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61. 发明申请

US20050270416A1 Device and method for producing coefficient seed data used for format conversion, and information-providing medium therefore 有权
标题翻译：因此，用于产生用于格式转换的系数种子数据的装置和方法，以及信息提供媒体
公开(公告)号：US20050270416A1
公开(公告)日：2005-12-08
申请号：US11197187
申请日：2005-08-04
申请人： Tetsujiro Kondo , Yasushi Tatehira , Takuo Morimura , Nobuyuki Asakura , Wataru Niitsuma , Kei Hiraizumi , Takahide Ayata
发明人： Tetsujiro Kondo , Yasushi Tatehira , Takuo Morimura , Nobuyuki Asakura , Wataru Niitsuma , Kei Hiraizumi , Takahide Ayata
IPC分类号： G06T3/40 , G09G5/00 , G09G5/391 , H04N7/01 , H04N11/20
CPC分类号： H04N7/0137 , G06T3/40 , G09G2340/0407 , H04N7/0125 , H04N7/0145
摘要： The present invention relates to an information signal processor and the like preferable for use in the case of converting a format of an image signal or converting an image size. An input image signal Vin (525i signal) is converted into an output image signal Vout (such as 1080i signal, XGA signal, or 525i signal for obtaining an image to be displayed in a different magnification). A class code CL is obtained from tap data selectively extracted from the Vin and corresponding to each pixel (pixel at a target position) within a unit pixel block, which constitutes Vout. A coefficient production circuit 136 produces coefficient data for each class, which is used at the time of calculating the pixel data at the target position, based on the coefficient seed data for each class and phase information h, v about the target position generated in a phase information generation circuit 139. A calculation circuit 127 provides pixel data y1 to yp of the target position according to the estimated equation using the tap data xi corresponding to the target position and the coefficient data Wi corresponding to the class code CL.
摘要翻译：本发明涉及一种信息信号处理器等，其优选用于转换图像信号的格式或转换图像大小的情况。输入图像信号Vin（525i信号）被转换成输出图像信号Vout（诸如1080i信号，XGA信号或525i信号，用于获得以不同放大率显示的图像）。根据构成Vout的单位像素块内的每个像素（目标位置的像素），从有选择地从Vin中提取的抽头数据获得类码CL。系数产生电路136基于每个类别的系数种子数据和相关信息h，v在每个类别产生的目标位置产生用于计算目标位置处的像素数据时使用的每个类别的系数数据相位信息生成电路139。计算电路127使用与目标位置对应的抽头数据xi和与类代码CL对应的系数数据Wi，根据估计的方程，提供目标位置的像素数据y 1至yp。

62. 发明申请

US20050050725A1 Method of connecting terminal to wire 有权
标题翻译：将端子连接到电线的方法
公开(公告)号：US20050050725A1
公开(公告)日：2005-03-10
申请号：US10952873
申请日：2004-09-30
申请人： Yasumichi Kuwayama , Masanori Onuma , Nobuyuki Asakura
发明人： Yasumichi Kuwayama , Masanori Onuma , Nobuyuki Asakura
IPC分类号： H01R43/048 , H01R4/18 , H01R4/24 , H01R43/042 , H01R43/058 , H01R43/04
CPC分类号： H01R4/2404 , H01R4/184 , H01R4/2495 , H01R43/0424 , H01R43/0585 , Y10T29/49174 , Y10T29/49181 , Y10T29/49185 , Y10T29/49188 , Y10T29/49192 , Y10T29/532 , Y10T29/53209 , Y10T29/53213 , Y10T29/53226 , Y10T29/53235
摘要： Inwardly-directed projecting portions (2, 3) are formed in a bent manner respectively at distal ends of a pair of clamping piece portions (4, 5) which are continuous with each other, and form a wire connection portion (7) of a terminal (1). A conductor portion (9) of a wire (8) is located on the inner sides of the pair of clamping piece portions (4, 5), and the pair of clamping piece portions are pressed over an entire periphery into a circular shape, and are extended in a peripheral direction, thereby causing projecting extension portions (2′, 3′), including the projecting portions (2, 3), to bite into the conductor portion. Before the pressing operation, the pair of clamping piece portions (4, 5) may be provisionally pressed to be curved, thereby causing distal ends of the projecting portions (2, 3) to bite slightly into an outer peripheral surface of the conductor portion (9).
摘要翻译：分别在彼此连续的一对夹紧片部分（4,5）的末端处以弯曲的方式形成向内定向的突出部分（2,3），并形成彼此相连的线连接部分（7）终端（1）。线（8）的导体部分（9）位于一对夹紧片部分（4,5）的内侧，并且一对夹紧片部分被整个周边压制成圆形，并且沿圆周方向延伸，从而使包括突出部分（2,3）在内的突起延伸部分（2'，3'）咬入导体部分。在按压操作之前，可以暂时压入一对夹紧片部分（4,5）以弯曲，从而使突出部分（2,3）的末端略微咬入到导体部分的外周表面（ 9）。

63. 发明授权

US06739899B2 Method and structure for connecting a terminal with a wire 失效
标题翻译：将端子与电线连接的方法和结构
公开(公告)号：US06739899B2
公开(公告)日：2004-05-25
申请号：US10183048
申请日：2002-06-27
申请人： Yasumichi Kuwayama , Toshihiro Maki , Masanori Onuma , Nobuyuki Asakura
发明人： Yasumichi Kuwayama , Toshihiro Maki , Masanori Onuma , Nobuyuki Asakura
IPC分类号： H01R424
CPC分类号： H01R43/0585 , H01R4/188 , H01R11/28 , Y10T29/49174 , Y10T29/49183 , Y10T29/49185 , Y10T29/49199
摘要： In a method of connecting a terminal with a wire in which a core (2) of a wire is inserted into a tubular wire connecting portion (1) of a terminal, and the wire connecting portion is crimped in a radial direction of the wire, the wire connecting portion is compressed in a radial direction of the wire and uniformly over the whole circumference. While rotating dies (7′) by using a rotary swaging machine, the wire connecting portion is compressed by the dies in a radial direction of the wire and uniformly over the whole circumference. The wire connecting portion is compressed in a radial direction of the wire and uniformly over the whole circumference, and the outer periphery of a compressed part of the wire connecting portion has a true circular section shape.
摘要翻译：在将端子与电线的芯线（2）连接在端子的管状电线连接部（1）中并且电线连接部沿导线的径向方向压接的方法中，电线连接部在电线的径向方向上被压缩，并且在整个圆周上均匀地压缩。通过使用旋转模锻机旋转模具（7'），线材连接部分被模具沿导线的径向方向压缩，并且在整个圆周上均匀地压缩。电线连接部在电线的径向上被压缩并且在整个圆周上均匀地压缩，并且电线连接部的压缩部的外周具有真正的圆形截面形状。

64. 发明授权

US06657126B2 Wire branch processing for shielded wire 有权
公开(公告)号：US06657126B2
公开(公告)日：2003-12-02
申请号：US10128580
申请日：2002-04-24
申请人： Tetsuro Ide , Akira Mita , Nobuyuki Asakura
发明人： Tetsuro Ide , Akira Mita , Nobuyuki Asakura
IPC分类号： H01R400
CPC分类号： H01R9/0512 , H01R9/0509 , H01R43/0228
摘要： In at least one shielded core wire, a first conductive core wire is covered with a first insulating sheath. A conductive foil covers the at least one shielded core wire. A second insulating sheath covers the conductive foil. In a branch wire, a second conductive core wire is covered with a third insulating sheath. A part of the second insulating sheath and a part of the third insulating sheath are thermally fused so that the conductive foil and the second conductive core wire are electrically connected.

65. 发明授权

US06477771B2 Terminal crimping method and terminal crimping apparatus 有权
标题翻译：端子压接方法和端子压接装置
公开(公告)号：US06477771B2
公开(公告)日：2002-11-12
申请号：US09915562
申请日：2001-07-27
申请人： Nobuyuki Asakura , Yasumichi Kuwayama , Masanori Onuma
发明人： Nobuyuki Asakura , Yasumichi Kuwayama , Masanori Onuma
IPC分类号： H01B4304
CPC分类号： H01R43/058 , H05K1/118 , H05K3/326 , Y10T29/49174 , Y10T29/49204 , Y10T29/49218 , Y10T29/4922 , Y10T29/53209 , Y10T29/53226 , Y10T29/53235
摘要： A terminal crimping apparatus (21) comprises a lower crimper (23) for supporting the lower side of a flat part (6) of an electrically connecting terminal (42); an upper crimper (25) arranged above and opposite to the lower crimper (23) and having molding faces (25a, 25b) for bending to deform the point portions of piercing parts (7, 8) opposite each other by relatively moving toward the lower crimper (23); terminal guides arranged as being movable along and relative to the outer sides of the piercing parts (7, 8) of the electrically connecting terminal (42) disposed on the lower crimper (23) so as to control the piercing parts (7, 8) from falling; and circuit body holders (32, 33) arranged above and opposite to the terminal guides (27, 28) for elastically holding the flat circuit body (1) in cooperation with the terminal guides (27, 28) while the upper crimper (25) moves toward the lower crimper (23).
摘要翻译：端子压接装置（21）包括用于支撑电连接端子（42）的平坦部分（6）的下侧的下压接器（23）。上下卷边器（25），布置在下卷边器（23）的上方并与之相对，并具有成型面（25a，25b），用于弯曲以使穿孔部分（7,8）的点相对地相对移动，卷曲机（23）; 端子引导件，其布置成可以沿着并相对于设置在下部卷边器（23）上的电连接端子（42）的穿孔部分（7,8）的外侧移动，以便控制穿孔部分（7,8）从跌倒以及布置在所述端子引导件（27,28）上方并与所述端子引导件（27,28）相对的电路体保持器（32,33），用于与所述端子引导件（27,28）协作地弹性地保持所述扁平电路体（1），同时所述上部卷曲器向下卷边器（23）移动。

66. 发明授权

US6004170A Connection structure of a covered wire with resin encapsulation 失效
标题翻译：带树脂封装的包线的连接结构
公开(公告)号：US6004170A
公开(公告)日：1999-12-21
申请号：US956941
申请日：1997-10-23
申请人： Tetsuo Kato , Nobuyuki Asakura , Akira Shinchi , Tetsuro Ide
发明人： Tetsuo Kato , Nobuyuki Asakura , Akira Shinchi , Tetsuro Ide
IPC分类号： H01R4/02 , H01R4/70 , H01R13/52 , H01R43/02
CPC分类号： H01R4/021 , H01R13/5216 , H01R4/023 , H01R4/70 , H01R43/0207 , Y10T29/49201
摘要： A covered wire connection structure is formed by the steps of: pinching a covered wire with a pair of resin chips; pressing and exciting a cover portion of the wire by ultrasonic vibration so as to conductively connect conductive portions of both the covered wires at the connection portion; and melting a pair of the resin chips so as to seal the connection portion. The resin chip comprises main melting portions for pinching the connection portion which are melted to a mating resin chip so as to seal the connection portion, and auxiliary melting portions which are formed of material compatible with the cover portion of the covered wire introduced from the main melting portions and pinch the cover portion such that they are melted to the mating resin chip. The auxiliary melting portions and cover portion of the covered wire are melted together and integrated so as to seal an introductive portion of the covered wire from the resin chips. As a result, a reliability in connecting the covered wires by ultrasonic vibration is maintained and waterproofness in the connection portion is improved.
摘要翻译：包覆线连接结构通过以下步骤形成：用一对树脂芯片夹住包线; 通过超声波振动来挤压和激发线的覆盖部分，以便在连接部分处导电地连接两根被覆线的导电部分; 并熔化一对树脂芯片以密封连接部分。树脂芯片包括用于夹持连接部分的主熔化部分，其熔化到配合树脂芯片上以便密封连接部分，以及辅助熔化部分，其由与从主体引入的包线的盖部分相容的材料形成熔化部分并夹住盖部分使得它们熔化到配合树脂芯片。包线的辅助熔化部分和覆盖部分熔化在一起并整合在一起，以将包线的引入部分与树脂片密封起来。结果，保持了通过超声波振动连接被覆线的可靠性，并且提高了连接部分的防水性。

67. 发明授权

US5928033A Waterproof structure for conductor leading part 失效
标题翻译：导体导线部分防水结构
公开(公告)号：US5928033A
公开(公告)日：1999-07-27
申请号：US990325
申请日：1997-12-17
申请人： Tetsuo Kato , Akira Shinchi , Nobuyuki Asakura
发明人： Tetsuo Kato , Akira Shinchi , Nobuyuki Asakura
IPC分类号： H01R13/504 , H01R13/52 , H01R13/40
CPC分类号： H01R13/5205 , H01R13/5216 , H01R13/504 , Y10T29/49211
摘要： A waterproof structure for a wire leading part of a housing is provided. The structure includes two cover bodies and two waterproof members carried by the cover bodies. The waterproof members are made of elastic materials which are soluble in each other and fusible in insulating covers of wires by ultrasonic oscillation under pressure. At the mutual welding of the cover bodies by the ultrasonic oscillation, the waterproof members are fused in each other, the waterproof members are fused in the insulating covers and the cover bodies are welded to the housing.
摘要翻译：提供一种用于壳体的导线部分的防水结构。该结构包括两个盖体和由盖体承载的两个防水构件。防水构件由弹性材料制成，它们彼此可溶，并在压力下通过超声波振荡熔接在电线的绝缘盖中。在通过超声波振荡对盖体进行相互焊接时，防水构件彼此熔合，防水构件熔合在绝缘盖中，并且盖体焊接到壳体。

68. 发明授权

US5922993A Covered wire connection structure 失效
标题翻译：包线连接结构
公开(公告)号：US5922993A
公开(公告)日：1999-07-13
申请号：US867845
申请日：1997-06-03
申请人： Tetsuro Ide , Nobuyuki Asakura
发明人： Tetsuro Ide , Nobuyuki Asakura
IPC分类号： H01R4/24 , H01R4/26 , H01R43/02 , H01R4/00
CPC分类号： H01R43/0228 , H01R43/0207
摘要： Two covered wires conductively connected with each other are overlapped with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips. Cover portions are melted and pressurized from the outside of resin chips capable of obtaining a sealing condition and providing an excellent melting operation efficiency so as to connect conductive wire portions conductively at the connection portions. Then, the pair of the resin chips are melted together to seal the connection portions. In introducing end portions in which a covered wire is introduced out of the resin chips, between a melting surface relative to a mating resin chip and an outer peripheral surface, a round corner having a curvature continuously changing smoothly is provided. Thus, it is possible to obtain a sealing condition securely and an excellent melting operation efficiency.
摘要翻译：导电连接的两根被覆线彼此在连接部分处重叠。重叠的连接部分被一对树脂芯片夹住。覆盖部分从能够获得密封条件的树脂片的外部熔化和加压，并且提供优异的熔化操作效率，以便在连接部分处导电地连接导线部分。然后，一对树脂片熔融在一起以密封连接部。在引入包覆线从树脂片引出的端部中，在相对于匹配树脂芯片的熔化面与外周面之间，设置曲率连续变化的圆角。因此，可以可靠地获得密封条件和优异的熔融操作效率。

69. 发明授权

US5338233A Structure for electrically connecting a terminal and a wire 失效
标题翻译：用于电连接端子和电线的结构
公开(公告)号：US5338233A
公开(公告)日：1994-08-16
申请号：US42792
申请日：1993-04-06
申请人： Mitsuo Endo , Nobuyuki Asakura
发明人： Mitsuo Endo , Nobuyuki Asakura
IPC分类号： H01R4/18 , H01R4/26 , H01R4/24
CPC分类号： H01R4/185 , H01R4/26
摘要： A wire has a conductor member and an insulation member covering the conductor member. A terminal has a wire connecting portion. The wire connecting portion has a conductor crimp portion for crimping said conductor member and an insulator crimp portion for crimping the insulation member together with the conductor member. The conductor crimp portion comprises a main body and a pair of crimp pieces extending from the main body. The crimp pieces have engaging portions which are electrically connected to the conductor member and engaged with each other when the crimp pieces are crimped.
摘要翻译：导线具有导体部件和覆盖导体部件的绝缘部件。端子具有电线连接部。电线连接部分具有用于压接所述导体部件的导体压接部分和用于与导体部件一起压接绝缘部件的绝缘体压接部分。导体压接部分包括主体和从主体延伸的一对压接片。压接片具有与导体构件电连接的接合部，并且在压接卷曲时彼此接合。

70. 发明申请

US20120214360A1 Wire-Equipped Crimp Terminal and Method of Curing Coating Agent 有权
标题翻译：带电线的压接端子和固化涂层剂的方法
公开(公告)号：US20120214360A1
公开(公告)日：2012-08-23
申请号：US13500791
申请日：2010-12-09
申请人： Hideto Kumakura , Yuichi Ito , Nobuyuki Asakura
发明人： Hideto Kumakura , Yuichi Ito , Nobuyuki Asakura
IPC分类号： H01R4/10 , B05D3/06
CPC分类号： H01R4/185 , H01R4/04 , H01R13/5216 , Y10T29/49181
摘要： A wire-equipped crimp terminal includes a wire, a crimp terminal and a coating agent. The wire has a conductor exposed from an insulative sheath. The crimp terminal has a crimping piece which is press-deformed to embrace the conductor. The coating agent is coated to a first part of the crimp terminal. A recess is formed at a non-coating part of the crimp terminal where the coating agent is not coated. The coating agent is cured by irradiating light or an electron beam to the first part in a state where a part of the coating agent flowing out from the first part is received in the recess.
摘要翻译：带电线的压接端子包括线，压接端子和涂覆剂。导线具有从绝缘护套暴露的导体。压接端子具有压接件，以压接导体。涂布剂涂覆到压接端子的第一部分。在未涂覆涂布剂的压接端子的非涂布部分处形成凹部。在从第一部分流出的涂布剂的一部分被容纳在凹部中的状态下，通过将光或电子束照射到第一部分来固化涂布剂。

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