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    • 55. 发明授权
    • Inputting device and electronic instrument using this inputting device and inputting method thereof
    • 使用该输入装置的输入装置和电子仪器及其输入方法
    • US06922185B2
    • 2005-07-26
    • US10202874
    • 2002-07-26
    • Yoshiaki YamadaMichio NagaiMidori TanakaYoko ArimitsuTatsuya Uchikawa
    • Yoshiaki YamadaMichio NagaiMidori TanakaYoko ArimitsuTatsuya Uchikawa
    • G06F3/033G06F3/038H01H25/00G09G5/00
    • G06F3/0338H01H25/002H01H2025/004
    • An inputting device, an electronic instrument using this inputting device, and an inputting method thereof, in which displacement of an operating section in the direction slanting for the X or the Y direction is detected and the movement of a moving object such as a cursor on a display can be controlled easily and precisely, are provided. The operating section is displaced about in the horizontal direction and the vertical direction for a plane being almost parallel to the surface of a cabinet. In case that orthogonal coordinates having the X axis and the Y axis are set on the plane being almost parallel to the surface of the cabinet, horizontal direction sensors detect the displacement of the operating section in the direction slanting for the X or Y direction, in addition to in the X or Y direction. The cursor moves on the display based on the displacement of the operating section about in the horizontal direction. Information being selected by the cursor on the display is decided by the displacement of the operating section about in the vertical direction.
    • 使用该输入装置的输入装置,电子仪器及其输入方法,其中检测到在X或Y方向上倾斜的方向上的操作部分的位移和诸如光标的移动物体的移动 可以容易且准确地控制显示。 操作部分在水平方向和垂直方向上位移大致平行于机柜表面。 在具有X轴和Y轴的正交坐标被设置在几乎平行于机柜表面的平面上的情况下,水平方向传感器检测操作部分在X或Y方向的倾斜方向上的位移, 除了在X或Y方向。 基于操作部分在水平方向上的位移,光标在显示器上移动。 由显示器上的光标选择的信息由操作部分在垂直方向上的位移决定。
    • 56. 发明授权
    • System and methods for providing a head drive unit
    • 用于提供头驱动单元的系统和方法
    • US06866356B2
    • 2005-03-15
    • US10379579
    • 2003-03-06
    • Hidenori UsudaYoshiaki Yamada
    • Hidenori UsudaYoshiaki Yamada
    • B41J2/01B05C5/00B41J2/045B41J2/055G02B5/20G02F1/13G02F1/1335G02F1/1343H01L51/50H05B33/10B41J29/38
    • B41J2/04541B41J2/04573B41J2/04581B41J2/04588B41J2/04593
    • The present invention provides a head drive unit capable of discharging a required amount of viscous body from a head having a pressure generating element, such as a piezoelectric element, and a method of the same, a droplet discharge unit having the head drive unit, a head drive program, and a device manufacturing method having a process of discharging the viscous body by the method as one of manufacturing processes. In the invention, a driving signal is a signal to be applied to a pressure generating element, such as a piezoelectric element, provided to a head and is generated in synchronization with a clock signal. The driving signal has a period to vary the voltage and a period to hold the voltage. The present invention can vary the rate of change in the voltage of the driving signal per unit time by setting a voltage variation during the period and the number of clocks of the clock signal held in the period as appropriate depending on the rate of deformation of the pressure generating element per unit time.
    • 本发明提供一种头驱动单元,其能够从具有诸如压电元件的压力产生元件的头部排出所需量的粘性体及其方法,具有头驱动单元的液滴喷射单元, 头驱动程序,以及具有通过作为制造过程之一的方法将粘性体排出的过程的装置制造方法。 在本发明中,驱动信号是施加到诸如压电元件的压力产生元件提供给头部并且与时钟信号同步产生的信号。 驱动信号具有改变电压和保持电压的周期的周期。 本发明可以通过在该周期内设定电压变化以及在该周期内保持的时钟信号的时钟数根据该变化的速率来改变每单位时间的驱动信号的电压变化率 压力发生元件每单位时间。
    • 59. 发明授权
    • Semiconductor device achieving higher integration, method of manufacturing thereof, and method of forming resist pattern used therefor
    • 实现更高集成度的半导体器件,其制造方法以及用于形成抗蚀剂图案的方法
    • US06395456B1
    • 2002-05-28
    • US09342895
    • 1999-06-29
    • Naohisa TamadaYoshiaki Yamada
    • Naohisa TamadaYoshiaki Yamada
    • G03F722
    • G03F7/70466
    • A semiconductor device achieving higher integration without deterioration of electrical characteristics thereof, a method of manufacturing the semiconductor device, and a method of forming a resist pattern used for that can be obtained. According to the method of forming a resist pattern used for the method of manufacturing a semiconductor device, light is directed via a mask onto a resist film surface formed on a substrate to project a first optical image having a width equal to or less than the wavelength of the light onto the resist surface. The mask is shifted relative to the substrate. Via the shifted mask, light is directed onto the resist film surface to project a second optical image having a width equal to or less than the wavelength of the light onto the resist surface such that the second optical image partially overlaps faith a region where the first optical image is projected.
    • 可以获得实现更高集成度而不劣化其电特性的半导体器件,制造半导体器件的方法以及形成用于其的抗蚀剂图案的方法。根据形成用于该方法的抗蚀剂图案的方法 制造半导体器件时,将光通过掩模引导到形成在基板上的抗蚀剂膜表面上,以将具有等于或小于光的波长的宽度的第一光学图像投影到抗蚀剂表面上。 掩模相对于基底移动。 通过移动的掩模,光被引导到抗蚀剂膜表面上,以将具有等于或小于光的波长的宽度的第二光学图像投影到抗蚀剂表面上,使得第二光学图像部分地与第一光学图像的第一 投影光学图像。
    • 60. 发明授权
    • Semiconductor device and method of testing the same
    • 半导体器件及其测试方法
    • US5900645A
    • 1999-05-04
    • US976082
    • 1997-11-21
    • Yoshiaki Yamada
    • Yoshiaki Yamada
    • H01L21/3205H01L21/66H01L23/52H01L23/544H01L23/58
    • H01L22/14H01L22/34H01L22/12H01L2924/0002
    • A semiconductor device is tested without destroying a substrate immediately after a formation of a metal film and before patterning the metal film.To this end, the substrate is first divided into a product region and a test pattern region. Next, an insulating film is formed on the substrate. Thereafter, openings are formed in the insulating film and on the product region and the test pattern region. Subsequently, the metal film is formed in the openings and on the insulating film. Finally, the metal film is patterned to form a wiring pattern.Under these circumstances, a forming state of the metal film in the opening on the test pattern region is actually tested. Specifically, the presence or absence of a void is checked. In accordance with this test result, a forming state of the metal film in the opening in the product region is evaluated.
    • 在形成金属膜之后并且在图案化金属膜之前,测试半导体器件而不破坏基板。 为此,首先将基板分成产品区域和测试图案区域。 接下来,在基板上形成绝缘膜。 此后,在绝缘膜和产品区域和测试图案区域上形成开口。 接着,在开口部和绝缘膜上形成金属膜。 最后,将金属膜图案化以形成布线图案。 在这些情况下,实际上测试了测试图案区域中的开口中的金属膜的形成状态。 具体地说,检查是否存在空隙。 根据该测试结果,评估产品区域中的开口中的金属膜的形成状态。