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    • 56. 发明授权
    • Method for forming heat sinks on silicon on insulator wafers
    • 在绝缘体硅片上形成散热片的方法
    • US07528012B1
    • 2009-05-05
    • US11508495
    • 2006-08-22
    • Peter J. HopperIouri MirgorodskiVladislav VashchenkoPeter Johnson
    • Peter J. HopperIouri MirgorodskiVladislav VashchenkoPeter Johnson
    • H01L21/00
    • H01L29/78606H01L23/3677H01L23/481H01L2924/0002H01L2924/00
    • An apparatus and method for a heat sink to dissipate the heat sourced by the encapsulated transistors in a SOI wafer. The apparatus includes a transistor formed in the active silicon layer of the wafer. The active surface is formed over an oxide layer and a bulk silicon layer. A heat sink is formed in the bulk silicon layer and configured to sink heat through the bulk silicon layer, to the back surface of the wafer. After the transistor is fabricated, the heat sink is formed by masking, patterning and etching the back surface of the wafer to form plugs in the bulk silicon layer. The plug extends through the thickness of the bulk layer to the oxide layer. Thereafter, the plug is filled with a thermally conductive material, such as a metal or DAG (thermally conductive paste). During operation, heat from the transistor is dissipated through the heat sink. In various embodiments of the invention, the plug hole is formed using either an anisotropic plasma or wet etch.
    • 散热器散热由SOI晶片中的封装晶体管产生的热量的装置和方法。 该装置包括形成在晶片的有源硅层中的晶体管。 活性表面形成在氧化物层和体硅层上。 在体硅层中形成散热器,并且构造成将热量通过体硅层吸收到晶片的背面。 在制造晶体管之后,通过掩模,图案化和蚀刻晶片的背面来形成散热器,以在体硅层中形成插塞。 塞子延伸穿过本体层的厚度到氧化物层。 此后,塞子填充有导热材料,例如金属或DAG(导热浆)。 在运行期间,来自晶体管的热量通过散热器消散。 在本发明的各种实施例中,插塞孔使用各向异性等离子体或湿蚀刻形成。