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    • 51. 发明授权
    • Organometallic composition for forming a metal alloy pattern and a method of forming such a pattern using the composition
    • 用于形成金属合金图案的有机金属组合物和使用该组合物形成这种图案的方法
    • US08715914B2
    • 2014-05-06
    • US12929151
    • 2011-01-04
    • Jin Young KimSoon Taik HwangYoung Hun ByunEuk Che HwangSang Yoon Lee
    • Jin Young KimSoon Taik HwangYoung Hun ByunEuk Che HwangSang Yoon Lee
    • G03C1/735
    • G03F7/0043G03F7/0042
    • An organometallic composition containing an organometallic compound (I) containing Ag, an organometallic compound (II) containing Au, Pd, or Ru, and an organometallic compound (III) containing Ti, Ta, Cr, Mo, Ru, Ni, Pd, Cu, Au, or Al, wherein the metal components of organometallic compounds (II) and (III), respectively, are present in an amount of 0.01˜10 mol % based on the amount of Ag in the organometallic compound (I), and a method of forming a metal alloy pattern using the same. Silver alloy patterns can be obtained through a simplified manufacturing process, which patterns have enhanced heat resistance, adhesiveness, and chemical stability. The method may be applied to making a reflective film for LCD and metal wiring (gate, source, drain electrode) for flexible displays or flat panel displays, and further to CMP-free damascene processing and PR-free ITO film deposition.
    • 含有含Ag的有机金属化合物(I),含有Au,Pd或Ru的有机金属化合物(II)和含有Ti,Ta,Cr,Mo,Ru,Ni,Pd,Cu的有机金属化合物(III)的有机金属组合物 ,Au或Al,其中有机金属化合物(II)和(III)的金属组分分别以有机金属化合物(I)中的Ag的量为0.01〜10摩尔%,和 使用其形成金属合金图案的方法。 可以通过简化的制造工艺获得银合金图案,该图案具有增强的耐热性,粘合性和化学稳定性。 该方法可以应用于制造用于LCD和用于柔性显示器或平板显示器的LCD和金属布线(栅极,源极,漏极)的反射膜,并且还可用于制造无CMP的镶嵌加工和无PR的ITO膜沉积。
    • 57. 发明授权
    • Organometallic composition for forming a metal alloy pattern and a method of forming such a pattern using the composition
    • 用于形成金属合金图案的有机金属组合物和使用该组合物形成这种图案的方法
    • US07883838B2
    • 2011-02-08
    • US10718809
    • 2003-11-24
    • Jin Young KimSoon Taik HwangYoung Hun ByunEuk Che HwangSang Yoon Lee
    • Jin Young KimSoon Taik HwangYoung Hun ByunEuk Che HwangSang Yoon Lee
    • B01J31/12C08F4/42
    • G03F7/0043G03F7/0042
    • An organometallic composition containing an organometallic compound (I) containing Ag, an organometallic compound (II) containing Au, Pd, or Ru, and an organometallic compound (III) containing Ti, Ta, Cr, Mo, Ru, Ni, Pd, Cu, Au, or Al, wherein the metal components of organometallic compounds (II) and (III), respectively, are present in an amount of 0.01˜10 mol % based on the amount of Ag in the organometallic compound (I), and a method of forming a metal alloy pattern using the same. Silver alloy patterns can be obtained through a simplified manufacturing process, which patterns have enhanced heat resistance, adhesiveness and chemical stability. The method may be applied to making a reflective film for LCD and metal wiring (gate, source, drain electrode) for flexible displays or flat panel displays, and further to CMP-free damascene processing and PR-free ITO film deposition.
    • 含有含Ag的有机金属化合物(I),含有Au,Pd或Ru的有机金属化合物(II)和含有Ti,Ta,Cr,Mo,Ru,Ni,Pd,Cu的有机金属化合物(III)的有机金属组合物 ,Au或Al,其中有机金属化合物(II)和(III)的金属组分分别以有机金属化合物(I)中的Ag的量为0.01〜10摩尔%,和 使用其形成金属合金图案的方法。 可以通过简化的制造工艺获得银合金图案,该图案具有增强的耐热性,粘合性和化学稳定性。 该方法可以应用于制造用于LCD和用于柔性显示器或平板显示器的LCD和金属布线(栅极,源极,漏极)的反射膜,并且还可用于制造无CMP的镶嵌加工和无PR的ITO膜沉积。