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    • 53. 发明授权
    • Doctor blade system
    • 刮刀系统
    • US07921773B2
    • 2011-04-12
    • US12149172
    • 2008-04-28
    • Ewald RöthleinHelmut Schmidt
    • Ewald RöthleinHelmut Schmidt
    • B41F31/00B41F31/02B41F9/10B05C3/02
    • B41F31/027
    • A doctor blade system utilizes a lightweight doctor blade chamber to apply ink to an inking roller. The doctor blade chamber is removably positioned on a support plate which is, in turn, carried by linear guides on pivotable end plates. A rigid box beam is also attached to the end plates and is spaced from the support plate. A plurality of membrane cylinders are mounted on the rigid box beam and engage a surface of the support plate opposite to the surface that supports the doctor blade chamber. Through the application of suitable force, the support plate and its supported doctor blade chamber can be moved, by sliding motion on the linear slides, into uniform engagement with the surface of the ink roller. The system uses pivotable end plates which are supported by exterior plates that are, in turn, pivotably supported by press side frames. The chamber doctor blade and its support plate and box beam can be moved into several different positions, with respect to the cooperating ink roller, to facilitate doctor blade chamber cleaning or replacement or ink roller replacement.
    • 刮刀系统使用轻质的刮刀室将油墨施加到着墨辊上。 刮刀室可移除地定位在支撑板上,支撑板又由可转动的端板上的直线导轨承载。 刚性箱梁也附接到端板并且与支撑板间隔开。 多个膜筒被安装在刚性箱梁上并且与支撑刮板室的表面相对的支撑板的表面接合。 通过施加适当的力,支撑板及其支撑的刮刀室可以通过在线性滑块上的滑动运动而与墨辊的表面均匀地接合。 该系统使用可旋转的端板,其由外部板支撑,外部板又由压力侧框架可枢转地支撑。 腔室刮刀及其支撑板和箱梁可以相对于协作的墨辊移动到几个不同的位置,以便于刮刀室清洁或更换或墨辊更换。
    • 59. 发明授权
    • Nanoimprint resist
    • 纳米抗蚀剂
    • US07431858B2
    • 2008-10-07
    • US10511402
    • 2003-04-09
    • Walter SpiessFumio KitaMichael MeierAndreas GierMartin MennigPeter W OliveiraHelmut Schmidt
    • Walter SpiessFumio KitaMichael MeierAndreas GierMartin MennigPeter W OliveiraHelmut Schmidt
    • B44C1/22C03C15/00C03C25/68C23F1/00
    • G03F7/0757B82Y10/00B82Y40/00G03F7/0002G03F7/0017G03F7/0047
    • The invention relates to a method for microstructuring electronic components, which yields high resolutions (≦200 nm) at a good aspect ratio while being significantly less expensive than photolithographic methods. The inventive method comprises the following steps: i) a planar unhardened sol film of a nanocomposite composition according to claim 1 is produced; ii) a target substrate consisting of a bottom coat (b) and a support (c) is produced; iii) sol film material obtained in step i) is applied to the bottom coat (b) obtained in step ii) by means of a microstructured transfer embossing stamp; iv) the applied sol film material is hardened; v) the transfer embossing stamp is separated, whereby an embossed microstructure is obtained as a top coat (a). The method for producing a microstructured semiconductor material comprises the following additional steps: vi) the remaining layer of the nanocomposite sol film is plasma etched, preferably with CHF3/O2 plasma; vii) the bottom coat is plasma etched, preferably with O2 plasma; viii) the semiconductor material is etched or the semiconductor material is doped in the etched areas.
    • 本发明涉及一种用于微结构化电子部件的方法,其以良好的纵横比产生高分辨率(<= 200nm),同时显着地低于光刻方法。 本发明的方法包括以下步骤:i)制备根据权利要求1的纳米复合组合物的平面未硬化溶胶膜; ii)制备由底涂层(b)和载体(c)组成的靶基材; iii)在步骤i)中获得的溶胶膜材料通过微结构转印压花印刷施加到在步骤ii)中获得的底涂层(b) iv)涂覆的溶胶膜材料硬化; v)分离转印压花印模,由此获得作为顶涂层(a)的压花微结构。 制造微结构化半导体材料的方法包括以下附加步骤:vi)纳米复合溶胶膜的剩余层被等离子体蚀刻,优选地具有CHF 3 O 2 / O 2等离子体 ; vii)底涂层被等离子体蚀刻,优选为O 2等离子体; viii)蚀刻半导体材料或者在蚀刻区域中掺杂半导体材料。