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    • 68. 发明申请
    • IMPROVED RETENTION MEANS FOR CHIP CARRIER SOCKETS
    • 改进的支持手段
    • WO1989011210A1
    • 1989-11-16
    • PCT/US1989001315
    • 1989-03-31
    • AMP INCORPORATED
    • AMP INCORPORATEDKORSUNSKY, IosifWALKER, Kevin, EugeneBROWN, Robert, Wiliam
    • H05K07/10
    • H05K7/1023
    • Chip carrier sockets (2) have terminals (4) provided therein, the terminals (4) comprising leg portions (34) with first resilient arms (18) and second resilient arms (20) pivotally attached thereto. The first resilient arms (18) have contact surfaces (26) provided on free end sections (22) thereof. The contact surfaces (26) are provided to electrically engage leads (6) of the chip carrier (8). A cover (12) is provided to cooperate with the chip carrier and to act as a protective handler for the chip carrier. Retention means are positioned on the chip carrier socket (2) to cooperate with the cover (12), thereby providing the contact force required to insure that a positive electrical connection is effected between the leads (6) and the terminals (4). The resilient configuration of the retention means insures that the retention means will not fail under normal stresses associated therewith.
    • 芯片载体插座(2)具有设置在其中的端子(4),端子(4)包括具有第一弹性臂(18)的腿部(34)和与其枢轴连接的第二弹性臂(20)。 第一弹性臂(18)具有设置在其自由端部分(22)上的接触表面(26)。 提供接触表面(26)以电接合芯片载体(8)的引线(6)。 提供盖(12)以与芯片载体协作并用作芯片载体的保护处理器。 保持装置定位在芯片承载座(2)上以与盖(12)配合,从而提供所需的接触力,以确保在引线(6)和端子(4)之间进行正电连接。 保持装置的弹性构造确保保持装置在与其相关联的正常应力下不会失效。