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61. 发明授权

US5071207A Broadband diffractive lens or imaging element 失效
$Broadband diffractive lens or imaging element$
标题翻译：宽带衍射透镜或成像元件
公开(公告)号：US5071207A
公开(公告)日：1991-12-10
申请号：US587699
申请日：1990-09-25
申请人： Natale M. Ceglio , Andrew M. Hawryluk , Richard A. London , Lynn G. Seppala
发明人： Natale M. Ceglio , Andrew M. Hawryluk , Richard A. London , Lynn G. Seppala
IPC分类号： G02B5/18
CPC分类号： G02B5/1876 , G02B5/188
摘要： A broadband diffractive lens or imaging element produces a sharp focus and/or a high resolution image with broad bandwidth illuminating radiation. The diffractive lens is sectored or segmented into regions, each of which focuses or images a distinct narrowband of radiation but all of which have a common focal length. Alternatively, a serial stack of minus filters, each with a diffraction pattern which focuses or images a distinct narrowband of radiation but all of which have a common focal length, is used. The two approaches can be combined. Multifocal broadband diffractive elements can also be formed.
摘要翻译：宽带衍射透镜或成像元件产生具有宽带宽照明辐射的清晰焦点和/或高分辨率图像。衍射透镜被分割或分割成各个区域，每个区域聚焦或成像不同的辐射窄带，但都具有共同的焦距。或者，使用负滤波器的串联堆叠，每个具有聚焦或图像不同的辐射窄带的衍射图案，但都具有共同的焦距。这两种方法可以组合。也可以形成多焦点宽带衍射元件。

62. 发明授权

US08765493B2 Methods of characterizing semiconductor light-emitting devices based on product wafer characteristics 有权
标题翻译：基于产品晶片特性来表征半导体发光器件的方法
公开(公告)号：US08765493B2
公开(公告)日：2014-07-01
申请号：US13681994
申请日：2012-11-20
申请人： Andrew M. Hawryluk , David Owen
发明人： Andrew M. Hawryluk , David Owen
IPC分类号： H01L21/00
CPC分类号： H01L33/005 , G01B11/24 , H01L33/0095
摘要： Methods of characterizing semiconductor light-emitting devices (LEDs) based on product wafer characteristics are disclosed. The methods include measuring at least one product wafer characteristic, such curvature or device layer stress. The method also includes establishing a relationship between the at least one characteristic and the emission wavelengths of the LED dies formed from the product wafer. The relationship allows for predicting the emission wavelength of LED structures formed in the device layer of similarly formed product wafers. This in turn can be used to characterize the product wafers and in particular the LED structures formed thereon, and to perform process control in high-volume LED manufacturing.
摘要翻译：公开了基于产品晶片特性来表征半导体发光器件（LED）的方法。这些方法包括测量至少一个产品晶片特性，这种曲率或器件层应力。该方法还包括建立从产品晶片形成的LED管芯的至少一个特性与发射波长之间的关系。该关系允许预测在类似形成的产品晶片的器件层中形成的LED结构的发射波长。这又可以用于表征产品晶片，特别是其上形成的LED结构，并且在大容量LED制造中执行过程控制。

63. 发明申请

US20140141538A1 METHODS OF CHARACTERIZING SEMICONDUCTOR LIGHT-EMITTING DEVICES BASED ON PRODUCT WAFER CHARACTERISTICS 有权
标题翻译：基于产品波形特性的半导体发光器件表征方法
公开(公告)号：US20140141538A1
公开(公告)日：2014-05-22
申请号：US13681994
申请日：2012-11-20
申请人： Andrew M. Hawryluk , David Owen
发明人： Andrew M. Hawryluk , David Owen
IPC分类号： H01L33/00 , G01B11/24
CPC分类号： H01L33/005 , G01B11/24 , H01L33/0095
摘要： Methods of characterizing semiconductor light-emitting devices (LEDs) based on product wafer characteristics are disclosed. The methods include measuring at least one product wafer characteristic, such curvature or device layer stress. The method also includes establishing a relationship between the at least one characteristic and the emission wavelengths of the LED dies formed from the product wafer. The relationship allows for predicting the emission wavelength of LED structures formed in the device layer of similarly formed product wafers. This in turn can be used to characterize the product wafers and in particular the LED structures formed thereon, and to perform process control in high-volume LED manufacturing.
摘要翻译：公开了基于产品晶片特性来表征半导体发光器件（LED）的方法。这些方法包括测量至少一个产品晶片特性，这种曲率或器件层应力。该方法还包括建立从产品晶片形成的LED管芯的至少一个特性与发射波长之间的关系。该关系允许预测在类似形成的产品晶片的器件层中形成的LED结构的发射波长。这又可以用于表征产品晶片，特别是其上形成的LED结构，并且在大容量LED制造中执行过程控制。

64. 发明申请

US20130267096A1 Systems for and methods of laser-enhanced plasma processing of semiconductor materials 有权
标题翻译：半导体材料激光等离子体加工的系统和方法
公开(公告)号：US20130267096A1
公开(公告)日：2013-10-10
申请号：US13438865
申请日：2012-04-04
申请人： Andrew M. Hawryluk , Arthur W. Zafiropoulo
发明人： Andrew M. Hawryluk , Arthur W. Zafiropoulo
IPC分类号： H01L21/302 , H01L21/31 , B23K9/00
CPC分类号： H01J37/32339 , H01J37/32082 , H01L21/02046 , H01L21/268 , H01L21/3065 , H01L21/67115
摘要： Systems for and methods of laser-enhanced plasma processing of semiconductor materials are disclosed. The method includes supporting a semiconductor material in a processing chamber interior and subjecting the semiconductor material to a plasma process. The method also includes simultaneously heating the wafer surface with a laser beam through a window in the processing chamber to increase the reaction rate of the plasma process. Other methods include performing laser heating of the semiconductor material before or after the plasma process but while the semiconductor material resides in the same chamber interior.
摘要翻译：公开了半导体材料的激光增强等离子体处理的系统和方法。该方法包括将半导体材料支撑在处理室内部并对半导体材料进行等离子体处理。该方法还包括通过处理室中的窗口同时用激光束加热晶片表面以增加等离子体处理的反应速率。其他方法包括在等离子体处理之前或之后对半导体材料进行激光加热，但半导体材料位于相同的室内。

65. 发明申请

US20130044301A1 Programmable illuminator for a photolithography system 有权
标题翻译：用于光刻系统的可编程照明器
公开(公告)号：US20130044301A1
公开(公告)日：2013-02-21
申请号：US13199112
申请日：2011-08-19
申请人： Borislav Zlatanov , Andrew M. Hawryluk
发明人： Borislav Zlatanov , Andrew M. Hawryluk
IPC分类号： G03B27/54
CPC分类号： G03F7/70066 , G02B26/0833 , G03F7/70558
摘要： A programmable illuminator for a photolithography system includes a light source, a first optical system having a light uniformizing element, a programmable micro-mirror device, and a second optical system that forms an illumination field that illuminates a reticle. The programmable micro-mirror device can be configured to perform shutter and edge-exposure-blocking functions that have previously required relatively large mechanical devices. Methods of improving illumination field uniformity using the programmable illuminator are also disclosed.
摘要翻译：用于光刻系统的可编程照明器包括光源，具有光均化元件的第一光学系统，可编程微镜器件以及形成照明光栅的照明场的第二光学系统。可编程微镜装置可以被配置为执行先前需要相对大的机械装置的快门和边缘曝光阻挡功能。还公开了使用可编程照明器改善照明场均匀性的方法。

66. 发明申请

US20120062726A1 Optical alignment systems for forming LEDs having a rough surface 失效
标题翻译：用于形成具有粗糙表面的LED的光学对准系统
公开(公告)号：US20120062726A1
公开(公告)日：2012-03-15
申请号：US13302308
申请日：2011-11-22
申请人： Robert L. Hsieh , Khiem Nguyen , Warren W. Flack , Andrew M. Hawryluk
发明人： Robert L. Hsieh , Khiem Nguyen , Warren W. Flack , Andrew M. Hawryluk
IPC分类号： H04N7/18
CPC分类号： G03F9/7084 , G03F9/7065 , G03F9/7076 , G03F9/708 , G03F9/7088 , H01L33/22
摘要： An alignment system for aligning a wafer when lithographically fabricating LEDs having an LED wavelength λLED is disclosed. The system includes the wafer. The wafer has a roughened alignment mark with a root-mean-square (RMS) surface roughness σS. The system has a lens configured to superimpose an image of the reticle alignment mark with an image of the roughened alignment mark. The roughened alignment marked image is formed with alignment light having a wavelength λA that is in the range from about 2σS to about 8σS. An image sensor detects the superimposed image. An image processing unit processes the detected superimposed image to measure an alignment offset between the wafer and the reticle.
摘要翻译：公开了一种用于在光刻制造具有LED波长λLED的LED的晶片时对准晶片的对准系统。该系统包括晶片。晶片具有粗糙的对准标记，均方根（RMS）表面粗糙度S。该系统具有配置为用掩模版对准标记的图像叠加掩模版对准标记的图像的透镜。粗糙的对准标记图像由波长λA为约2＆Sgr; S至约8＆Sgr; S的对准光形成。图像传感器检测叠加图像。图像处理单元处理检测到的叠加图像以测量晶片和标线片之间的对准偏移。

67. 发明授权

US08067305B2 Electrically conductive structure on a semiconductor substrate formed from printing 有权
标题翻译：由印刷形成的半导体基板上的导电结构
公开(公告)号：US08067305B2
公开(公告)日：2011-11-29
申请号：US12231457
申请日：2008-09-03
申请人： Arthur W. Zafiropoulo , Andrew M. Hawryluk
发明人： Arthur W. Zafiropoulo , Andrew M. Hawryluk
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , B33Y80/00 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/11442 , H01L2224/11462 , H01L2224/11472 , H01L2224/11515 , H01L2224/1155 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Provided are methods for forming an electrically conductive structure of a desired three-dimensional shape on a substantially planar surface of a substrate, e.g., a semiconductor wafer. Typically, the particulate matter is deposited in a layer-by-layer manner and adhered to selected regions on the substrate surface. The particulate matter may be deposited to produce a mold for forming the structure and/or to produce the structure itself. A three-dimensional printer with associated electronic data may be used without the need of a lithographic mask or reticle.
摘要翻译：提供了在基板（例如半导体晶片）的基本平坦的表面上形成所需三维形状的导电结构的方法。通常，颗粒物质以层叠的方式沉积并粘附到基底表面上的选定区域。可以沉积颗粒物质以产生用于形成结构的模具和/或产生结构本身。可以使用具有相关联的电子数据的三维打印机，而不需要光刻掩模或掩模版。

68. 发明授权

US07960993B2 Method for capacitive testing of flat panel displays 有权
标题翻译：平板显示器电容测试方法
公开(公告)号：US07960993B2
公开(公告)日：2011-06-14
申请号：US12547251
申请日：2009-08-25
申请人： David W. Gardner , Andrew M. Hawryluk
发明人： David W. Gardner , Andrew M. Hawryluk
IPC分类号： G01R31/26
CPC分类号： G02F1/1309 , G09G3/006
摘要： Each sensor of a linear array of sensors includes, in part, a sensing electrode and an associated feedback circuit. The sensing electrodes are adapted to be brought in proximity to a flat panel having formed thereon a multitude of pixel electrodes in order to capacitively measure the voltage of the pixel electrodes. Each feedback circuit is adapted to actively drive its associated electrode via a feedback signal so as to maintain the voltage of its associated electrode at a substantially fixed bias. Each feedback circuit may include an amplifier having a first input terminal coupled to the sensing electrode and a second input terminal coupled to receive a biasing voltage. The output signal of the amplification circuit is used to generate the feedback signal that actively drives the sensing electrode. The biasing voltage may be the ground potential.
摘要翻译：传感器的线性阵列的每个传感器部分地包括感测电极和相关联的反馈电路。感测电极适于接近其上形成有多个像素电极的平板，以便电容地测量像素电极的电压。每个反馈电路适于经由反馈信号主动驱动其相关联的电极，以便将其相关电极的电压维持在基本上固定的偏压。每个反馈电路可以包括具有耦合到感测电极的第一输入端和耦合以接收偏置电压的第二输入端的放大器。放大电路的输出信号用于产生主动驱动感测电极的反馈信号。偏置电压可能是地电位。

69. 发明申请

US20100084744A1 Thermal processing of substrates with pre- and post-spike temperature control 审中-公开
标题翻译：具有前和后峰值温度控制的基板的热处理
公开(公告)号：US20100084744A1
公开(公告)日：2010-04-08
申请号：US12287085
申请日：2008-10-06
申请人： Arthur W. Zafiropoulo , Andrew M. Hawryluk , James T. McWhirter , Serguei G. Anikitchev
发明人： Arthur W. Zafiropoulo , Andrew M. Hawryluk , James T. McWhirter , Serguei G. Anikitchev
IPC分类号： H01L29/06 , F27D11/00 , H01L21/00
CPC分类号： B23K26/0608 , B23K26/073 , B23K26/082 , B23K26/083 , H01L21/268
摘要： Provided are apparatuses and method for the thermal processing of a substrate surface, e.g., controlled laser thermal annealing (LTA) of substrates. The invention typically involves irradiating the substrate surface with first and second images to process regions of the substrate surface at a substantially uniform peak processing temperature along a scan path. A first image may serve to effect spike annealing of the substrates while another may be used to provide auxiliary heat treatment to the substrates before and/or after the spike annealing. Control over the temperature profile of the prespike and/or postspike may also reduce stresses and strains generated in the wafers. Also provided are microelectronic devices formed using the inventive apparatuses and methods.
摘要翻译：提供了用于衬底表面的热处理的装置和方法，例如衬底的受控激光热退火（LTA）。本发明通常包括用基板表面照射第一和第二图像，以沿着扫描路径的基本均匀的峰值处理温度处理基板表面的区域。第一图像可以用于实现基板的尖峰退火，而另一个可以用于在尖峰退火之前和/或之后向基板提供辅助热处理。控制预压和/或后刺的温度分布也可以减少在晶片中产生的应力和应变。还提供了使用本发明的装置和方法形成的微电子器件。

70. 发明授权

US5176970A Virtually distortion-free imaging system for large field, high resolution lithography 失效
标题翻译：几何无失真的成像系统，用于大场，高分辨率光刻
公开(公告)号：US5176970A
公开(公告)日：1993-01-05
申请号：US597968
申请日：1990-10-12
申请人： Andrew M. Hawryluk , Natale M. Ceglio
发明人： Andrew M. Hawryluk , Natale M. Ceglio
IPC分类号： G03F7/20
CPC分类号： G03F7/70208 , G03F7/2002 , G03F7/70233 , G03F7/70275 , G03F7/70433
摘要： Virtually distortion free large field high resolution imaging is performed using an imaging system which contains large field distortion or field curvature. A reticle is imaged in one direction through the optical system to form an encoded mask. The encoded mask is then imaged back through the imaging system onto a wafer positioned at the reticle position.
摘要翻译：使用包含大的场失真或场曲率的成像系统执行几乎无失真的大场高分辨率成像。通过光学系统在一个方向上对掩模版进行成像，以形成编码掩模。然后将编码的掩模通过成像系统成像回到位于掩模版位置的晶片上。

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