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    • 51. 发明授权
    • Method for integrating image sensors with optical components
    • 图像传感器与光学元件集成的方法
    • US06679964B2
    • 2004-01-20
    • US09981774
    • 2001-10-16
    • Chih-Kung LeeLong-Sun HuangWen-Jong ChenChing-Heng TangChing-Hua Lee
    • Chih-Kung LeeLong-Sun HuangWen-Jong ChenChing-Heng TangChing-Hua Lee
    • H01L2146
    • H01L27/14685H01L27/14618H01L27/14621H01L27/14627H01L2224/48091Y10T156/1093H01L2924/00014
    • The present invention is a wafer level integrating method for bonding an un-sliced wafer including image sensors and a wafer-sized substrate including optical components thereon. A zeroth order light reflective substrate is provided between the un-sliced wafer and the wafer-sized substrate. The image sensors are either CMOS or CCD image sensors. The wafer-sized substrate is a transparent plate and the optical components thereon include a blazed grating, a two-dimensional microlens array or other optical-functional elements. The wafer-sized substrate is bonded onto the zeroth order light reflective substrate by an appropriate optical adhesive to form a composite substrate. Bonding pads and bumps are provided at corresponding positions on the bonding surface of the un-sliced wafer and the composite substrate respectively so that the composite substrate and the un-sliced wafer can be bonded together through a reflow process. Alternatively, the composite substrate and the un-sliced wafer can be bonded together by cold compression or thermal compression. The resultant wafer is then sliced into separated image sensors for further packaging, such as CLCC, PLCC, QFP, QFN or QFJ. Alternatively, the resultant wafer can be packaged through a wafer-level chip scale packaging process.
    • 本发明是一种用于将包括图像传感器的未切片晶片和其上包括光学部件的晶片尺寸基板接合的晶片级积分方法。 在未切片的晶片和晶片尺寸的基板之间设置零级光反射基板。 图像传感器是CMOS或CCD图像传感器。 晶片尺寸的基板是透明板,并且其上的光学部件包括闪耀的光栅,二维微透镜阵列或其它光学功能元件。 晶片尺寸的基板通过合适的光学粘合剂粘合到第零级光反射基板上以形成复合基板。 在非切片晶片和复合基板的接合面上的对应位置分别设置有接合焊盘和凸块,使得复合基板和未切片的晶片可以通过回流工艺结合在一起。 或者,可以通过冷压缩或热压缩将复合衬底和未切片晶片结合在一起。 然后将得到的晶片切成分离的图像传感器以进一步包装,例如CLCC,PLCC,QFP,QFN或QFJ。 或者,所得到的晶片可以通过晶片级芯片级封装工艺进行封装。
    • 54. 发明授权
    • Piezoelectric polymer laminates for torsional and bending modal control
    • 用于扭转和弯曲模态控制的压电聚合物层压板
    • US4868447A
    • 1989-09-19
    • US95494
    • 1987-09-11
    • Chih-Kung LeeFrancis C. Moon
    • Chih-Kung LeeFrancis C. Moon
    • H01L41/08H01L41/09H01L41/113
    • H01L41/1132H01L41/047H01L41/0825H01L41/094H01L41/0993Y10S310/80
    • Laminates of polyvinylidene fluroride (PVDF) are employed as piezoelectric sensors and actuators which can sense and/or generate complex motions that include bending, stretching, and twisting components. The laminates can be attached directly to a mechanical structure whose motions are to be sensed and/or controlled. By skewing the principal axes of each of the lamina in the laminate with respect to one another, the laminate is responsive not only to bending motions, but to torsional motions as well. Surface electrodes are disposed on the top and bottom sides of each of the lamina to either sense voltage generated by the lamina in response to motion imparted thereto, or supply voltage to the lamina to induce motion therein. The shape of the surface electrode patterns can be varied to control the particular components of motion to which each of the lamina is responsive (e.g., bending modes). The polarization profile in each of the lamina can also be varied for this purpose. Mechanical oscillators and dampers can be constructed using the laminates.
    • 聚偏氟乙烯(PVDF)的层压板被用作压电传感器和致动器,其可以感测和/或产生包括弯曲,拉伸和扭转部件的复杂运动。 层压板可以直接连接到其运动被感测和/或控制的机械结构上。 通过使层叠体中的每个层板的主轴相对于彼此偏斜,层压体不仅对弯曲运动产生响应,而且响应于扭转运动。 表面电极设置在每个层板的顶侧和底侧,以响应于施加到其上的运动来感测由层产生的电压,或者向层提供电压以在其中引起运动。 可以改变表面电极图案的形状以控制每个薄片响应的运动的特定分量(例如,弯曲模式)。 为了此目的,也可以改变每层中的偏振轮廓。 机械振荡器和阻尼器可以使用层压板构造。
    • 58. 发明授权
    • Surface plasmon resonance meter
    • 表面等离子体共振仪
    • US07791730B2
    • 2010-09-07
    • US12422891
    • 2009-04-13
    • Chih-Kung LeeShu-Sheng LeeChih-Hsiang SungYi-Hao Chen
    • Chih-Kung LeeShu-Sheng LeeChih-Hsiang SungYi-Hao Chen
    • G01N21/55
    • G01N21/553
    • A surface plasmon resonance meter is provided, including a backlight module, a line-slot plate, a parabolic mirror, a linear polarizer, a sensing chip, a prism and a photo detector array. The line-slot plate includes a light outlet. A light beam travels in the backlight module, and leaves the backlight module through the light outlet. The position of the line-slot plate is matched on a predetermined focal point of the parabolic mirror. The light beam is reflected by the parabolic mirror to be a parallel light beam, and travels trough the linear polarizer to the prism. The prism includes a light entering surface, a detection surface and a light exiting surface. The light beam enters the prism through the light entering surface, contacts the sensing chip with total internal reflection, and finally leaves the prism through the light exiting surface to be received by the photo detector array.
    • 提供了表面等离子体共振仪,包括背光模块,线槽板,抛物面镜,线性偏振器,感测芯片,棱镜和光电检测器阵列。 线槽板包括一个灯出口。 光束在背光模块中传播,并使背光模块通过灯泡出口。 线槽板的位置在抛物面镜的预定焦点上匹配。 光束被抛物面镜反射成平行光束,并且通过线性偏振器行进到棱镜。 棱镜包括光入射表面,检测表面和光出射表面。 光束通过光进入表面进入棱镜,与全内反射接触感测芯片,最后通过光出射表面离开棱镜,以被光电检测器阵列接收。