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    • 58. 发明公开
    • High temperature adhesive for polyimide films and its use
    • Hochtemperatur-KlebemittelfürPolyimidfilme和ihre Anwendung。
    • EP0298668A2
    • 1989-01-11
    • EP88306005.5
    • 1988-07-01
    • ETHYL CORPORATION
    • Roark, David NealLambert, Jules Adam
    • C08G73/10B32B27/04
    • B32B7/12B32B15/08B32B15/20B32B27/04B32B27/08B32B27/281B32B2311/12B32B2379/08C08G73/105C08J5/124C08J5/24C08J2379/08H05K3/386Y10T428/249951Y10T428/31681Y10T428/31721Y10T442/138
    • Thermoplastic polyimides of benzophenone tetracarboxylic acid or an ester or anhydride thereof and a 2,2-bis[4-(aminophenoxy)phenyl]hexafluoro­propane are excellent adhesives for, for example, bonding polyimide films to various substrates including polyimide film, and metals. The film and substrate need not be abraded before application of the polyamic acid resin or polyimide precursor from which the polyimide is formed on curing. The bond is tenacious. Even after heating to 425°C the bond was stronger than two different polyimide films. Interposing between the polyimide film and the substrate a strip or patch of a prepreg made from polyimide precursor solutions composed of monomers, solvent and polyamic acid, and applying heat to cure the resin in situ while keeping the components in intimate contact by application of slight pressure is a preferred way of applying and utilizing the adhesives. Such prepregs are also useful for bonding metal to metal or to various other substrates.
    • 二苯甲酮四羧酸或其酯或酸酐和2,2-双[4-(氨基苯氧基)苯基]六氟丙烷的热塑性聚酰亚胺是例如将聚酰亚胺膜与包括聚酰亚胺膜和金属的各种基材接合的优异的粘合剂。 在固化之前,在施加聚酰亚胺的聚酰胺酸树脂或聚酰亚胺前体之前,不需要研磨膜和基材。 债券是顽强的。 即使在加热至425℃之后,该结合强于两种不同的聚酰亚胺膜。 在聚酰亚胺膜和基板之间插入由单体,溶剂和聚酰胺酸组成的聚酰亚胺前体溶液制成的预浸料条带或贴片,并通过施加轻微的压力施加热来固化树脂,同时保持组分紧密接触 是施加和利用粘合剂的优选方式。 这种预浸料也可用于将金属与金属或各种其它基材结合。