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61. 发明公开

EP0827620A1 FLEX CIRCUIT FLEXURE WITH INTEGRAL HIGH COMPLIANCE GIMBAL 失效
标题翻译：具有低刚度元素灵活的头悬架
公开(公告)号：EP0827620A1
公开(公告)日：1998-03-11
申请号：EP96920400.0
申请日：1996-05-21
申请人： QUANTUM CORPORATION
发明人： WILLIAMS, Stephen, P. , RIENER, Timothy, A.
IPC分类号： G11B5 , G11B21
CPC分类号： G11B5/4833 , G11B21/16
摘要： An improved flexure (31) for supporting a read/white head adjacent to a relatively moving storage medium in a disk drive is disclosed. The flexure is a patterned flex circuit structure (30) that is mounted to a load beam (42) in an actuator assembly and includes integral wiring and bonding pads (33) for electrically connecting the head (16) to the electronics of the disk drive. The flexure also implements a high compliance gimbal with integral wiring.

62. 发明公开

EP0803530A3 Cross-linked polyolefin tape 失效
标题翻译：交联聚烯烃胶带
公开(公告)号：EP0803530A3
公开(公告)日：1998-03-11
申请号：EP97302881.4
申请日：1997-04-25
申请人： Sentinel Products Corp.
发明人： Hurley, Robert, F. , Kozma, Matthew, L. , Bambara, John, D.
IPC分类号： C08J3/24
CPC分类号： C09J7/241 , Y10T428/249983 , Y10T428/249985 , Y10T428/2852 , Y10T428/2857
摘要： The invention relates to polymer tapes that are blends including at least one silane-grafted single-site initiated polyolefin resin. The silane-grafted single-site initiated polyolefin resin generally is a copolymer of ethylene and a C 3 -C 20 alpha-olefin that has a molecular weight distribution between about 1.5 and about 3.5. The polymer tapes include an adhesive on at least one face of the polymer. The polymer tapes can be foamed.

63. 发明授权

EP0414368B1 Apparatus for data and forward error correction coding for low DC-offset and short run length 失效
标题翻译：装置，用于数据编码和前向纠错的低直流偏移电压和短游程长度
公开(公告)号：EP0414368B1
公开(公告)日：1998-03-04
申请号：EP90307674.3
申请日：1990-07-09
申请人： DIGITAL EQUIPMENT CORPORATION
发明人： McMahon, Donald H. , Kirby, Alan J. , Schofield, Bruce A. , Springer, Kent
IPC分类号： H04L25/49
CPC分类号： H04L1/0042 , H04L25/4908

64. 发明公开

EP0823058A1 METHOD AND APPARATUS FOR ELIMINATING MUTUAL INDUCTANCE EFFECTS IN RESONANT COIL ASSEMBLIES 失效
标题翻译：方法和设备拆卸感应效应响应线圈布置
公开(公告)号：EP0823058A1
公开(公告)日：1998-02-11
申请号：EP96911046.0
申请日：1996-04-26
申请人： Mansfield, Peter
发明人： Mansfield, Peter
IPC分类号： A61B5 , G01R33 , H01Q1 , H01Q7
CPC分类号： G01R33/365 , G01R33/3628 , H01Q1/521 , H01Q7/005
摘要： A method and apparatus for eliminating mutual inductance effects in resonant coil assemblies in which a plurality of coils are situated in sufficiently close proximity to create small mutual inductances between the coils, the method comprises evaluating the mutual inductances using a T, star or other transformation of the relevant parts of the circuit thereby isolating the mutual inductances in such a way that series capacitances may be introduced to tune out the mutual inductances at a common frequency thereby reducing the coil array to a synchronously tuned circuit.

65. 发明授权

EP0430502B1 A method for simultaneous initialization of a double buffer and a frame buffer 失效
标题翻译：双缓冲器和帧缓冲器的同时初始化
公开(公告)号：EP0430502B1
公开(公告)日：1998-01-14
申请号：EP90312473.3
申请日：1990-11-15
申请人： DIGITAL EQUIPMENT CORPORATION
发明人： Kelleher, Brian Michael , Hussain, Zahid
IPC分类号： G06T1/00 , G09G1/16
CPC分类号： G09G5/399 , G06T15/405 , G09G5/363 , G09G2360/122 , G09G2360/126

66. 发明授权

EP0341852B1 High efficiency disk format and synchronization system 失效
标题翻译：具有高效率和系统同步磁盘格式
公开(公告)号：EP0341852B1
公开(公告)日：1998-01-07
申请号：EP89304048.5
申请日：1989-04-24
申请人： QUANTUM CORPORATION
发明人： Leis, Michael D. , Leshay, Bruce , Muchnik, Michael , Rege, Satish , Riggle, Charles Michael , Weng, Lih-Jyh
IPC分类号： G11B5/596 , G11B27/30 , G11B20/12
CPC分类号： G11B27/3027 , G11B5/59633 , G11B20/1217 , G11B2020/1282 , G11B2220/20

67. 发明公开

EP0811285A1 METHOD AND APPARATUS IN NETWORK ADAPTER FOR AUTOMATIC RETRANSMISSION OF PACKETS 失效
标题翻译：方法和设备在网络适配器包自动重发
公开(公告)号：EP0811285A1
公开(公告)日：1997-12-10
申请号：EP96942888.0
申请日：1996-12-04
申请人： DIGITAL EQUIPMENT CORPORATION
发明人： PAUL, Gideon , WERTHIMER, Aviad , BEN-MICHAEL, Simoni , HAWE, William
IPC分类号： H04L12
CPC分类号： H04L12/40032 , H04L12/40013 , H04L12/413
摘要： A method implemented by a computer network adapter for automatic retransmission of a packet whose transmission was interrupted by the occurrence of a number of excessive collisions entails the steps of (a) if the number of excessive collisions is below an excessive collision limit, stopping transmission and substantially immediately initiating transmission of the packet again, and (b) if the number of excessive collisions exceeds an excessive collision limit, stopping transmission and discarding the packet. The method also serves for automatic retransmission of any packet involved in an unsuccessful transmission attempt due to transmit buffer underflow conditions and entails the steps of (a) stopping the transmission; and (b) retrying another transmission of the packet for up to a predetermined number of attempts with an increased transmit threshold. The transmit threshold is the number of bytes of data of the packet involved in the transmission that are stored in the transmit buffer prior to start of transmission. Preferably, for the initial transmission attempt, the adapter requires only a small number of bytes of the packet to be stored in the transmit buffer. After occurrence of a buffer underflow condition, the adapter attempts a retry in accordance with the algorithm only after a substantially larger portion of the packet has entered the transmit buffer for transmission. If any retry succeeds, the adapter need not issue an interrupt.

68. 发明公开

EP0804764A1 SYNCHRONOUS DMA TRANSFER PROTOCOL 失效
标题翻译：同步DMA传输协议
公开(公告)号：EP0804764A1
公开(公告)日：1997-11-05
申请号：EP96938822.0
申请日：1996-11-12
申请人： QUANTUM CORPORATION
发明人： APPELBAUM, Jeffrey, H. , BROOKS, John, W. , McGRATH, James, P. , NGUYEN, Hung, C.
IPC分类号： G06F13
CPC分类号： G06F13/28
摘要： A synchronous DMA burst transfer method is provided for transferring data between a host device and a peripheral drive device connected by an ATA bus. The method provides synchronous data transfer capability in an asynchronous system by having one device in charge of both a strobe signal and a data signal. When a host read or write command (901) is delivered to the drive device, the device decides when to start the synchronous DMA burst (902). For a read command (B), the device requests the synchronous DMA burst, then drives a data word onto the ATA bus (908) after the host acknowledges that it is ready to begin the burst (904 and 906). After the device toggles a strobe signal (910), the host latches the data word on the bus (912). Additional data words can be driven on the bus and the strobe signal can be retoggled to latch additional data words into the host (914). After all data words have been transferred, the burst is terminated and ready to be used for another host command (918).

69. 发明公开

EP0632495A3 Method of forming micro-trench isolation regions in the fabrication of semiconductor devices 失效
标题翻译：一种用于制造微沟槽的隔离区域用于半导体器件的过程。
公开(公告)号：EP0632495A3
公开(公告)日：1997-11-05
申请号：EP94304725.8
申请日：1994-06-28
申请人： DIGITAL EQUIPMENT CORPORATION
发明人： Swan,Stephen William , Picciolo,Ellen Grant
IPC分类号： H01L21/76
CPC分类号： H01L21/76232 , Y10S148/05
摘要： A method of forming micro-trench isolation regions with a separation of 0.20µm to 0.35µm in the fabrication of semiconductor devices involves forming an silicon dioxide layer on select locations of a semiconductor substrate and depositing a polysilicon layer onto the silicon dioxide layer. A layer of photoresist is then deposited over select areas of the polysilicon layer and patterned to form micro-trench isolation regions of widths between about 0.2µm to about 0.5µm and aspect ratio of between about 2:1 to about 7:1. Thereafter, the isolation regions are etched for a time and pressure sufficient to form micro-trenches in the substrate surface. The micro-trenches will generally have a width ranging from about 1000Å to about 3500Å and depth ranging from about 500Å to about 5000Å. The layer of photoresist is then removed to expose the polysilicon layer and a channel stop implant is deposited and aligned with the micro-trenches. A thermal silicon dioxide layer is formed in the micro-trenches and an undoped silicon dioxide layer is deposited onto the polysilicon layer to fill the micro-trenches. A planar silicon dioxide layer is then deposited onto the undoped silicon dioxide layer and the undoped and planar silicon dioxide layers are then etched back to expose the polysilicon layer. After etchback, the polysilicon layer is stripped to provide the micro-trench isolation regions.

70. 发明公开

EP0801608A1 SEAT LOCKING MECHANISM AND SEAT INCORPORATING SAME 失效
标题翻译：座椅锁定装置和SEAT利用这样的装置
公开(公告)号：EP0801608A1
公开(公告)日：1997-10-22
申请号：EP95941815.0
申请日：1995-12-29
申请人： Tricom Automotive Limited , ROVER GROUP LIMITED
发明人： JONES, Neil, Harvey, Lyndon , MacANDREW, Kenneth, Douglas, Alexander
IPC分类号： B60N2
CPC分类号： B60N2/3011 , B60N2/01583 , B60N2/206 , B60N2002/962
摘要： PCT No. PCT/GB95/03046 Sec. 371 Date May 22, 1998 Sec. 102(e) Date May 22, 1998 PCT Filed Dec. 29, 1995 PCT Pub. No. WO96/20848 PCT Pub. Date Jul. 11, 1996A locking mechanism for a folding vehicle seat which ensures that the seat cannot be unfolded to a position suitable for use as a seat unless the seat is correctly engaged with latching points on the vehicle body. The mechanism provides a single actuating control which facilitates movement of, for example, the seat back rest from a folded to an upright position once the seat is correctly engaged with the latching points. The mechanism also provides an actuating control to facilitate seat removal from the latching or anchorage point when the seat is in the folded position.

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