会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 62. 发明授权
    • Method for manufacturing a thin film transistor
    • 薄膜晶体管的制造方法
    • US06387738B2
    • 2002-05-14
    • US09731756
    • 2000-12-08
    • Hye-dong Kim
    • Hye-dong Kim
    • H01L2100
    • H01L29/66757H01L29/458H01L29/78621
    • There is provided a method for manufacturing a thin film transistor. The present invention can reduce the number of process steps for manufacturing a thin film transistor, and also can lower contact resistance between layers. The manufacturing method deposits a buffer layer and an active layer on a substrate. The active layer is crystalized and patterned. Then, an insulating layer is deposited on an upper surface of the active layer and patterned to form a gate electrode on an upper surface of the insulating layer by a photolithography process using a photoresist layer. The photoresist layer covering the gate electrode is reflowed by heating and covers the edges of the gate electrode. A contact layer is formed by doping in high concentration at both edges of the active layer by plasma ion-injecting using the reflowed photoresist layer as a mask. After removing the photoresist layer, an LDD region is formed at the active layer by ion-injecting in low concentration. Then, an interlayer insulating layer is deposited on an upper surface of the gate electrode, exposing the contact layer by forming a contact hole at a predetermined portion of the interlayer insulating layer. A three-layered thin film of a first metal layer, an ITO layer and a second metal layer is sequentially deposited and patterned to form a source electrode, a drain electrode and a pixel electrode. A data line is formed on the second metal layer of the source electrode by an electroplating method.
    • 提供了制造薄膜晶体管的方法。 本发明可以减少用于制造薄膜晶体管的工艺步骤的数量,并且还可以降低层之间的接触电阻。 制造方法在衬底上沉积缓冲层和活性层。 有源层结晶化并图案化。 然后,在有源层的上表面上沉积绝缘层,并通过使用光致抗蚀剂层的光刻工艺将其图案化以在绝缘层的上表面上形成栅电极。 覆盖栅电极的光致抗蚀剂层通过加热回流并覆盖栅电极的边缘。 通过使用回流光致抗蚀剂层作为掩模的等离子体离子注入,在有源层的两个边缘以高浓度掺杂形成接触层。 在去除光致抗蚀剂层之后,通过离子注入低浓度在活性层处形成LDD区。 然后,在栅电极的上表面上淀积层间绝缘层,在层间绝缘层的规定部分形成接触孔,使接触层露出。 顺序地沉积和图案化第一金属层,ITO层和第二金属层的三层薄膜,以形成源电极,漏电极和像素电极。 通过电镀方法在源电极的第二金属层上形成数据线。