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61. 发明授权

US07863116B2 IC card and booking-account system using the IC card 有权
标题翻译： IC卡和预订账号系统使用IC卡
公开(公告)号：US07863116B2
公开(公告)日：2011-01-04
申请号：US12652910
申请日：2010-01-06
申请人： Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Mai Akiba
发明人： Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Mai Akiba
IPC分类号： H01L21/00 , H01L21/84
CPC分类号： G06K19/077 , G06K19/07703 , G06Q20/105 , G06Q20/3415 , G07F7/1008 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/00011 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/10271 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/01005 , H01L2224/45147
摘要： It is an object of the present invention to provide a highly sophisticated functional IC card that can ensure security by preventing forgery such as changing a picture of a face, and display other images as well as the picture of a face. An IC card comprising a display device and a plurality of thin film integrated circuits; wherein driving of the display device is controlled by the plurality of thin film integrated circuits; a semiconductor element used for the plurality of thin film integrated circuits and the display device is formed by using a polycrystalline semiconductor film; the plurality of thin film integrated circuits are laminated; the display device and the plurality of thin film integrated circuits are equipped for the same printed wiring board; and the IC card has a thickness of from 0.05 mm to 1 mm.
摘要翻译：本发明的目的是提供一种高度复杂的功能IC卡，其可以通过防止诸如改变脸部照片的伪造，以及显示其他图像以及脸部照片来确保安全性。一种IC卡，包括显示装置和多个薄膜集成电路; 其中所述显示装置的驱动由所述多个薄膜集成电路控制; 通过使用多晶半导体膜形成用于多个薄膜集成电路的半导体元件和显示装置; 层叠多个薄膜集成电路; 显示装置和多个薄膜集成电路被配备用于相同的印刷线路板; IC卡的厚度为0.05mm〜1mm。

62. 发明申请

US20100248402A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, DELAMINATION METHOD, AND TRANSFERRING METHOD 有权
标题翻译：半导体器件及其制造方法，分层方法和传输方法
公开(公告)号：US20100248402A1
公开(公告)日：2010-09-30
申请号：US12766318
申请日：2010-04-23
申请人： Junya MARUYAMA , Toru TAKAYAMA , Yumiko OHNO , Shunpei YAMAZAKI
发明人： Junya MARUYAMA , Toru TAKAYAMA , Yumiko OHNO , Shunpei YAMAZAKI
IPC分类号： H01L21/30 , H01L31/18 , H01L33/00
CPC分类号： H01L27/1218 , H01L21/76251 , H01L27/1214 , H01L27/1248 , H01L27/1266 , H01L29/78603 , H01L33/24 , H01L33/44 , H01L33/56 , H01L33/62 , H01L2221/68368
摘要： A technique for forming a TFT element over a substrate having flexibility typified by a flexible plastic film is tested. When a structure in which a light-resistant layer or a reflective layer is employed to prevent the damage to the delamination layer, it is difficult to fabricate a transmissive liquid crystal display device or a light emitting device which emits light downward.A substrate and a delamination film are separated by a physical means, or a mechanical means in a state where a metal film formed over a substrate, and a delamination layer comprising an oxide film including the metal and a film comprising silicon, which is formed over the metal film, are provided. Specifically, a TFT obtained by forming an oxide layer including the metal over a metal film; crystallizing the oxide layer by heat treatment; and performing delamination in a layer of the oxide layer or at both of the interface of the oxide layer is formed.
摘要翻译：测试了以柔性塑料膜为代表的柔性基板上形成TFT元件的技术。当采用耐光层或反射层来防止对分层的损害的结构时，难以制造向下发光的透射型液晶显示装置或发光装置。在基板上形成金属膜的状态下，通过物理手段或机械装置分离基板和分层膜，以及包含包含金属的氧化物膜和包含硅的膜的分层，其形成在提供金属膜。具体地说，通过在金属膜上形成包含金属的氧化物层而获得的TFT; 通过热处理使氧化层结晶; 并且在氧化物层的一层或氧化物层的界面上形成分层。

63. 发明申请

US20100144070A1 IC CARD AND BOOKING-ACCOUNT SYSTEM USING THE IC CARD 有权
标题翻译：使用IC卡的IC卡和预订帐号系统
公开(公告)号：US20100144070A1
公开(公告)日：2010-06-10
申请号：US12652910
申请日：2010-01-06
申请人： Toru TAKAYAMA , Junya MARUYAMA , Yuugo GOTO , Yumiko OHNO , Mai AKIBA
发明人： Toru TAKAYAMA , Junya MARUYAMA , Yuugo GOTO , Yumiko OHNO , Mai AKIBA
IPC分类号： H01L33/00 , H01L21/60
CPC分类号： G06K19/077 , G06K19/07703 , G06Q20/105 , G06Q20/3415 , G07F7/1008 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/00011 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/10271 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/01005 , H01L2224/45147
摘要： It is an object of the present invention to provide a highly sophisticated functional IC card that can ensure security by preventing forgery such as changing a picture of a face, and display other images as well as the picture of a face. An IC card comprising a display device and a plurality of thin film integrated circuits; wherein driving of the display device is controlled by the plurality of thin film integrated circuits; a semiconductor element used for the plurality of thin film integrated circuits and the display device is formed by using a polycrystalline semiconductor film; the plurality of thin film integrated circuits are laminated; the display device and the plurality of thin film integrated circuits are equipped for the same printed wiring board; and the IC card has a thickness of from 0.05 mm to 1 mm.
摘要翻译：本发明的目的是提供一种高度复杂的功能IC卡，其可以通过防止诸如改变脸部图像的伪造，以及显示其他图像以及脸部照片来确保安全性。一种IC卡，包括显示装置和多个薄膜集成电路; 其中所述显示装置的驱动由所述多个薄膜集成电路控制; 通过使用多晶半导体膜形成用于多个薄膜集成电路的半导体元件和显示装置; 层叠多个薄膜集成电路; 显示装置和多个薄膜集成电路被配备用于相同的印刷线路板; IC卡的厚度为0.05mm〜1mm。

64. 发明授权

US07732262B2 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US07732262B2
公开(公告)日：2010-06-08
申请号：US11477376
申请日：2006-06-30
申请人： Keitaro Imai , Toru Takayama , Yuugo Goto , Junya Maruyama , Yumiko Ohno
发明人： Keitaro Imai , Toru Takayama , Yuugo Goto , Junya Maruyama , Yumiko Ohno
IPC分类号： H01L21/46
CPC分类号： H01L27/1266 , H01L27/1214 , H01L27/1218 , H01L29/42384 , H01L29/4908 , H01L29/66757 , H01L29/78603 , H01L29/78621 , H01L29/78675 , H01L2221/6835 , H01L2221/68368
摘要： To provide a method for manufacturing a semiconductor device including a transfer step that is capable of controlling the adhesiveness of a substrate and an element-formed layer in the case of separating the element-formed layer including a semiconductor element or an integrated circuit formed over the substrate from the substrate and bonding it to another substrate. An adhesive agent made of a good adhesiveness material is formed between the semiconductor element or the integrated circuit comprising plural semiconductor elements formed over the substrate (a first substrate) and the substrate, and thus it is possible to prevent a semiconductor element from peeling off a substrate in manufacturing the semiconductor element, and further, to make it easier to separate the semiconductor element from the substrate by removing the adhesive agent after forming the semiconductor element.
摘要翻译：为了提供一种制造半导体器件的方法，该半导体器件包括转印步骤，该转印步骤能够在分离包含半导体元件或在其上形成的集成电路的元件形成层的情况下控制衬底和元件形成层的粘附性衬底并将其粘合到另一衬底上。在半导体元件或包括形成在基板（第一基板）和基板之上的多个半导体元件的集成电路之间）形成由良好的粘合性材料制成的粘合剂，因此可以防止半导体元件剥离制造半导体元件的基板，并且通过在形成半导体元件之后去除粘合剂，使得更容易将半导体元件与基板分离。

65. 发明申请

US20090321004A1 METHOD OF TRANSFERRING A LAMINATE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE 审中-公开
标题翻译：传输层压体的方法和制造半导体器件的方法
公开(公告)号：US20090321004A1
公开(公告)日：2009-12-31
申请号：US12502428
申请日：2009-07-14
申请人： Toru TAKAYAMA , Yuugo GOTO , Junya MARUYAMA , Yumiko OHNO
发明人： Toru TAKAYAMA , Yuugo GOTO , Junya MARUYAMA , Yumiko OHNO
IPC分类号： B32B38/10
CPC分类号： H01L21/76251 , H01L21/2007 , H01L2221/68368 , Y10T428/14
摘要： An object of the present invention is to provide a method of transferring an object to be peeled onto a transferring member in a short time without imparting damage to the object to be peeled within a laminate. Also, another object of the present invention is to provide a method of manufacturing a semiconductor device in which a semiconductor element manufactured on a substrate is transferred onto a transferring member, typically, a plastic substrate. The methods are characterized by including: forming a peeling layer and an object to be peeled on a substrate; bonding the object to be peeled and a support through a two-sided tape; peeling the object to be peeled from the peeling layer by using a physical method, and then bonding the object to be peeled onto a transferring member; and peeling the support and the two-sided tape from the object to be peeled.
摘要翻译：本发明的目的是提供一种在短时间内将被剥离物转印到转印部件上而不会对层压体内被剥离对象造成损伤的方法。另外，本发明的另一个目的是提供一种半导体器件的制造方法，其中将制造在衬底上的半导体元件转移到通常为塑料衬底的转印构件上。该方法的特征在于包括：在基板上形成剥离层和待剥离物体; 通过双面胶带粘合要剥离的物体和支撑体; 通过使用物理方法剥离剥离层的物体，然后将被剥离物接合到转印体上; 并将支撑体和双面胶带从要剥离的物体上剥离。

66. 发明申请

US20090289548A1 MANUFACTURING METHOD OF LIGHT EMITTING DEVICE AND MANUFACTURING DEVICE THEREOF 有权
标题翻译：发光装置的制造方法及其制造装置
公开(公告)号：US20090289548A1
公开(公告)日：2009-11-26
申请号：US12512418
申请日：2009-07-30
申请人： Junya MARUYAMA , Toru TAKAYAMA , Yumiko OHNO
发明人： Junya MARUYAMA , Toru TAKAYAMA , Yumiko OHNO
IPC分类号： H01J1/62
CPC分类号： H01L51/524 , H01L51/5259 , H01L51/56
摘要： It is an object of the present invention to provide a light emitting device having a structure wherein oxygen and moisture are prevented from reaching to the light emitting device, and to provide a manufacturing method thereof. It is another object of the present invention to seal a light emitting device in fewer steps without encapsulating a desiccant.The present invention provides a structure in which a pixel region 13 is surrounded by a first sealing material (having higher viscosity than a second sealing material) 16 including a spacer (filler, minute particles and/or the like) which maintains a gap between the two substrates, filled with a few drops of the transparent second sealing material 17a which is spread in the region; and sealed by using the first sealing material 16 and the second sealing material 17.
摘要翻译：本发明的目的是提供一种具有防止氧气和水分到达发光器件的结构的发光器件，并提供其制造方法。本发明的另一个目的是在不封装干燥剂的情况下以较少的步骤密封发光器件。本发明提供了一种结构，其中像素区域13被包括间隔物（填料，微小颗粒和/或类似物）的第一密封材料（具有比第二密封材料更高的粘度）16包围，两个衬底，填充有几滴透明的第二密封材料17a，其在该区域中扩散; 并通过使用第一密封材料16和第二密封材料17密封。

67. 发明申请

US20090275196A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090275196A1
公开(公告)日：2009-11-05
申请号：US12480752
申请日：2009-06-09
申请人： Shunpei YAMAZAKI , Toru TAKAYAMA , Junya Maruyama , Yumiko OHNO
发明人： Shunpei YAMAZAKI , Toru TAKAYAMA , Junya Maruyama , Yumiko OHNO
IPC分类号： H01L21/283
CPC分类号： H01L27/1218 , H01L23/291 , H01L27/1214 , H01L27/1266 , H01L27/3244 , H01L29/66757 , H01L29/78603 , H01L51/0002 , H01L51/0021 , H01L51/0024 , H01L51/003 , H01L2221/68368 , H01L2924/0002 , Y10S438/928 , Y10S438/982 , H01L2924/00
摘要： (Object)It is an object of the present invention to provide a peeling method that causes no damage to a layer to be peeled and to allow not only a layer to be peeled with a small surface area but also a layer to be peeled with a large surface area to be peeled entirely. Further, it is also an object of the present invention to bond a layer to be peeled to various base materials to provide a lighter semiconductor device and a manufacturing method thereof. Particularly, it is an object to bond various elements typified by a TFT, (a thin film diode, a photoelectric conversion element comprising a PIN junction of silicon, or a silicon resistance element) to a flexible film to provide a lighter semiconductor device and a manufacturing method thereof. (Solving Means) When a metal layer 11 is provided over a substrate, an oxide layer 12 is provided in contact with the metal layer 11, a layer to be peeled 13 is formed, and the metal layer 11 is irradiated with a laser beam to perform oxidization and form a metal oxide layer 16, a clear separation is possible with a physical means within the metal oxide layer 12 or at an interface between the metal oxide layer 16 and the oxide layer 12.
摘要翻译：（对象）本发明的目的是提供一种不会对被剥离层造成损害的剥离方法，并且不仅允许以小的表面积剥离层，而且还可以使用剥离层大的表面积要完全剥离。此外，本发明的另一个目的是将要剥离的层粘合到各种基材上以提供更轻的半导体器件及其制造方法。特别地，目的是将由TFT表示的各种元素（薄膜二极管，包含硅的PIN结的光电转换元件或硅电阻元件）粘合到柔性膜上以提供更轻的半导体器件和其制造方法。（解决方案）当在基板上设置金属层11时，设置与金属层11接触的氧化物层12，形成被剥离层13，并且用激光束照射金属层11 进行氧化并形成金属氧化物层16，通过金属氧化物层12内的物理手段或金属氧化物层16与氧化物层12之间的界面，可以进行清晰的分离。

68. 发明授权

US07564139B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07564139B2
公开(公告)日：2009-07-21
申请号：US11947835
申请日：2007-11-30
申请人： Hideaki Kuwabara , Junya Maruyama , Yumiko Ohno , Toru Takayama , Yuugo Goto , Etsuko Arakawa , Shunpei Yamazaki
发明人： Hideaki Kuwabara , Junya Maruyama , Yumiko Ohno , Toru Takayama , Yuugo Goto , Etsuko Arakawa , Shunpei Yamazaki
IPC分类号： H01L29/40
CPC分类号： H01L21/6835 , H01L21/563 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/83 , H01L29/0657 , H01L29/66757 , H01L29/78675 , H01L2221/68359 , H01L2221/68368 , H01L2224/0401 , H01L2224/04026 , H01L2224/13111 , H01L2224/13144 , H01L2224/16225 , H01L2224/274 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/0781 , H01L2924/12042 , H01L2924/14 , H01L2924/1517 , H01L2924/15311 , H01L2924/1579 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2924/01014 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： It is an object of the present invention to provide a technique for making a semiconductor device thinner without using a back-grinding method for a silicon wafer. According to the present invention, an integrated circuit film is mounted, thereby making a semiconductor device mounting the integrated circuit film thinner. The term “an integrated circuit film” means a film-like integrated circuit which is manufactured based on an integrated circuit manufactured by a semiconductor film formed over a substrate such as a glass substrate or a quartz substrate. In the present invention, the integrated circuit film is manufactured by a technique for transferring.
摘要翻译：本发明的目的是提供一种使半导体器件更薄而不使用用于硅晶片的后磨法的技术。根据本发明，安装集成电路膜，从而使得安装集成电路膜的半导体器件更薄。术语“集成电路膜”是指基于由诸如玻璃基板或石英基板的基板上形成的半导体膜制成的集成电路制造的膜状集成电路。在本发明中，通过转印技术制造集成电路膜。

69. 发明申请

US20090152539A1 Semiconductor Apparatus and Fabrication Method of the Same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20090152539A1
公开(公告)日：2009-06-18
申请号：US12370767
申请日：2009-02-13
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yumiko Ohno
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yumiko Ohno
IPC分类号： H01L29/04 , H01L31/036 , H01L31/20
CPC分类号： H01L23/12 , H01L27/12 , H01L27/1214 , H01L27/1218 , H01L27/1266 , H01L27/3244 , H01L27/3281 , H01L29/78603 , H01L51/003 , H01L51/0097 , H01L51/524 , H01L51/529 , H01L51/56 , H01L2221/68368 , H01L2227/326 , H01L2251/5338 , H01L2924/0002 , Y02E10/549 , Y02P70/521 , H01L2924/00
摘要： It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal display apparatus using a plastic substrate. According to the present invention, devices formed on a glass substrate or a quartz substrate (a TFT, a light-emitting device having an organic compound, a liquid crystal device, a memory device, a thin-film diode, a pin-junction silicon photoelectric converter, a silicon resistance element, or the like) are separated from the substrate, and transferred to a plastic substrate having high thermal conductivity.
摘要翻译：本发明的目的是提供一种能够防止由于水分或氧气的渗透引起的劣化的半导体器件，例如具有形成在塑料基板上的有机发光器件的发光装置，以及使用塑料基板的液晶显示装置。根据本发明，形成在玻璃基板或石英基板（TFT，具有有机化合物的发光器件，液晶器件，存储器件，薄膜二极管，pin-junction硅光电转换器，硅电阻元件等）与衬底分离，并转移到具有高导热性的塑料衬底。

70. 发明申请

US20090127556A1 SEMICONDUCTOR DEVICE HAVING LIGHT EMITTING ELEMENT, INTEGRATED CIRCUIT AND ADHESIVE LAYER (AS AMENDED) 有权
标题翻译：具有发光元件，集成电路和粘合层（已修复）的半导体器件
公开(公告)号：US20090127556A1
公开(公告)日：2009-05-21
申请号：US12266589
申请日：2008-11-07
申请人： Toru Takayama , Junya Maruyama , Yumiko Ohno
发明人： Toru Takayama , Junya Maruyama , Yumiko Ohno
IPC分类号： H01L31/00
CPC分类号： H01L51/5246 , H01L27/1214 , H01L27/1218 , H01L27/1266 , H01L27/3244 , H01L27/3276 , H01L29/78672 , H01L51/0097 , H01L51/5237 , H01L51/5243 , H01L51/5253 , H01L51/56 , H01L2221/68368 , H01L2227/326 , H01L2251/5323
摘要： To realize a high-performance liquid crystal display device or light-emitting element using a plastic film. A CPU is formed over a first glass substrate and then, separated from the first substrate. A pixel portion having a light-emitting element is formed over a second glass substrate, and then, separated from the second substrate. The both are bonded to each other. Therefore, high integration can be achieved. Further, in this case, the separated layer including the CPU serves also as a sealing layer of the light-emitting element.
摘要翻译：实现使用塑料膜的高性能液晶显示装置或发光元件。 CPU形成在第一玻璃基板上，然后与第一基板分离。具有发光元件的像素部分形成在第二玻璃基板上，然后与第二基板分离。两者相互结合。因此，可以实现高集成度。此外，在这种情况下，包括CPU的分离层也用作发光元件的密封层。

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