层形成，并且包括安装到部件的平面上的基座，梁的第一端和位于梁的与基座相对的自由端的尖端。梁在其自由端和底座之间具有不受支撑的跨距。微电子弹簧触头有利地通过在模制的牺牲衬底上沉积弹性材料形成。弹簧触点可以具有各种创新的轮廓形状。在本发明的各种实施例中，电子部件包括半导体管芯，半导体晶片，LGA插座，插入件或测试头组件。

70. 发明申请

US20050148214A1 Lithographic contact elements 有权
标题翻译：光刻接触元件
公开(公告)号：US20050148214A1
公开(公告)日：2005-07-07
申请号：US10933063
申请日：2004-09-02
申请人： Gaetan Mathieu , Benjamin Eldridge , Gary Grube
发明人： Gaetan Mathieu , Benjamin Eldridge , Gary Grube
IPC分类号： G01R1/067 , G01R3/00 , H05K3/32 , H05K3/40 , H01R12/00
CPC分类号： G01R3/00 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06744 , G01R1/06761 , H01L21/6835 , H01L23/49811 , H01L24/16 , H01L25/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/1147 , H01L2224/11902 , H01L2224/13012 , H01L2224/13017 , H01L2224/13019 , H01L2224/1308 , H01L2224/13099 , H01L2225/06513 , H01L2225/06527 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H05K3/326 , H05K3/4092 , Y10S438/977 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.
摘要翻译：通过光刻技术形成包括弹簧接触元件的互连的方法。在一个实施例中，该方法包括在衬底的第一部分上施加掩模材料，掩模材料具有将限定弹簧结构的第一部分的开口，在开口中沉积结构材料（例如导电材料）并用结构材料过度填充开口，去除结构材料的一部分，以及去除掩模材料的第一部分。在该实施例中，弹簧结构的第一部分的至少一部分没有掩蔽材料。在本发明的一个方面，该方法包括平坦化掩模材料层和结构材料以去除结构材料的一部分。另一方面，形成的弹簧结构包括柱部分，梁部分和尖端结构部分中的一个。

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