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61. 发明申请

US20080138508A1 Substrate Processing Method and Substrate Processing Apparatus 审中-公开
标题翻译：基板加工方法及基板加工装置
公开(公告)号：US20080138508A1
公开(公告)日：2008-06-12
申请号：US11885870
申请日：2006-03-06
申请人： Daisuke Takagi , Xinming Wang , Akira Owatari , Masanori Ishizaka , Akira Fukunaga
发明人： Daisuke Takagi , Xinming Wang , Akira Owatari , Masanori Ishizaka , Akira Fukunaga
IPC分类号： B05D5/12 , B05C3/02 , C09D5/00
CPC分类号： C23C18/1844 , C23C18/1653 , C23C18/168 , H01L21/288 , H01L21/76849
摘要： A substrate processing method is useful for forming, by electroless plating, a protective film, such as a magnetic film, which covers exposed surfaces of embedded interconnects composed of an interconnect material, such as copper or silver, embedded in fine interconnect recesses provided in a surface of a substrate. The substrate processing method includes bringing a surface of a substrate into contact with a processing solution whose temperature is adjusted to not more than 15° C., thereby activating the surface, and bringing the activated surface of the substrate into contact with a plating solution, thereby forming a metal film on the surface.
摘要翻译：基板处理方法可用于通过无电镀形成诸如磁性膜的保护膜，该保护膜覆盖由诸如铜或银的互连材料（例如铜或银）组成的嵌入式互连件的暴露表面，该互连材料嵌入在设置在基材表面。基板处理方法包括使基板的表面与温度调整为15℃以下的处理液接触，从而使表面活化，使基板的活化面与电镀液接触，从而在表面上形成金属膜。

62. 发明授权

US06693570B2 Digital-to-analog conversion circuitry incorporating a simplified testing circuit 失效
标题翻译：包含简化测试电路的数模转换电路
公开(公告)号：US06693570B2
公开(公告)日：2004-02-17
申请号：US10283097
申请日：2002-10-30
申请人： Shinsuke Ohnishi , Daisuke Takagi
发明人： Shinsuke Ohnishi , Daisuke Takagi
IPC分类号： H03M110
CPC分类号： H03M1/109 , H03M1/66
摘要： Digital-to-analog (DA) conversion circuitry with a simplified testing circuit includes a DA converter to which test data, initially “0”, may be applied. The DA converter feeds an analog voltage corresponding to the test data to a voltage holding circuit. Subsequently the test data is incremented to “1” and then converted to a corresponding analog voltage by the DA converter. A comparator compares the analog voltage corresponding to the test data “1” with the previous analog voltage held in the voltage holding circuit and corresponding to the test data “0”. When the test data is sequentially incremented by 1 (one) at intervals, the voltage output from the DA converter is higher than the voltage held in the voltage holding circuit while the DA converter operates normally. The function of the DA converter can be easily, rapidly tested by monitoring the output of the comparator.
摘要翻译：具有简化测试电路的数模（DA）转换电路包括DA转换器，可以应用测试数据，最初为“0”。 DA转换器将对应于测试数据的模拟电压馈送到电压保持电路。随后，测试数据增加到“1”，然后由DA转换器转换成相应的模拟电压。比较器将对应于测试数据“1”的模拟电压与保持在电压保持电路中的先前的模拟电压进行比较，并对应于测试数据“0”。当测试数据间隔地顺序增加1（1）时，DA转换器输出的电压高于保持在电压保持电路中的电压，而DA转换器正常工作。 DA转换器的功能可以通过监视比较器的输出来轻松快速地测试。

63. 发明授权

US5742480A Optical module circuit board having flexible structure 失效
标题翻译：光模块电路板结构灵活
公开(公告)号：US5742480A
公开(公告)日：1998-04-21
申请号：US552351
申请日：1995-11-02
申请人： Sosaku Sawada , Ryoji Sakamoto , Hiromi Kurashima , Daisuke Takagi , Satoshi Ohe , Takeshi Sekiguchi , Nobuo Shiga
发明人： Sosaku Sawada , Ryoji Sakamoto , Hiromi Kurashima , Daisuke Takagi , Satoshi Ohe , Takeshi Sekiguchi , Nobuo Shiga
IPC分类号： G02B6/42 , H05K1/00 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/30 , H05K3/34 , H01R9/09
CPC分类号： H05K1/189 , G02B6/4274 , G02B6/4281 , G02B6/4283 , G02B6/4245 , G02B6/4269 , H05K1/0393 , H05K1/118 , H05K2201/10151 , H05K2201/1034 , H05K2201/10446 , H05K2201/10636 , H05K2201/10651 , H05K2201/10689 , H05K2201/2009 , H05K3/0058 , H05K3/306 , H05K3/3447 , Y02P70/611
摘要： It is an object of the present invention to provide a highly reliable optical module circuit board having a sufficient mechanical strength with respect to an external stress. An optical module circuit board according to the present invention includes a flexible printed circuit having at least a multilayered structure in which a layer containing a conductive metal interconnection is sandwiched between insulating layers, wherein the flexible printed circuit includes a main body portion having the multilayered structure, a first surface mounted with an electronic component, and a second surface opposite to the first surface, a neck portion having the multilayered structure and extending from one end of the main body portion, and a head portion positioned at a distal end of the neck portion extending from the one end of the main body portion, having the multilayered structure, and mounted with an optical operation element and a bypass capacitor, Particularly, the neck portion defines the positional relationship between the main body portion and the head portion so as to give the circuit board a sufficient mechanical strength.
摘要翻译：本发明的目的是提供一种具有足够的机械强度相对于外部应力的高度可靠的光学模块电路板。根据本发明的光学模块电路板包括具有至少多层结构的柔性印刷电路，其中包含导电金属互连的层被夹在绝缘层之间，其中柔性印刷电路包括具有多层结构的主体部分，安装有电子部件的第一表面和与第一表面相对的第二表面，具有多层结构并从主体部分的一端延伸的颈部和位于颈部的远端的头部具有多层结构的主体部分的一端延伸并安装有光操作元件和旁路电容器的部分，特别地，颈部限定主体部分和头部之间的位置关系，从而给电路板提供足够的机械强度。

64. 发明授权

US11001072B2 Liquid discharge head, liquid discharge device, dispensing device, and liquid discharge method 有权
公开(公告)号：US11001072B2
公开(公告)日：2021-05-11
申请号：US16680741
申请日：2019-11-12
申请人： Manabu Yamanaka , Daisuke Takagi , Shinnosuke Koshizuka , Hiroshi Fujie , Takeshi Akai , Yu Yamaya , Youhei Niitsuma
发明人： Manabu Yamanaka , Daisuke Takagi , Shinnosuke Koshizuka , Hiroshi Fujie , Takeshi Akai , Yu Yamaya , Youhei Niitsuma
IPC分类号： B41J2/175 , B41J2/185 , B41J2/14
摘要： Liquid discharge head comprising: liquid discharge unit, which includes discharge port, liquid retaining section configured to retain liquid to be discharged from the discharge port, and displacement section configured to discharge the liquid retained within the liquid retaining section from the discharge port; a pair of liquid storage sections, which are configured to store the liquid and are each connected to the liquid retaining section in the liquid discharge unit so that the liquid can flow; a pair of liquid feeding sections that are connected to the pair of liquid storage sections and are configured to feed the liquid between the liquid storage section and the liquid retaining section; and a pair of open and close sections that are each disposed at flow path between the liquid feeding section and the liquid storage section and are configured to open and close the flow path.

65. 发明授权

US10605716B2 Particle counting apparatus, particle counting method, and particle containing sample 有权
公开(公告)号：US10605716B2
公开(公告)日：2020-03-31
申请号：US16041603
申请日：2018-07-20
申请人： Ikuo Katoh , Manabu Seo , Yunong Ji , Nobuaki Toyoshima , Hiroki Somada , Ryuya Mashiko , Satoshi Izumi , Takahiko Matsumoto , Daisuke Takagi
发明人： Ikuo Katoh , Manabu Seo , Yunong Ji , Nobuaki Toyoshima , Hiroki Somada , Ryuya Mashiko , Satoshi Izumi , Takahiko Matsumoto , Daisuke Takagi
IPC分类号： G01N15/14 , B01L3/02
摘要： A particle counting apparatus is provided that includes: a droplet discharger configured to discharge a droplet containing at least one luminescent particle capable of emitting light upon receiving light; a light irradiator configured to irradiate the droplet discharged by the droplet discharger with light; at least one light receiver configured to receive light emitted by the at least one luminescent particle irradiated with the light emitted by the light irradiator; and circuitry configured to count luminescent particles contained in the droplet based on the light received by the at least one light receiver, the circuitry being configured to measure a presence or absence of the luminescent particles contained in the droplet; and to measure a number of the luminescent particles contained in the droplet.

66. 发明申请

US20200023328A1 DROPLET FORMING DEVICE, DROPLET FORMING METHOD, AND DISPENSING APPARATUS 审中-公开
公开(公告)号：US20200023328A1
公开(公告)日：2020-01-23
申请号：US16435779
申请日：2019-06-10
申请人： Yuzuru KURAMOCHI , Daisuke TAKAGI , Satoshi OKANO , Takahiko MATSUMOTO , Koichi MURAMATSU , Satoshi NAKAZAWA , Ryuya MASHIKO , Manabu SEO , Hidekazu YAGINUMA , Mayuko MURANO
发明人： Yuzuru KURAMOCHI , Daisuke TAKAGI , Satoshi OKANO , Takahiko MATSUMOTO , Koichi MURAMATSU , Satoshi NAKAZAWA , Ryuya MASHIKO , Manabu SEO , Hidekazu YAGINUMA , Mayuko MURANO
IPC分类号： B01J2/18 , B41J2/045 , B41J2/025
摘要： A droplet forming device is provided. The droplet forming device includes a liquid holder configured to hold a liquid, a film having a discharge hole, two or more vibration generators configured to vibrate the film, and a driver configured to apply a driving signal to the vibration generators. One or more of the vibration generators are disposed in each region on the film where a polarity of bending moment differs.

67. 发明申请

US20190283402A1 LIQUID DROPLET FORMING DEVICE AND LIQUID DROPLET FORMING METHOD 审中-公开
公开(公告)号：US20190283402A1
公开(公告)日：2019-09-19
申请号：US16294969
申请日：2019-03-07
申请人： Yuzuru KURAMOCHI , Daisuke Takagi , Satoshi Okano , Takahiko Matsumoto , Koichi Muramatsu , Satoshi Nakazawa , Ryuya Mashiko
发明人： Yuzuru KURAMOCHI , Daisuke Takagi , Satoshi Okano , Takahiko Matsumoto , Koichi Muramatsu , Satoshi Nakazawa , Ryuya Mashiko
IPC分类号： B41J2/045
摘要： Provided is a liquid droplet forming device including: a liquid container capable of containing a liquid; a membranous member disposed at a bottom of the liquid container and including a discharging hole; a deforming unit capable of deforming the membranous member; and a driving unit configured to drive the deforming unit by outputting a discharging signal for deforming the membranous member to discharge the liquid or a suppressing signal for suppressing residual vibration of the membranous member, wherein the suppressing signal is a signal based on natural vibration period T0 of the membranous member, wherein an amplitude of the suppressing signal is lower than or equal to an amplitude of the discharging signal, and wherein interval time Ti from when outputting of the discharging signal is ended until when outputting of the suppressing signal is started satisfies a formula: Ti=(m−½)×T0, where m represents a positive integer.

68. 发明授权

US08632161B2 Liquid ejection head and image forming apparatus including the liquid ejection head 有权
标题翻译：液体喷射头和包括液体喷射头的成像设备
公开(公告)号：US08632161B2
公开(公告)日：2014-01-21
申请号：US13231464
申请日：2011-09-13
申请人： Masahiro Kuwata , Daisuke Takagi , Kazuo Haida
发明人： Masahiro Kuwata , Daisuke Takagi , Kazuo Haida
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/14274 , B41J2/055 , B41J2002/14419
摘要： A liquid ejection head includes a common-chamber formation member including a common chamber to supply liquid to pressure chambers communicating nozzles for ejecting liquid droplets, a flexible thin-film member to form part of a wall face of the common chamber, and a thin-film support member bonded to the thin-film member with glue. The support member has an opening or a recessed portion at least partially having a shape that is broad in an area proximal to a first surface of the support member bonded to the thin-film member and becomes narrower as an area of the opening or the recessed portion is more distant from the first surface. The opening or the recessed portion is sealed with the thin-film member. A portion of the thin-film member corresponding to the opening or the recessed portion has the glue on only a periphery area of the portion that contacts the support member.
摘要翻译：液体喷射头包括共用室形成构件，其包括公共室以将液体供应到用于喷射液滴的连通喷嘴的压力室，形成公共室的壁面的一部分的柔性薄膜构件，薄膜支撑构件用胶粘在薄膜构件上。支撑构件具有开口或凹部，该开口或凹部至少部分地具有在接近薄膜构件的支撑构件的第一表面附近的区域中宽的形状，并且作为开口的面积变窄或凹入部分距离第一表面更远。开口部或凹部用薄膜部件密封。对应于开口或凹部的薄膜构件的一部分仅在与支撑构件接触的部分的周边区域上具有胶水。

69. 发明授权

US07737562B2 Semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode 有权
标题翻译：半导体元件安装，半导体器件，成像器件，发光二极管元件和发光二极管
公开(公告)号：US07737562B2
公开(公告)日：2010-06-15
申请号：US11987170
申请日：2007-11-28
申请人： Kenjiro Higaki , Daisuke Takagi , Sadamu Ishidu , Yasushi Tsuzuki
发明人： Kenjiro Higaki , Daisuke Takagi , Sadamu Ishidu , Yasushi Tsuzuki
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L33/62 , H01L23/49827 , H01L24/97 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2924/01004 , H01L2924/01046 , H01L2924/01067 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/16195 , H01L2924/3025 , H05K1/0306 , H05K3/0052 , H05K3/403 , H05K2201/09181 , H05K2201/09827 , H01L2924/00014 , H01L2924/00
摘要： A collective substrate has through-holes. The through-holes each have an interior surface including taper surfaces which are tapered as having an opening size progressively decreasing from a main surface and an external connection surface toward a minimum size hole portion. A semiconductor element mount includes an insulative member cut out of the collective substrate. An imaging device includes an imaging element mounted in a region surrounded by a frame which is bonded to the main surface of the insulative member and closed by a cover. A light emitting diode component includes a light emitting element mounted on the main surface of the insulative member with the minimum size hole portion of the through-hole being filled with an electrically conductive material, the light emitting element being sealed with a fluorescent material and/or a protective resin.
摘要翻译：集体衬底具有通孔。通孔各自具有内表面，该内表面包括锥形表面，该锥形表面具有从主表面和外部连接表面朝向最小尺寸孔部分逐渐减小的开口尺寸的锥形。半导体元件安装件包括从集体基板切出的绝缘构件。成像装置包括安装在被框架包围的区域中的成像元件，所述框架被结合到绝缘构件的主表面并被盖封闭。发光二极管部件包括安装在绝缘构件的主表面上的发光元件，通孔的最小孔部分填充有导电材料，发光元件用荧光材料和/ 或保护树脂。

70. 发明申请

US20050245080A1 Method and apparatus for processing substrate 有权
标题翻译：处理基板的方法和装置
公开(公告)号：US20050245080A1
公开(公告)日：2005-11-03
申请号：US11039967
申请日：2005-01-24
申请人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka , Tsuyoshi Sahoda
发明人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka , Tsuyoshi Sahoda
IPC分类号： C23C18/16 , C23C18/18 , H01L21/00 , H01L21/02 , H01L21/288 , H01L21/306 , H01L21/321 , H01L21/768 , H01L21/4763 , H01L21/44
CPC分类号： H01L21/02068 , C23C18/1632 , C23C18/1689 , C23C18/1844 , H01L21/02074 , H01L21/288 , H01L21/67028 , H01L21/76849 , H01L21/76874 , H01L21/76883
摘要： A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.
摘要翻译：基板处理方法可以通过在贱金属（例如互连）的暴露表面上通过无电解电镀牢固地形成金属膜，具有增加的生产量并且在母材中不形成空隙。基板处理方法包括：用包含含羧基的有机酸或其盐和表面活性剂的水溶液作为添加剂的清洗溶液清洗在表面形成的基体金属的基材的表面; 使清洗后的基板的表面与包含清洗液和含有催化剂金属离子的溶液的混合物的处理溶液接触，从而将催化剂施加到基板的表面; 以及通过在基板的催化剂涂覆表面上通过无电镀形成金属膜。

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