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51. 发明专利

JP2007250898A Probe card 审中-公开
标题翻译：探针卡
公开(公告)号：JP2007250898A
公开(公告)日：2007-09-27
申请号：JP2006073314
申请日：2006-03-16
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： UJIIE AKIRA , MATSUOKA NORIYUKI , SUZUKI TAKESHI
IPC分类号： H01L21/66 , G01R1/06 , G01R1/073 , G01R31/26
摘要： PROBLEM TO BE SOLVED: To avoid the deflection of a bump from a prescribed normal position upon executing a manufacturing process and burn-in screening of a flexible board.
SOLUTION: Contact pads 34CP are connected to bumps 34bg on an electrode-attached sheet 34FB of the flexible board 34. Air gaps 34H are formed separately on the periphery of each contact pad 34CP, and conductive layers 34CD are formed on the periphery of and between the air gaps 34H.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了在执行柔性板的制造过程和老化筛选时避免凸块从规定的正常位置偏转。
解决方案：接触焊盘34CP连接到柔性板34的电极附着片34FB上的凸块34bg。气隙34H分别形成在每个接触焊盘34CP的周边上，导电层34CD形成在外围在气隙34H之间和之间。版权所有（C）2007，JPO＆INPIT

52. 发明专利

JP2003149290A LATCH LOCK MECHANISM OF KGD CARRIER 审中-公开
公开(公告)号：JP2003149290A
公开(公告)日：2003-05-21
申请号：JP2001346331
申请日：2001-11-12
申请人： YAMAICHI ELECTRONICS CO LTD
发明人： HISAISHI MINORU , MATSUOKA NORIYUKI
IPC分类号： G01R31/26 , G01R1/04 , H01L23/32 , H01R33/76
摘要： PROBLEM TO BE SOLVED: To provide a latch lock mechanism of a KGD carrier which facilitates the simultaneous opening/closing operation of latches and the mounting/removing operation of a carrier retainer in a simple structure. SOLUTION: The mechanism comprises a carrier retainer having a cover and a chip retainer, a carrier board having a carrier body, a substrate and a carrier base, at least two mutually opposed latches turnably mounted on the cover of the carrier retainer, each forming an L-letter with a handling part and a lock part, and an engaging part provided on the carrier body of the carrier board for engaging with the lock part of the latch. When the lock parts of the two opposed latches are closed, the engaging part engages with the lock part provided on the carrier body to lock the carrier retainer and the carrier board.

53. 发明专利

JP2002237669A METHOD OF FORMING RECOGNITION MARK TO SUBSTRATE FOR KGD 失效
公开(公告)号：JP2002237669A
公开(公告)日：2002-08-23
申请号：JP2001034324
申请日：2001-02-09
申请人： YAMAICHI ELECTRONICS CO LTD
发明人： SUZUKI TAKESHI , MATSUOKA NORIYUKI
IPC分类号： G01R31/26 , H01L23/544 , H05K1/02 , H05K1/11 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a recognition mark, to the rear of a substrate, despite the production cost being low, and which can be manufactured easily and by which the substrate with the formed recognition mark can be sued repeatedly. SOLUTION: In the substrate, a wiring pattern is formed on one face of an insulating board. A conductor pattern as the recognition mark is formed on one face on which the wiring pattern is formed, and a through-hole is formed toward the conductor pattern from a face, on which the wiring pattern is not formed. In the substrate, a bump connected to a KGD is formed on the face, on which the wiring pattern is not formed. The conductor pattern may have a shape of the recognition mark, and the shape of the through-hole may be of the shape of the recognition mark.

54. 发明专利

JP2007071699A Perpendicular type probe card 审中-公开
标题翻译： PERPENDICULAR型探针卡
公开(公告)号：JP2007071699A
公开(公告)日：2007-03-22
申请号：JP2005259047
申请日：2005-09-07
申请人： Rika Denshi Co Ltd , Yamaichi Electronics Co Ltd , 山一電機株式会社 , 理化電子株式会社
发明人： KAGAMI SUMIO , SAITO HOTOKU , MATSUOKA NORIYUKI , SUZUKI TAKESHI , UJIIE AKIRA
IPC分类号： G01R1/073 , G01R1/067 , G01R31/26 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To realize a perpendicular type probe card which is easy in assembling and causes no connection failure.
SOLUTION: The perpendicular type probe card has a probe board 41 having a plurality of tester terminal connection parts on one side, a plurality of head connection parts 102 on the other side and wiring inside, a probe head 71 having a plurality of spring probes 91 and a wiring conversion member 61 having a plurality of prove contact parts 66 contacting the spring probes, a plurality of board contact parts 62 contacting a plurality of the head contact parts 102 on the other side and wiring inside. The wiring conversion member 61 is a flexible substrate and is provided with an anistropic-conductivity pressurizing rubber plate 51 placed in between the probe board 41 and the wiring conversion member 61. A plurality of head connection parts 102 and a plurality of board contact parts 62 are connected via the anistropic-conductivity pressurizing rubber plate 51.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：实现容易组装的垂直型探针卡，不会引起连接故障。解决方案：垂直型探针卡具有探针板41，探针板41在一侧具有多个测试器端子连接部，多个头连接部102在另一侧和布线内部，探头71具有多个弹簧探头91和布线转换构件61具有接触弹簧探针的多个证明接触部分66，多个板接触部分62与另一侧上的多个头部接触部分102和接线内部接触。布线转换构件61是柔性基板，并且设置有布置在探针板41和布线转换构件61之间的辅助导电性加压橡胶板51.多个头连接部102和多个基板接触部62 通过无性传导性加压橡胶板51连接。版权所有：（C）2007，JPO＆INPIT

55. 发明专利

JP2004134141A Ic socket 审中-公开
标题翻译： IC插座
公开(公告)号：JP2004134141A
公开(公告)日：2004-04-30
申请号：JP2002295415
申请日：2002-10-08
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： NAKAO KENZO , MATSUOKA NORIYUKI
IPC分类号： G01R31/26 , G01R1/073 , H01R33/76
摘要： PROBLEM TO BE SOLVED: To sufficiently ensure stable contact force as a spring characteristic of a contact for an IC package so that the contact does not interfere with other parts, nor causes friction.
SOLUTION: An IC socket has contacts to form electric connection with the IC package inserted thereinto, wherein the tip end of the contact is positioned such that it is slanted backward in a partitioning hole in an upper insulating substrate when it is free, and positioned substantially vertically it is upon a measurement.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了充分确保作为IC封装的触点的弹簧特性的稳定的接触力，使得接触不会与其它部件干涉，也不会引起摩擦。解决方案：IC插座具有与插入其中的IC封装形成电连接的触点，其中触点的尖端定位成使得当触点的顶端在空闲时在上绝缘基板中的分隔孔中向后倾斜，并且基本上垂直地定位它在测量时。版权所有（C）2004，JPO

56. 发明专利

JP2003297469A Contact, manufacturing method of contact and electronic component using contact 审中-公开
标题翻译：联系人，联系人使用联系人和电子元件的制造方法
公开(公告)号：JP2003297469A
公开(公告)日：2003-10-17
申请号：JP2002100253
申请日：2002-04-02
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： SATO MASARU , MATSUOKA NORIYUKI
IPC分类号： H01R13/11 , H01R24/00 , H01R43/16 , H01R107/00
摘要： PROBLEM TO BE SOLVED: To form a metal welding part by using a weldable wire of a metal such as platinum for a contact and to form it into a contact part shape, thereby to prevent contact resistance increase caused by continuous use from easily occurring and to prevent adhesion of the contact to a solder ball from easily occurring.
SOLUTION: This contact has the metal welding part formed on a contacting part at one end of a contact member for electrical connection, and has a contact part formed by secondarily processing the metal welding part.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过使用诸如铂的金属的可焊接线来形成金属焊接部分用于接触并将其形成为接触部分形状，从而防止由于容易地连续使用引起的接触电阻增加发生并且防止触点对焊球的粘附容易发生。解决方案：该接触件具有形成在用于电连接的接触构件的一端的接触部分上的金属焊接部，并且具有通过二次加工金属焊接部而形成的接触部。版权所有（C）2004，JPO

57. 发明专利

JP2003017209A Socket for ic package 有权
标题翻译： IC封装插座
公开(公告)号：JP2003017209A
公开(公告)日：2003-01-17
申请号：JP2001202641
申请日：2001-07-03
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： NAKANO KAZUNORI , MATSUOKA NORIYUKI
IPC分类号： G01R31/26 , G01R1/073 , H01R33/76
摘要： PROBLEM TO BE SOLVED: To provide a socket for IC package which can gain a substantial pressing power at time of burn-in and can operate with a small operating force at time of mounting of an IC package.
SOLUTION: With the socket for IC package provided with a pressure mechanism pressing and holding an IC package onto a socket main body with the contact state of its terminal and contact maintained, a normal coil spring 82 and a shape-memory coil spring 84 are set in combination as a pressing force changing means for differentiating a pressing force at normal temperature and that at burn-in.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供用于IC封装的插座，其可以在老化时获得显着的按压力，并且可以在安装IC封装时以小的操作力操作。解决方案：具有压接机构的集成电路封装的插座，将压接机构按压并保持IC封装在插座主体上，保持接线端子和触点的接触状态，设置正常的螺旋弹簧82和形状记忆螺旋弹簧84 组合作为用于区分常温下的按压力和老化时的按压力的按压力改变装置。

58. 发明专利

JP2002164134A SOCKET FOR IC PACKAGE 失效
公开(公告)号：JP2002164134A
公开(公告)日：2002-06-07
申请号：JP2000359938
申请日：2000-11-27
申请人： YAMAICHI ELECTRONICS CO LTD , INFINEON TECHNOLOGIES AG
发明人： ECKER KLAUS , MATSUOKA NORIYUKI
IPC分类号： G01R31/26 , G01R1/073 , H01R13/04 , H01R33/76
摘要： PROBLEM TO BE SOLVED: To provide a socket for an IC package with sure and reliable electric connection with the IC package and durability even when repeatedly used, or used for long time. SOLUTION: The socket for the IC package 10 comprises a lower side contact piece part 46 supporting a lead terminal of the IC package when mounting it, a contact 40 having an upper side contact piece part 43 which contacts the lead terminal, supported by the lower side contact piece part 46 in an elastically pressed state, and a release means 30 enabled to release the elastically pressed state of the contact 40. A sharp protrusion 43a is formed on a contact part of the upper side contact piece part 43 of the contact 40, and a concave part or a groove 46, preventing from a contact with at least the top end of the sharp protrusion part 43, is formed to the lower side contact piece part 46.

59. 发明专利

JP2004063105A Ic socket 审中-公开
公开(公告)号：JP2004063105A
公开(公告)日：2004-02-26
申请号：JP2002215801
申请日：2002-07-24
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： KITADA HIROYUKI , SATO MASARU , MATSUOKA NORIYUKI
IPC分类号： H01R33/76
摘要： PROBLEM TO BE SOLVED: To facilitate the replacement of guide members differed in outer shape or dimension to improve the workability in an IC socket having a guide member.
SOLUTION: This IC socket comprises a socket body and the guide member removably mounted on the socket body. This socket further comprises an engagement means formed of a hook and receiving part for mounting the guide member on the socket body. At least one of the hook and receiving part has a tapered shape.
COPYRIGHT: (C)2004,JPO

60. 发明专利

JP2004047186A Socket for semiconductor device 有权
公开(公告)号：JP2004047186A
公开(公告)日：2004-02-12
申请号：JP2002200459
申请日：2002-07-09
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： SUZUKI TAKESHI , MATSUOKA NORIYUKI
IPC分类号： G01R31/26 , G01R1/073 , H01R11/01 , H01R33/76 , H01R12/16
摘要： PROBLEM TO BE SOLVED: To avoid an unwanted, lopsided pressurizing force acting on a part of a plurality of bumps in a contact sheet. SOLUTION: Dummy bumps 62 are fitted for regulating pushing volume on the bumps in a bare chip 60, around the bumps 44B in the contact sheet 44. COPYRIGHT: (C)2004,JPO

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