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    • 54. 发明授权
    • Display device and method of fabricating the same
    • 显示装置及其制造方法
    • US07446843B2
    • 2008-11-04
    • US11776683
    • 2007-07-12
    • Shunpei YamazakiYasuhiko TakemuraSetsuo NakajimaYasuyuki Arai
    • Shunpei YamazakiYasuhiko TakemuraSetsuo NakajimaYasuyuki Arai
    • G02F1/1345
    • G02F1/13452G02F1/1303G02F1/133305G02F1/1345G02F1/13454H01L21/67132H01L2221/68363H01L2224/16H01L2924/01079
    • A method of fabricating a driver circuit for use with a passive matrix or active matrix electrooptical display device such as a liquid crystal display. The driver circuit occupies less space than heretofore. A circuit (stick crystal) having a length substantially equal to the length of one side of the matrix of the display device is used as the driver circuit. The circuit is bonded to one substrate of the display device, and then the terminals of the circuit are connected with the terminals of the display device. Subsequently, the substrate of the driver circuit is removed. This makes the configuration of the circuit much simpler than the configuration of the circuit heretofore required by the TAB method or COG method, because conducting lines are not laid in a complex manner. The driver circuit can be formed on a large-area substrate such as a glass substrate. The display device can be formed on a lightweight material having a high shock resistance such as a plastic substrate. Hence, a display device having excellent portability can be obtained.
    • 一种制造用于无源矩阵或有源矩阵电光显示装置如液晶显示器的驱动电路的方法。 驱动电路占用的空间比以前少。 使用具有与显示装置的矩阵的一侧的长度大致相等的长度的电路(棒状晶体)作为驱动电路。 电路接合到显示装置的一个基板,然后电路的端子与显示装置的端子连接。 随后,驱动电路的基板被去除。 这使得电路的配置比TAB方法或COG方法所要求的电路的配置简单得多,因为导线不是以复杂的方式铺设。 驱动电路可以形成在诸如玻璃基板的大面积基板上。 显示装置可以形成在具有高抗冲击性的轻质材料上,例如塑料基板。 因此,可以获得具有优异便携性的显示装置。
    • 55. 发明授权
    • Semiconductor device forming method
    • 半导体器件形成方法
    • US07391051B2
    • 2008-06-24
    • US11321640
    • 2005-12-30
    • Hongyong ZhangToru TakayamaYasuhiko TakemuraAkiharu MiyanagaHisashi Ohtani
    • Hongyong ZhangToru TakayamaYasuhiko TakemuraAkiharu MiyanagaHisashi Ohtani
    • H01L31/00
    • H01L29/045G09G2300/0408H01L21/02532H01L21/02672H01L27/1277H01L27/1296H01L29/66757
    • In thin film transistors (TFTs) having an active layer of crystalline silicon adapted for mass production, a catalytic element is introduced into doped regions of an amorphous silicon film by ion implantation or other means. This film is crystallized at a temperature below the strain point of the glass substrate. Further, a gate insulating film and a gate electrode are formed. Impurities are introduced by a self-aligning process. Then, the laminate is annealed below the strain point of the substrate to activate the dopant impurities. On the other hand, Neckel or other element is also used as a catalytic element for promoting crystallization of an amorphous silicon film. First, this catalytic element is applied in contact with the surface of the amorphous silicon film. The film is heated at 450 to 650° C. to create crystal nuclei. The film is further heated at a higher temperature to grow the crystal grains. In this way, a crystalline silicon film having improved crystallinity is formed.
    • 在具有适于批量生产的结晶硅有源层的薄膜晶体管(TFT)中,通过离子注入或其它方式将催化元素引入到非晶硅膜的掺杂区域中。 该膜在低于玻璃基板的应变点的温度下结晶。 此外,形成栅极绝缘膜和栅电极。 杂质通过自对准过程引入。 然后,层压体在基板的应变点以下退火以活化掺杂剂杂质。 另一方面,Neckel或其它元素也用作促进非晶硅膜结晶的催化元素。 首先,将该催化元件与非晶硅膜的表面接触。 将膜在450至650℃加热以产生晶核。 将膜进一步在较高温度下加热以生长晶粒。 以这种方式,形成具有改善的结晶度的晶体硅膜。
    • 56. 发明授权
    • Semiconductor device having at least first and second thin film transistors
    • 具有至少第一和第二薄膜晶体管的半导体器件
    • US07253440B1
    • 2007-08-07
    • US09342235
    • 1999-06-29
    • Yasuhiko Takemura
    • Yasuhiko Takemura
    • H01L29/76
    • H01L27/124G02F1/13624G02F2001/13606G02F2203/30G09G3/2011G09G3/3648G09G2300/043G09G2300/0465G09G2300/08G09G2310/0262G09G2320/0233H01L27/1251
    • A semiconductor device having a substrate having an insulating surface; at least first and second semiconductor islands formed over the substrate where each of the semiconductor islands has a channel region and a pair of impurity regions; an insulating film formed over the substrate, the insulating film including at least first and second gate insulating films formed over the first and second semiconductor islands, respectively; at least first and second gate electrodes formed over the first and second semiconductor islands with the first and second gate insulating films interposed therebetween; a wiring formed on the insulating film for electrically connecting one of the impurity regions of the first semiconductor island with the second gate electrode where said wiring is connected to the one of the impurity regions through a hold opened in the insulating film; an interlayer insulating film formed over the first and second semiconductor islands, the first and second gate electrodes and the wiring; and a pixel electrode formed over the interlayer insulating film electrically connected to one of the pair of the impurity regions of the second semiconductor island.
    • 一种具有绝缘表面的衬底的半导体器件; 形成在衬底上的至少第一和第二半导体岛,其中每个半导体岛具有沟道区和一对杂质区; 形成在所述基板上的绝缘膜,所述绝缘膜分别至少包括形成在所述第一和第二半导体岛上的第一和第二栅极绝缘膜; 至少第一和第二栅电极,形成在第一和第二半导体岛上,第一和第二栅极绝缘膜介于它们之间; 在所述绝缘膜上形成的布线,用于将所述第一半导体岛的所述杂质区与所述第二栅极电连接,所述布线通过在所述绝缘膜中开放的保持连接到所述杂质区之一; 形成在第一和第二半导体岛上的层间绝缘膜,第一和第二栅电极和布线; 以及形成在与第二半导体岛的一对杂质区中的一个电连接的层间绝缘膜上的像素电极。