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    • 60. 发明授权
    • High pressure high non-reactive diluent gas content high plasma ion density plasma oxide etch process
    • 高压高反应性稀释气体含量高等离子体离子密度等离子体氧化物蚀刻工艺
    • US06238588B1
    • 2001-05-29
    • US08733554
    • 1996-10-21
    • Kenneth CollinsDavid GroechelRaymond HungMichael RiceGerald YinJian DingChunshi Cui
    • Kenneth CollinsDavid GroechelRaymond HungMichael RiceGerald YinJian DingChunshi Cui
    • B44C122
    • H01L21/02063C23C16/517H01F2029/143H01J37/32082H01J37/321H01J37/32146H01J37/32165H01J37/32458H01J37/32467H01J37/32522H01J37/32688H01J37/32706H01J37/32871H01J2237/3343H01J2237/3345H01J2237/3346H01L21/31116H01L21/6831
    • The invention is embodied in a method of processing a semiconductor workpiece in a plasma reactor chamber, including supplying a polymer and etchant precursor gas containing at least carbon and fluorine into the chamber at a first flow rate sufficient of itself to maintain a gas pressure in the chamber in a low pressure range below about 20 mT, supplying a relatively non-reactive gas into the chamber at second flow rate sufficient about one half or more of the total gas flow rate into the chamber, in combination with the first flow rate of the precursor gas, to maintain the gas pressure in the chamber in a high pressure range above 20 mT, and applying plasma source power into the chamber to form a high ion density plasma having an ion density in excess of 1010 ions per cubic centimeter. In one application of the invention, the workpiece includes an oxygen-containing overlayer to be etched by the process and a non-oxygen-containing underlayer to be protected from etching, the precursor gas dissociating in the plasma into fluorine-containing etchant species which etch the oxygen-containing layer and carbon-containing polymer species which accumulate on the non-oxygen-containing underlayer. Alternatively, the high pressure range may be defined as a pressure at which the skin depth of the inductive field exceeds {fraction (1/10)} of the gap between the inductive antenna and the workpiece.
    • 本发明体现在一种在等离子体反应器室中处理半导体工件的方法,包括以足以自动维持气体压力的第一流量将至少含有碳和氟的聚合物和蚀刻剂前体气体供应到室中 在低于大约20mT的低压范围内,将第二流量的第二流量的相对非反应性气体供应到室内的总气体流速的约一半以上,并与第一流量 将气体压力保持在高于20mT的高压范围内,并将等离子体源功率施加到腔室中以形成离子密度超过每立方厘米1010离子的高离子密度等离子体。 在本发明的一个应用中,工件包括通过该方法蚀刻的含氧覆层和不受蚀刻保护的非含氧底层,前体气体在等离子体中解离成含氟蚀刻剂,其蚀刻 含氧层和积聚在非含氧底层上的含碳聚合物种类。 或者,高压范围可以被定义为感应场的趋肤深度超过感应天线和工件之间的间隙的{分数(1/10)}的压力。