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    • 61. 发明公开
    • 반도체 패키지 성형 설비의 리드 프레임 스트립 운반 장치
    • 用于输送半导体封装形成器件的引线框架的装置
    • KR1020000034191A
    • 2000-06-15
    • KR1019980051441
    • 1998-11-28
    • 삼성전자주식회사
    • 박현우박경수조경래조영식
    • H01L23/50
    • PURPOSE: An apparatus for conveying lead frame strips of a semiconductor package forming device are provided to detect any curl on a lead frame strip before conveying lead frame strips after a forming step is performed. CONSTITUTION: An apparatus for conveying lead frame strips of a semiconductor package forming device include a forming mold(20), and a curl(374) separation device. The curl(374) separation device separates a curl between the lead frame strips(370) from the frame strip. The lead frame conveying device includes a support plate(302), a fixer, a plurality of sensor rods(306), a sensor rod body(304), and a device for the elevational motion of the head of the sensor rod. The fixer is implemented on the lower part of the support plate(302) and fixes the lead frame strips conveyed. The sensor rod(306) is implemented as to detect curls between the lead frame strips.
    • 目的:提供一种用于输送半导体封装形成装置的引线框条的装置,用于在执行成形步骤之前,在引线框条之前检测引线框条上的任何卷曲。 构成:用于输送半导体封装形成装置的引线框条的装置包括成形模(20)和卷曲(374)分离装置。 卷曲(374)分离装置将引线框条(370)与框架条之间的卷曲分开。 引线框架输送装置包括支撑板(302),固定器,多个传感器杆(306),传感器杆体(304)和用于传感器杆头部的高度运动的装置。 固定器被实施在支撑板(302)的下部并且固定所传送的引线框架条带。 传感器杆(306)被实现为检测引线框条之间的卷曲。