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61. 发明公开

EP2442631A2 Emi shielding gasket 审中-公开
标题翻译： Abschirmungsdichtung gegen elektromagnetischeStörungen
公开(公告)号：EP2442631A2
公开(公告)日：2012-04-18
申请号：EP11184598.8
申请日：2011-10-11
申请人： Innochips Technology Co., Ltd.
发明人： Park, In-Kil , Kim, Dae Kyum
IPC分类号： H05K9/00
CPC分类号： H05K9/0015
摘要： Provided is an electromagnetic interference shielding gasket including an elastomer, and an electrode partially inserted and fixed in the elastomer, and bent along a side surface and a bottom surface of the elastomer. The electrode may be fixed through an adhesive tape to the bottom surface of the elastomer. Coupling force between the elastomer and the electrode is improved, and thus, a removal of the elastomer from the electrode after a mounting process is prevented.
摘要翻译：本发明提供一种包括弹性体的电磁干扰屏蔽垫片和部分地插入和固定在弹性体中并沿着弹性体的侧表面和底表面弯曲的电极。电极可以通过粘合带固定到弹性体的底表面。弹性体和电极之间的耦合力得到改善，因此防止了在安装过程之后从电极去除弹性体。

62. 发明公开

EP2442628A2 Emi shielding gasket 审中-公开
标题翻译： Emi屏蔽垫片
公开(公告)号：EP2442628A2
公开(公告)日：2012-04-18
申请号：EP11184583.0
申请日：2011-10-11
申请人： Innochips Technology Co., Ltd.
发明人： Park, In-Kil , Kim, Dae Kyum
IPC分类号： H05K1/02
CPC分类号： H05K3/3431 , H05K9/0015 , H05K2201/10371 , Y02P70/613
摘要： Provided is an electromagnetic interference shielding gasket, which includes an elastomer, a soldering prevention part disposed in at least one region of a side surface and a bottom surface of the elastomer, and an electrode disposed on the bottom surface of the elastomer. Even when solder cream for attaching the EMI shielding gasket to a printed circuit board is pushed from the bottom surface of the EMI shielding gasket by its surface tension and solder-rising, the solder cream stays in the soldering prevention part without moving upward along the side surface of the EMI shielding gasket. Accordingly, the reliability of soldering can be ensured without sacrificing elastic resilient force of the EMI shielding gasket.
摘要翻译：提供了一种电磁干扰屏蔽垫片，其包括弹性体，设置在弹性体的侧表面和底表面的至少一个区域中的防焊部分以及设置在弹性体的底表面上的电极。即使当用于将EMI屏蔽垫片附接到印刷电路板的焊膏由于其表面张力和焊料升高而从EMI屏蔽垫片的底表面推动时，焊膏仍留在防焊部分中而不沿着侧面向上移动 EMI屏蔽垫片的表面。因此，可以确保焊接的可靠性而不牺牲EMI屏蔽垫片的弹性回弹力。

63. 发明授权

EP3070722B1 LAMINATED CHIP DEVICE 有权
公开(公告)号：EP3070722B1
公开(公告)日：2018-06-20
申请号：EP16160526.6
申请日：2016-03-15
申请人： Innochips Technology Co., Ltd.
发明人： Park, In Kil , Noh, Tae Hyung , Kim, Gyeong Tae , Lee, Myung Ho , Seo, Tae Geun , Lee, Min Soo , Lee, Song Yeon
IPC分类号： H01F17/00 , H01F27/28 , H01G4/232 , H01G4/30 , H03H1/00 , H03H7/01 , H01G4/00 , H01G4/40 , H01G4/005
CPC分类号： H03H1/00 , H01F17/0013 , H01F27/2804 , H01F2017/002 , H01F2017/0026 , H01F2027/2809 , H01G4/005 , H01G4/232 , H01G4/30 , H01G4/40 , H03H7/0115 , H03H2001/0085
摘要： Provided is a laminated chip device including a first laminate in which a plurality of conductor patterns formed on a plurality of sheets are connected to each other through a via formed to penetrate at least a sheet, and a second laminate provided over or below the first laminate and having a plurality of internal electrode patterns formed on a plurality of sheets, and the internal electrode patterns have a non-conductive region in at least a portion of an area corresponding to the via.

64. 发明公开

EP2903158A3 Stacked chip device 有权
标题翻译：堆叠芯片设备
公开(公告)号：EP2903158A3
公开(公告)日：2015-11-18
申请号：EP15152490.7
申请日：2015-01-26
申请人： Innochips Technology Co., Ltd.
发明人： Park, In Kil , Noh, Tae Hyung , Kim, Gyeong Tae , Seo, Tae Geun , Lee, Myung Ho , Lee, Min Soo
IPC分类号： H03H7/01 , H03H1/00
CPC分类号： H03H7/0115 , H03H2001/0085
摘要： The present disclosure relates to a stacked chip device (11) including a first stack unit (B) comprising a plurality of electrode patterns (111, 112) respectively disposed for a unit device region and common electrode patterns (121) formed to be connected to overlap the unit device regions, a second stack unit (A) disposed on a top portion of the first stack unit (B) and comprising a plurality of first conductor patterns (211-216), and a third stack unit (C) disposed on a bottom portion of the first stack unit (B) and comprising a plurality of second conductor patterns (311-316), wherein the first and second conductor patterns (211-216; 311-316) are formed on a plurality of sheets (201-206; 301-306), the first and second conductor patterns formed on one sheet are formed across a plurality of unit device regions, and the first and second conductor patterns (211-216; 311-316) are connected vertically through vias (511, 512, 521, 522) formed penetrating through at least some of the sheets.
摘要翻译：本发明涉及一种堆叠芯片器件（11），其包括：第一堆叠单元（B），其包括分别设置用于单元器件区域的多个电极图案（111,112）;以及公共电极图案（121），其形成为连接到（B）的顶部上并且包括多个第一导体图案（211-216）的第二堆叠单元（A）以及设置在第一堆叠单元（B）上的第三堆叠单元（C）（B）的底部并且包括多个第二导体图案（311-316），其中第一和第二导体图案（211-216; 311-316）形成在多个片材（201 -206,301-306），形成在一个薄片上的第一和第二导体图案横跨多个单元器件区域形成，并且第一和第二导体图案（211-216; 311-316）通过通孔垂直连接（穿过至少一些片材形成。

65. 发明公开

EP2930500A1 LAYERED SENSOR ARRAY DEVICE 审中-公开
标题翻译： SCHICHTSENSORARRAYVORRICHTUNG
公开(公告)号：EP2930500A1
公开(公告)日：2015-10-14
申请号：EP15162644.7
申请日：2015-04-07
申请人： Innochips Technology Co., Ltd.
发明人： Park, In Kil , Noh, Tae Hyung , Park, Sung Cheol , Kwon, Ki Beom , Lee, Seung Hwan , Jung, Jun Ho
IPC分类号： G01N27/12 , G01N33/00
CPC分类号： G01N33/0031 , G01N27/123
摘要： Disclosed is a sensor device including a plurality of substrates (110, 120, 130, 140) vertically stacked, a plurality of heaters (210, 220, 230, 240) formed on at least one selected substrate and separated from each other in a horizontal direction, a plurality of sensing electrodes (310, 320, 330, 340) formed at least one selected substrate on a top portion of the substrate on which the plurality of heaters are formed and separated in the horizontal direction, and a plurality of materials (410, 420, 430, 440) configured to respectively contact the plurality of sensing electrodes and formed separately from each other.
摘要翻译：公开了一种传感器装置，其包括垂直堆叠的多个基板（110,120,130,140），形成在至少一个选定基板上的多个加热器（210,220,230,240），并在水平方向上彼此分离多个感测电极（310,320,330,340），其形成在其上形成有多个加热器的水平方向上分离的基板的顶部上的至少一个选择的基板，以及多个材料（，其被配置为分别接触所述多个感测电极并且彼此分开形成。

66. 发明公开

EP2869596A1 Complex device and electronic device having the same 有权
标题翻译： Komplexe Vorrichtung und elektronische Vorrichtung damit
公开(公告)号：EP2869596A1
公开(公告)日：2015-05-06
申请号：EP14191357.4
申请日：2014-10-31
申请人： Innochips Technology Co., Ltd.
发明人： Park, In Kil , Noh, Tae Hyung , Park, Sung Cheol , Kim, Young Sul , Choi, Soon Dong , Jung, In Seob , Park, Wan , Shin, Hee Seob
IPC分类号： H04R17/00 , H04B1/38 , H04M1/02 , H02J7/00
CPC分类号： H04W4/80 , B06B1/06 , H02J7/00 , H02J7/025 , H02J50/10 , H02J50/70 , H04M1/026 , H04M1/185 , H04M1/72575 , H04M2250/04 , H04R2217/00
摘要： Provided are a complex device including a piezoelectric device, a wire patch cell (WPC) antenna disposed on one surface of the piezoelectric device, the WPC antenna being connected to two antenna patterns that are vertically spaced apart from each other, and a near field communication (NFC) antenna disposed outside the WPC antenna and an electronic device having the same.
摘要翻译：提供了一种复合器件，包括压电器件，设置在压电器件的一个表面上的有线贴片电池（WPC）天线，WPC天线连接到彼此垂直间隔开的两个天线图案，以及近场通信（NFC）天线以及具有该天线的电子设备。

67. 发明公开

EP2442628A3 Emi shielding gasket 审中-公开
标题翻译：防电磁干扰屏蔽垫片
公开(公告)号：EP2442628A3
公开(公告)日：2014-05-07
申请号：EP11184583.0
申请日：2011-10-11
申请人： Innochips Technology Co., Ltd.
发明人： Park, In-Kil , Kim, Dae Kyum
IPC分类号： H05K1/02 , H05K3/34 , H05K9/00
CPC分类号： H05K3/3431 , H05K9/0015 , H05K2201/10371 , Y02P70/613
摘要： Provided is an electromagnetic interference shielding gasket, which includes an elastomer, a soldering prevention part disposed in at least one region of a side surface and a bottom surface of the elastomer, and an electrode disposed on the bottom surface of the elastomer. Even when solder cream for attaching the EMI shielding gasket to a printed circuit board is pushed from the bottom surface of the EMI shielding gasket by its surface tension and solder-rising, the solder cream stays in the soldering prevention part without moving upward along the side surface of the EMI shielding gasket. Accordingly, the reliability of soldering can be ensured without sacrificing elastic resilient force of the EMI shielding gasket.

68. 发明公开

EP2450777A3 Multi-direction input device 审中-公开
标题翻译：输入装置具有多个方向的
公开(公告)号：EP2450777A3
公开(公告)日：2012-06-06
申请号：EP11187541.5
申请日：2011-11-02
申请人： Innochips Technology Co., Ltd.
发明人： Park, In-Kil , Kim, Dae Kyum , Kim, Young Sul
IPC分类号： G06F3/033 , H01H25/00
CPC分类号： H01H25/002 , G06F3/03548
摘要： Provided is multi-direction input device. The multi-direction input device includes a magnet part, a manipulation member configured to receive the magnet part, the manipulation member being moved in multi-directions by user's manipulation, and a spring configured to surround at least one side of the manipulation member, the spring allowing the manipulation member to return to an original position by elasticity. At least one portion of the manipulation member is formed of a magnetic field blocking material.

69. 发明授权

EP2963679B1 HEAT RADIATION SHEET 有权
公开(公告)号：EP2963679B1
公开(公告)日：2018-09-12
申请号：EP15175256.5
申请日：2015-07-03
申请人： Innochips Technology Co., Ltd.
发明人： Noh, Tae Hyung , Park, In Kil , Kim, Dae Kyum
IPC分类号： H01L23/373 , B32B15/00 , C09J7/00 , G06F1/20 , B32B7/12 , B32B15/04 , C09J7/35 , C09J7/26 , F28F13/18 , H01L23/42
CPC分类号： H05K7/2039 , B32B7/12 , B32B15/046 , B32B2307/302 , C09J7/26 , C09J7/35 , F28F13/18 , G06F1/20 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： Provided is a heat-radiating sheet including a heat-radiating layer having a porous structure with multiple pores, a filler including multiple thermally conductive particles and filling the pores inside the heat-radiating layer, and an adhesive layer disposed on at least one surface of the heat-radiating layer.

70. 发明授权

EP2930501B1 SENSOR 有权
公开(公告)号：EP2930501B1
公开(公告)日：2018-03-21
申请号：EP15162645.4
申请日：2015-04-07
申请人： Innochips Technology Co., Ltd.
发明人： Park, In Kil , Noh, Tae Hyung , Park, Sung Cheol , Kwon, Ki Beom , Lee, Seung Hwan , Jung, Jun Ho
IPC分类号： G01N27/12
CPC分类号： G01N27/12
摘要： Provided is a sensor including an insulating layer (100), at least two heater patterns (210, 220, 230) separated in one direction in the insulating layer and electrically connected to each other, at least two sensing electrode patterns (310, 320, 330) insulated form the heater patterns, separated in the one direction in the insulating layer, and electrically connected to each other, and a sensing material (400), at least a part of which is buried in the insulating layer to contact the sensing electrode patterns.

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