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51. 发明授权

US06750894B2 Method of forming image on support 失效
标题翻译：在支撑上形成图像的方法
公开(公告)号：US06750894B2
公开(公告)日：2004-06-15
申请号：US10168535
申请日：2002-07-01
申请人： Urho A. Pietilä
发明人： Urho A. Pietilä
IPC分类号： B41J2435
CPC分类号： H05K3/125 , B41C1/1066 , G03C5/00 , H05K3/0082 , H05K3/102 , H05K3/105 , H05K3/106 , H05K2203/013 , H05K2203/0525
摘要： The present invention relates to a method of recording an image of a given object onto a substrate. In the method, the object is first defined as the numerical image values at its coordinate locations and then, using these numerical values for control, the final image is recorded with the help of reactive agents capable of undergoing a change of state. Each one of the state-changing reactive agents is applied onto each point of the substrate in an amount located and controlled by the numerical value of the respective point in the object image, whereupon each one of the amounts of the applied agents is subjected to a reaction causing a change of state. The invention can be implemented to record photographic images, for instance. Other applications are in the manufacture of printed-circuit boards, printing plates and the like.
摘要翻译：本发明涉及将给定对象的图像记录到基板上的方法。在该方法中，首先将对象定义为其坐标位置处的数值图像值，然后使用这些数值进行控制，借助于能够经历状态改变的反应器来记录最终图像。状态变化反应剂中的每一个以基于对象图像中的各个点的数值所定位和控制的量施加到基板的每个点上，由此施加的试剂的量的每一个都经受反应导致状态改变。例如，可以实现本发明来记录照相图像。其他应用在印刷电路板，印版等的制造中。

52. 发明申请

US20030013228A1 Method and apparatus for attaching solder members to a substrate 有权
标题翻译：将焊料部件附着于基板的方法和装置
公开(公告)号：US20030013228A1
公开(公告)日：2003-01-16
申请号：US10191473
申请日：2002-07-10
发明人： Gregory B. Hotchkiss , Gary D. Stevens
IPC分类号： H01L021/48
CPC分类号： H01L21/4839 , H01L21/6835 , H01L24/11 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/3025 , H05K3/3478 , H05K2201/10424 , H05K2203/0113 , H05K2203/0152 , H05K2203/0156 , H05K2203/0338 , H05K2203/041 , H05K2203/0525 , H01L2224/0401 , H01L2924/00012
摘要： The invention discloses a method for attaching solder members (114) to a substrate (112). The method includes forming a decal (110) with a plurality of solder members (114). The method further comprises aligning the decal (110) with the substrate (112) and transferring the solder members (114) on the decal (110) to the substrate (112).
摘要翻译：本发明公开了一种将焊料部件（114）附着于基板（112）的方法。该方法包括用多个焊料构件（114）形成贴花（110）。该方法还包括使贴花（110）与衬底（112）对准并将贴花（110）上的焊料部件（114）转移到衬底（112）上。

53. 发明授权

US6071801A Method and apparatus for the attachment of particles to a substrate 有权
标题翻译：用于将颗粒附着到基底的方法和装置
公开(公告)号：US6071801A
公开(公告)日：2000-06-06
申请号：US253837
申请日：1999-02-19
申请人： Kurt P. Wachtler , Gregory B. Hotchkiss
发明人： Kurt P. Wachtler , Gregory B. Hotchkiss
IPC分类号： H01L21/48 , H01L23/498 , H05K3/34 , H01L21/44
CPC分类号： H01L23/49811 , H01L21/4846 , H05K3/3478 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/15311 , H05K2203/041 , H05K2203/0522 , H05K2203/0525
摘要： A method for populating an substrate (14) with particles (12, 16), comprising the steps of applying an adhesive coating (22) to both surfaces of a substrate (14) and loading the particles (12, 16) to the adhesive areas (30) of the adhesive coating (22), such that each surface of the substrate (14) is fully populated with the particles (12, 16) which may thereafter be reflowed simultaneously. The particles may be composed of a variety of compositions, including copper, other metals, alloys, and synthetic resin compounds, such as conductive plastics.
摘要翻译：一种用于用颗粒（12,16）填充衬底（14）的方法，包括以下步骤：将粘合剂涂层（22）施加到衬底（14）的两个表面上，并将颗粒（12,16）装载到粘合剂区域（22）的所述表面（30），使得所述基底（14）的每个表面完全填充有随后可以同时回流的颗粒（12,16）。颗粒可以由各种组合物组成，包括铜，其他金属，合金和合成树脂化合物，例如导电塑料。

54. 发明授权

US5994034A Fabrication method of printed wiring board 失效
标题翻译：印刷电路板的制造方法
公开(公告)号：US5994034A
公开(公告)日：1999-11-30
申请号：US845037
申请日：1997-04-21
申请人： Eiji Maehata
发明人： Eiji Maehata
IPC分类号： G03F7/004 , G03F7/40 , H05K3/18 , H05K3/46 , G03C5/16
CPC分类号： G03F7/40 , H05K3/182 , H05K3/4661 , G03F7/405 , H05K2201/0209 , H05K2201/0212 , H05K2201/0236 , H05K2203/0525 , H05K2203/121
摘要： A fabrication method of a printed wiring board realizing high adhesion strength of a patterned conductive layer while keeping the high insulation reliability between adjacent conductive paths. First, an adhesive material is prepared, which is a mixture of a photo-setting resin as a matrix, fine particles of a photolyzable resin dispersed in the photo-setting resin, and a metal-organic compound/complex mixed with the photo-setting resin. The adhesive material is coated on an insulative base material to form an adhesive layer. The adhesive layer is then selectively exposed to light, selectively curing the photo-setting resin and selectively photolyzing the particles of the photolyzable resin. The exposed adhesive layer is developed by an alkaline developer solution, thereby transferring the pattern on the mask to the adhesive layer and removing the photolyzed particles for surface roughening of the remaining, unexposed parts of the adhesive layer. The metal-organic compound/complex in the unexposed parts of the adhesive layer is reduced for activation, causing the metal-organic compound/complex to reveal plating catalytic activity. A conductive layer is selectively formed on the unexposed parts of the adhesive layer by electroless plating performed under the plating catalytic activity of the activated metal-organic compound/complex.
摘要翻译：在保持相邻导电路径之间的高绝缘可靠性的同时实现图案化导电层的高粘合强度的印刷线路板的制造方法。首先，制备作为基质的光固化树脂，分散在光固化树脂中的光可分散树脂的微粒和与光固化剂混合的金属有机化合物/络合物的混合物的粘合剂材料树脂。将粘合剂材料涂覆在绝缘基材上以形成粘合剂层。然后选择性地将粘合剂层暴露于光，选择性地固化光固化树脂并选择性地光解光可光化树脂的颗粒。曝光的粘合剂层由碱性显影剂溶液显影，从而将掩模上的图案转印到粘合剂层上，并除去光解颗粒以使粘合剂层的剩余的未曝光部分的表面粗糙化。粘合剂层的未曝光部分中的金属有机化合物/络合物被还原以用于活化，导致金属 - 有机化合物/络合物显示电镀催化活性。通过在活化的金属 - 有机化合物/络合物的电镀催化活性下进行的化学镀，在粘合剂层的未曝光部分上选择性地形成导电层。

55. 发明授权

US4737446A Method for making multilayer circuits using embedded catalyst receptors 失效
标题翻译：使用嵌入式催化剂受体制造多层电路的方法
公开(公告)号：US4737446A
公开(公告)日：1988-04-12
申请号：US947832
申请日：1986-12-30
申请人： Abraham B. Cohen , Roxy N. Fan , John A. Quinn
发明人： Abraham B. Cohen , Roxy N. Fan , John A. Quinn
IPC分类号： G03F7/004 , H05K3/00 , H05K3/18 , H05K3/38 , H05K3/46 , G03C5/00 , B05D3/06 , B05D5/12
CPC分类号： G03F7/0047 , H05K3/181 , H05K3/38 , H05K3/4661 , H05K2201/0209 , H05K2201/0376 , H05K2201/09509 , H05K2201/2072 , H05K2203/0525 , H05K3/0023 , H05K3/184 , H05K3/465
摘要： The invention is directed to a laminate for the preparation of a multilayer printed circuit by electroless plating of conductive metal thereon which comprisesa. a substrate having formed on a surface thereofb. a conductive pattern, and,c. overlying the pattern and surrounding substrate areas, a layer of tonable photodielectric material having partially embedded therein finely divided particles of adsorbent which protrude from the layer surface away from the substrate, the protrusive surfaces of which are adsorptive with respect to electroless plating catalysts or reductive precursors thereof.

56. 发明授权

US3723123A Multicolor reproductions 失效
标题翻译：多媒体重现
公开(公告)号：US3723123A
公开(公告)日：1973-03-27
申请号：US3723123D
申请日：1971-03-10
申请人： STALEY MFG CO A E
发明人： JONES R , THOMPSON W
IPC分类号： B41M5/00 , G03F1/56 , G03F7/28 , G03G7/00 , G03G11/00 , G03C5/24 , B05C1/16
CPC分类号： G03F1/56 , B41M5/0029 , G03F7/28 , G03G7/00 , G03G11/00 , H05K2203/0525 , H05K2203/0585 , H05K2203/1355
摘要： THE METHOD OF FORMING A MULTICOLOR REPRODUCTION WHICH COMPRISES: COATING A SUBSTRATE BEARING A FIRST COLOR IN IMAGE-WISE CONFIGURATION WITH A SOLID, LIGHT-SENSITIVE ORGANIC LAYER HAVING A THICKNESS OF AT LEAST 0.1 MICRON WHILE MAINTAINING SAID FIRST COLOR IN ITS IMAGE-WISE CONFIGURATION, SAID LIGJT-SENSITIVE ORGANIC LAYER BEING CAPABLE OF DEVELOPING A RD OF 0.2 TO 2.2; EXPOSING SAID LIGHT-SENSITIVE OR GANIC LAYER TO ACTINIC RADIATION IN IMAGE-RECEIVING MANMER TO ESTABLISH A POTENTIAL RD OF 0.2 TO 2.2; APPLYING SAID LAYER OF ORGANIC MATERIAL, FREE FLOWING POWDER PARTICLES OF A SECOND COLOR HAVING A DIAMETER, ALONG AT LEAST ONE AXIS, OF AT LEAST ABOUT 0.2 MICRON BUT LESS THAN 25 TIMES THE THICKNESS OF SAID ORGANIC LAYER; WHILE THE LAYER IS AT A TEMPERATURE BELOW THE MELTING POINTS OF THE POWDER AND OF THE ORGANIC LAYER, EMBEDDING SAID POWDER PARTICLES AS A MONOLAYER IN A STRATUM AT THE SURFACE OF SAID LIGHT-SENSITIVE LAYER TO YIELD AN IMAGE HAVING PORTIONS VARYING IN DENSITY IN PROPORTION TO THE EXPOSURE OF EACH PORTION; AND REMOVING NON-EMBEDDED PARTICLES FROM SAID ORGANIC LAYER TO DEVELOP A MULTICOLOR REPRODUCTION.

57. 发明授权

US3637385A Solid deformation imaging 失效
标题翻译：固体变形成像
公开(公告)号：US3637385A
公开(公告)日：1972-01-25
申请号：US3637385D
申请日：1969-02-05
申请人： STALEY MFG CO A E
发明人： HAYES LESTER P , JONES REXFORD W , THOMPSON WILLIAM B
IPC分类号： G03F7/004 , G03F7/038 , G03C5/24 , G03C1/68
CPC分类号： G03F7/038 , H05K2203/0525 , H05K2203/0585 , H05K2203/1355 , Y10S430/114
摘要： Process and articles for forming line, halftone or continuoustone images which comprises: exposing to actinic radiation in image-receiving manner a solid, positive-acting or negativeacting light-sensitive organic layer having a thickness of at least 0.1 micron, said layer being capable of developing a Rd of 0.2 to 2.2; continuing the exposure to either clear the background of positive-acting light-sensitive layers or to establish a potential Rd of 0.2 to 2.2 with negative-acting light-sensitive organic layers; applying to said layer of organic material, free-flowing powder particles having a diameter, along at least one axis of at least about 0.3 micron but less than 25 times the thickness of said organic layer; while the layer is at a temperature below the melting points of the powder and of the organic layer, physically embedding said powder particles as a monolayer in a stratum at the surface of said light-sensitive layer to yield images having portions varying in density in proportion to the light exposure of each portion; and removing nonembedded particles from said organic layer to develop an image.
摘要翻译：用于形成线，半色调或连续色调图像的方法和制品，其包括：以图像接收方式曝光具有至少0.1微米厚度的固体，正作用或负效应的感光有机层的光化辐射，所述层能够显影0.2〜2.2的Rd; 继续曝光以清除正性光敏层的背景，或用负性光敏有机层建立0.2〜2.2的潜在Rd; 施加到所述有机材料层上，沿至少一个轴线至少约0.3微米但小于所述有机层厚度的25倍的直径的自由流动粉末颗粒; 而该层的温度低于粉末和有机层的熔点，将所述粉末颗粒作为单层物理地包埋在所述感光层的表面的层中，以产生具有以比例密度变化的部分的图像对每个部分的曝光; 以及从所述有机层去除未嵌入的颗粒以形成图像。

58. 发明授权

US2443119A Process of producing predetermined metallic patterns 失效
标题翻译：制作预定金属图案的工艺
公开(公告)号：US2443119A
公开(公告)日：1948-06-08
申请号：US52988744
申请日：1944-04-05
申请人： RUBIN MILTON D
发明人： RUBIN MILTON D
IPC分类号： C25D5/02 , H05K3/10
CPC分类号： H05K3/108 , C25D5/02 , H05K2203/0525 , H05K2203/1355

59. 发明申请

US20080119581A1 Material for Metallic-Pattern Formation, Crosslinking Monomer, and Method of Forming Metallic Pattern 审中-公开
标题翻译：金属图案形成材料，交联单体和形成金属图案的方法
公开(公告)号：US20080119581A1
公开(公告)日：2008-05-22
申请号：US11883063
申请日：2005-12-28
申请人： Hiroshi Takanashi , Syozo Miyazawa , Tomoya Kudo
发明人： Hiroshi Takanashi , Syozo Miyazawa , Tomoya Kudo
IPC分类号： C08F2/46 , D06M15/277
CPC分类号： C23C18/06 , C07C233/20 , C08F2/48 , C08F220/58 , C23C18/02 , C23C18/04 , C23C18/08 , G03F7/0047 , G03F7/027 , G03F7/40 , G03F7/405 , H01L21/76838 , H05K1/0306 , H05K3/105 , H05K3/185 , H05K2203/0525 , H05K2203/121
摘要： The present invention provides a process for forming a metal pattern in which a metal is chemically absorbed, and a pattern forming material and a crosslinkable monomer used for the process. The process includes: a step for forming a pattern by photolithography including an exposure step for carrying out exposure with a purified water-based developer having a pH of less than 7 on a pattern forming material containing (A) a matrix polymer having at least one of a carboxyl and a sulfonate group, and a rinsing step; a step for forming a metal-containing pattern by immersing the pattern in an aqueous solution containing a metal compound to allow for chemical absorption of a metal ion or a complex ion to the pattern; and a step for forming a metal pattern containing the elemental metal or further containing metal oxide by sintering the metal-containing pattern. A crosslinkable monomer containing a condensation product of a polyhydric alcohol with N-methylol(meth)acrylamide was used.
摘要翻译：本发明提供一种用于形成其中化学吸收金属的金属图案的方法，以及用于该方法的图案形成材料和可交联单体。该方法包括：通过光刻形成图案的步骤，包括用于在含有（A）具有至少一个基质聚合物的基质聚合物的图案形成材料上进行用pH小于7的纯化水性显影剂进行曝光的曝光步骤的羧基和磺酸酯基，和漂洗步骤; 通过将图案浸渍在含有金属化合物的水溶液中以允许化学吸收金属离子或复合离子到图案上来形成含金属图案的步骤; 以及通过烧结含金属图案形成含有元素金属或进一步含有金属氧化物的金属图案的步骤。使用含有多元醇与N-羟甲基（甲基）丙烯酰胺的缩合物的交联性单体。

60. 发明申请

US20070145103A1 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas 审中-公开
标题翻译：用于从具有粘性和非粘性区域阵列的表面安装和拆卸颗粒的静电方法和装置
公开(公告)号：US20070145103A1
公开(公告)日：2007-06-28
申请号：US11705949
申请日：2007-02-12
申请人： Thomas Bednarz , Allan Cairncross , John Gantzhorn , George Thomson
发明人： Thomas Bednarz , Allan Cairncross , John Gantzhorn , George Thomson
IPC分类号： A47J36/02
CPC分类号： H01L24/742 , H01L21/4853 , H01L23/49811 , H01L24/11 , H01L2224/11334 , H01L2224/13099 , H01L2224/742 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/01052 , H01L2924/01068 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/3025 , H05K3/3478 , H05K2203/041 , H05K2203/0522 , H05K2203/0525 , H05K2203/105 , H05K2203/1492 , H01L2924/00
摘要： Methods and associated apparatus are disclosed for use in mounting particles on and de-mounting particles from a substrate having an array of tacky and non-tacky areas. The particles can be either electrically conducting or electrically non-conducting. Selection of electrically conducting particles is preferred. The substrate having an array of tacky and non-tacky areas can either be electrically nonconducting (e.g., a dielectric substrate) or electrically-conducting. The methods involve use of first and second electrode plates with the substrate therebetween, the plates having applied thereto a direct current potential, which potential in preferred embodiments is reversed in polarity for a number N of cycles. Methods and articles are disclosed using an electrically conductive surface adjacent the tacky and non-tacky areas to minimize static buildup on the particles and tacky and non-tacky areas.
摘要翻译：公开了用于将颗粒安装在具有粘性和非粘性区域阵列的基底上并从其上拆卸颗粒的方法和相关设备。颗粒可以是导电的或非导电的。优选选择导电颗粒。具有粘性和非粘性区域阵列的基底可以是非导电的（例如电介质基底）或导电的。所述方法包括使用第一和第二电极板，其间具有基板，所述板向其施加直流电势，优选实施例中的电位在极数N个循环中反转。使用邻近粘性和非粘性区域的导电表面来公开方法和制品，以最小化颗粒和粘性和非粘性区域上的静电积累。

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